公开(公告)号：US20160052442A1

公开(公告)日：2016-02-25

申请号：US14462786

申请日：2014-08-19

Applicant: FANG-LIN YANG

Inventor： FANG-LIN YANG

IPC: B60P7/08 ,  B25B25/00 ,  B65B13/02

CPC classification number: B60P7/083 ,  B65B13/025 ,  Y10T24/2115

Abstract: A ratchet buckle, which is configured to connect a first strap and a second strap, includes a controlling device, an operating device connected to the first strap, a reel passing through the controlling device and the operating device along an axial line, the second strap wound around the reel, at least one ratchet set mounted on the reel, the reel being not rotated relative to the ratchet set, and a pawl device. When the user wants to unwind the second strap from the reel, the user moves and rotates the controlling device smoothly with only one hand thereof; therefore, it's very convenient for the user to operate. The special structure making the ratchet set unidirectionally rotatable, and it doesn't need any further structure, so that it is lighter and has lower cost.

Abstract translation: 配置为连接第一带和第二带的棘轮扣包括控制装置，连接到第一带的操作装置，沿着轴线穿过控制装置和操作装置的卷轴，第二带 围绕卷轴缠绕，安装在卷轴上的至少一个棘轮组，卷轴不相对于棘轮组旋转，以及棘爪装置。 当用户想要从卷轴上松开第二条带时，使用者只用一只手平稳地移动和旋转控制装置; 因此，用户操作非常方便。 棘轮机组的特殊结构单向旋转，不需要任何其他结构，使其更轻，成本更低。

公开(公告)号：US08962390B2

公开(公告)日：2015-02-24

申请号：US13327491

申请日：2011-12-15

Applicant: Diann-Fang Lin

Inventor： Diann-Fang Lin

IPC: H01L21/00 ,  H01L25/16 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L25/16 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48265 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method for manufacturing a chip packaging structure is disclosed. The manufacturing method includes steps of: providing a protection layer; forming a conductive trace layer on the protection layer; forming an adhesion layer on the conductive trace layer; placing a chip on the adhesion layer; and electrically connecting the chip to the conductive trace layer. Via these arrangements, the chip packaging structure made by the manufacturing method can have a smaller thickness.

Abstract translation: 公开了一种制造芯片封装结构的方法。 该制造方法包括以下步骤：提供保护层; 在保护层上形成导电迹线层; 在导电迹线层上形成粘附层; 将芯片放置在粘合层上; 并且将所述芯片电连接到所述导电迹线层。 通过这些布置，通过制造方法制造的芯片封装结构可以具有更小的厚度。

公开(公告)号：US08766939B2

公开(公告)日：2014-07-01

申请号：US13411295

申请日：2012-03-02

Applicant: David Amory Sobel ,  Sumant Ranganathan ,  Xin Dai ,  Fang Lin

Inventor： David Amory Sobel ,  Sumant Ranganathan ,  Xin Dai ,  Fang Lin

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G06F3/0416

Abstract: A mode-configurable amplifier comprises a single-ended input for receiving a received signal from a capacitive touch panel, a differential output operable to carry a differential processed signal to a subsequent processing stage, and processing circuitry in communication with the single ended input and the differential output. The processing circuitry comprises mode selection inputs and mode selection circuitry in communication with the mode selection inputs. The mode selection circuitry is operable to configure the processing circuitry into a current operating mode selected from a high-pass filter mode, bandpass filter mode, and a trans-capacitive gain mode. The high-pass filter mode is operable to high-pass filter the received signal to obtain the differential processed signal. The bandpass filter mode is operable to bandpass filter the received signal to obtain the differential processed signal. The wideband gain mode is operable to amplify the received signal to obtain the differential processed signal.

Abstract translation: 模式可配置放大器包括用于从电容式触摸面板接收接收信号的单端输入，可操作以将差分处理信号传送到后续处理级的差分输出，以及与单端输入和 差分输出。 处理电路包括与模式选择输入通信的模式选择输入和模式选择电路。 模式选择电路可操作以将处理电路配置为从高通滤波器模式，带通滤波器模式和跨电容增益模式中选择的当前工作模式。 高通滤波器模式可操作地对接收到的信号进行高通滤波以获得差分处理信号。 带通滤波器模式可用于对接收到的信号进行带通滤波以获得差分处理的信号。 宽带增益模式可操作以放大接收信号以获得差分处理信号。

公开(公告)号：US20140022737A1

公开(公告)日：2014-01-23

申请号：US13647385

申请日：2012-10-09

Applicant: Yung-Hung HSIAO ,  Ju-Tang LO ,  Yen-Ming CHEN ,  Hao-Te HSU ,  Pei-Li CHANG ,  Chia-Hsien YEN ,  Shin-Bin LIN ,  Yu-Hsuan WU ,  Chin-Hang LEE ,  Huei-Fang LIN ,  Ping-Yu CHEN ,  Chi-Chang HO

Inventor： Yung-Hung HSIAO ,  Ju-Tang LO ,  Yen-Ming CHEN ,  Hao-Te HSU ,  Pei-Li CHANG ,  Chia-Hsien YEN ,  Shin-Bin LIN ,  Yu-Hsuan WU ,  Chin-Hang LEE ,  Huei-Fang LIN ,  Ping-Yu CHEN ,  Chi-Chang HO

IPC: H05K7/00

CPC classification number: H05K7/08 ,  H05K7/026 ,  H05K7/1432 ,  H05K7/2039 ,  H05K7/2089

Abstract: A modular power device is used for mounting on a main plate. The modular power system includes a first substrate, a driving module and a converting module. The first substrate having a first axial direction and a second axial direction substantially perpendicular to the first axial direction is inserted into the main plate, such that the second axial direction is substantially perpendicular to the main plate. The driving module is located on one side of the first substrate and electrically connected thereon. The converting module is located on the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction.

Abstract translation: 模块化功率器件用于安装在主板上。 模块化电力系统包括第一基板，驱动模块和转换模块。 将具有第一轴向和与第一轴向大致垂直的第二轴向的第一基板插入主板中，使得第二轴向大致垂直于主板。 所述驱动模块位于所述第一基板的一侧并电连接。 转换模块位于第一基板的另一侧并电连接到驱动模块。 转换模块的长度在第一轴向上与第一基板的长度基本相同，并且转换模块的宽度小于第一基板在第一轴向方向上的长度。

公开(公告)号：US08589569B2

公开(公告)日：2013-11-19

申请号：US11517200

申请日：2006-09-06

Applicant: Cheng-Fang Lin ,  Samit Roy

Inventor： Cheng-Fang Lin ,  Samit Roy

IPC: G06F17/30

CPC classification number: G06F17/30421 ,  G06F17/30528

Abstract: One embodiment of the present invention provides a system stored on a non-transitory computer-readable storage medium for invoking a plug-in that is dynamically associated with a database operation. During operation, a client sends a request to a database system to perform an operation on the database, wherein the request includes a control-message which specifies a plug-in which needs to be executed. Next, the system executes the plug-in at a plug-in server to obtain a plug-in result. Then, the system determines if the plug-in result is an error identifier. If so, the system sends the error identifier to the client. On the other hand, if the plug-in result is not an error identifier, the system performs the operation to obtain an operation result. The system then sends the operation result to the client.

Abstract translation: 本发明的一个实施例提供了一种存储在非暂时计算机可读存储介质上的系统，用于调用与数据库操作动态相关联的插件。 在操作期间，客户端向数据库系统发送请求以对数据库执行操作，其中请求包括指定需要执行的插件的控制消息。 接下来，系统在插件服务器上执行插件以获得插件结果。 然后，系统确定插件结果是否是错误标识符。 如果是这样，系统会向客户端发送错误标识符。 另一方面，如果插件结果不是错误标识符，则系统执行操作以获得操作结果。 系统然后将操作结果发送给客户端。

公开(公告)号：US08587017B2

公开(公告)日：2013-11-19

申请号：US13070486

申请日：2011-03-24

Applicant: Wei-Hung Kuo ,  Yi-Keng Fu ,  Suh-Fang Lin ,  Rong Xuan

Inventor： Wei-Hung Kuo ,  Yi-Keng Fu ,  Suh-Fang Lin ,  Rong Xuan

IPC: H01L33/00 ,  H01L21/00

CPC classification number: H01L33/38 ,  H01L33/0079 ,  H01L33/145 ,  H01L33/405 ,  H01L33/44

Abstract: A light emitting device and a method of fabricating a light emitting device are provided. The light emitting device includes a carrier substrate, at least one epitaxy structure, a high resistant ring wall, a first electrode, and a second electrode. The epitaxy structure is disposed on the carrier substrate and includes a first semiconductor layer, an active layer, and a second semiconductor layer stacked in sequence. The first semiconductor layer is relatively away from the carrier substrate and the second semiconductor layer is relatively close to the carrier substrate. The high resistant ring wall surrounds the epitaxy structure and a width of the high resistant ring wall is greater than 5 μm. The first electrode is disposed between the carrier substrate and the epitaxy structure. The second electrode is disposed at a side of the epitaxy structure away from the carrier substrate.

Abstract translation: 提供发光器件和制造发光器件的方法。 发光器件包括载体衬底，至少一个外延结构，高电阻环壁，第一电极和第二电极。 外延结构设置在载体基板上，并且包括依次堆叠的第一半导体层，有源层和第二半导体层。 第一半导体层相对离开载体衬底，并且第二半导体层相对靠近载体衬底。 高阻环圈围绕外延结构，高阻环的宽度大于5um。 第一电极设置在载体衬底和外延结构之间。 第二电极设置在远离载体衬底的外延结构的一侧。

公开(公告)号：US08465577B2

公开(公告)日：2013-06-18

申请号：US12826838

申请日：2010-06-30

Applicant: Hsiao-San Chen ,  Jen-Fang Lin

Inventor： Hsiao-San Chen ,  Jen-Fang Lin

IPC: C09D11/02 ,  C09B31/08

CPC classification number: C09B33/10 ,  C09B67/0055 ,  C09D11/328

Abstract: A novel black ink composition is provided. In the black ink composition of the present invention, the dye compounds include a blue dye compound of formula (I), a red dye compound of formula (II) and a yellow dye compound of formula (III). The black ink composition of the present invention is suitable for inkjet printing to improve light-fastness and printing property.

Abstract translation: 提供了一种新颖的黑色油墨组合物。 在本发明的黑色油墨组合物中，染料化合物包括式（I）的蓝色染料化合物，式（II）的红色染料化合物和式（III）的黄色染料化合物。 本发明的黑色油墨组合物适用于喷墨印刷以提高耐光性和印刷性。

公开(公告)号：US20130141187A1

公开(公告)日：2013-06-06

申请号：US13588077

申请日：2012-08-17

Applicant: Min-Han Chuang ,  Chia-Chu Lai ,  Bo-Shiang Fang ,  Ho-Chuan Lin ,  Li-Fang Lin

Inventor： Min-Han Chuang ,  Chia-Chu Lai ,  Bo-Shiang Fang ,  Ho-Chuan Lin ,  Li-Fang Lin

IPC: H03H7/01

CPC classification number: H03H7/09 ,  H01P1/20327 ,  H03H7/0161 ,  H03H7/12

Abstract: A cross-coupled bandpass filter includes first, second and third resonators such that a positive mutual inductance is generated between the first and third resonators and mutual inductance generated between the first and second resonators and mutual inductance generated between the second and third resonators have the same polarity, thereby generating a transmission zero in a high frequency rejection band.

Abstract translation: 交叉耦合带通滤波器包括第一，第二和第三谐振器，使得在第一和第三谐振器之间产生正互感，并且在第一和第二谐振器之间产生的互感和在第二和第三谐振器之间产生的互感相同 从而在高频抑制频带中产生传输零点。

公开(公告)号：US08420521B2

公开(公告)日：2013-04-16

申请号：US12955256

申请日：2010-11-29

Applicant: Fang-Lin Tsai ,  Ho-Yi Tsai ,  Han-Ping Pu ,  Cheng-Hsu Hsiao

Inventor： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Han-Ping Pu ,  Cheng-Hsu Hsiao

IPC: H01L21/44

CPC classification number: H01L25/105 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01077 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A stack structure of semiconductor packages and a method for fabricating the stack structure are provided. A plurality of electrical connection pads and dummy pads are formed on a surface of a substrate of an upper semiconductor package and at positions corresponding to those around an encapsulant of a lower semiconductor package. Solder balls are implanted to the electrical connection pads and the dummy pads. The upper semiconductor package is mounted on the lower semiconductor package. The upper semiconductor package is electrically connected to the lower semiconductor package by the solder balls implanted to the electrical connection pads, and the encapsulant of the lower semiconductor package is surrounded and confined by the solder balls implanted to the dummy pads. Thereby, the upper semiconductor package is properly and securely positioned on the lower semiconductor package, without the occurrence of misalignment between the upper and lower semiconductor packages.

Abstract translation: 提供半导体封装的堆叠结构以及制造叠层结构的方法。 在上半导体封装的衬底的表面上和与下半导体封装的密封剂周围的位置对应的位置处形成多个电连接焊盘和虚拟焊盘。 将焊球植入电连接焊盘和虚拟焊盘。 上半导体封装安装在下半导体封装上。 上半导体封装通过注入电连接焊盘的焊球电连接到下半导体封装，并且下半导体封装的密封剂被植入到虚拟焊盘中的焊球围绕并限制。 因此，上半导体封装被适当且牢固地定位在下半导体封装上，而不会发生上下半导体封装之间的未对准。

公开(公告)号：US20130047338A1

公开(公告)日：2013-02-28

申请号：US13217768

申请日：2011-08-25

Applicant: Yi-Fang LIN

Inventor： Yi-Fang LIN

IPC: A47G9/10

CPC classification number: A47G9/1081

Abstract: A pillow with better neck support structure in accordance with the present invention comprises: a head support portion connected to a correction support portion, the head support portion is softer than the correction support portion. The user's head can be well positioned when laid on the head support portion which is softer than the correction support portion, and the correction support portion which is relatively harder can support the user's head in such a manner that the scapula of the user is supported on the second support section of the correction support portion, while the user's neck is suspended with respect to the traction section, so that the cervical spine, under its gravity, can be returned to a pressure-free and most ergonomic position, thus improving blood circulation in the brain cells.

Abstract translation: 根据本发明的具有更好的颈部支撑结构的枕头包括：连接到校正支撑部分的头部支撑部分，头部支撑部分比校正支撑部分柔软。 使用者的头部放置在比校正支撑部分更柔软的头部支撑部分上时可以很好地定位，并且相对较硬的校正支撑部分可以以使得使用者的肩胛骨被支撑在其上的方式支撑使用者的头部 校正支撑部分的第二支撑部分，同时使用者的颈部相对于牵引部分悬挂，使得颈椎在其重力下可以返回到无压力和最符合人体工程学的位置，从而改善血液循环 在脑细胞中。