Abstract:
A ratchet buckle, which is configured to connect a first strap and a second strap, includes a controlling device, an operating device connected to the first strap, a reel passing through the controlling device and the operating device along an axial line, the second strap wound around the reel, at least one ratchet set mounted on the reel, the reel being not rotated relative to the ratchet set, and a pawl device. When the user wants to unwind the second strap from the reel, the user moves and rotates the controlling device smoothly with only one hand thereof; therefore, it's very convenient for the user to operate. The special structure making the ratchet set unidirectionally rotatable, and it doesn't need any further structure, so that it is lighter and has lower cost.
Abstract:
A method for manufacturing a chip packaging structure is disclosed. The manufacturing method includes steps of: providing a protection layer; forming a conductive trace layer on the protection layer; forming an adhesion layer on the conductive trace layer; placing a chip on the adhesion layer; and electrically connecting the chip to the conductive trace layer. Via these arrangements, the chip packaging structure made by the manufacturing method can have a smaller thickness.
Abstract:
A mode-configurable amplifier comprises a single-ended input for receiving a received signal from a capacitive touch panel, a differential output operable to carry a differential processed signal to a subsequent processing stage, and processing circuitry in communication with the single ended input and the differential output. The processing circuitry comprises mode selection inputs and mode selection circuitry in communication with the mode selection inputs. The mode selection circuitry is operable to configure the processing circuitry into a current operating mode selected from a high-pass filter mode, bandpass filter mode, and a trans-capacitive gain mode. The high-pass filter mode is operable to high-pass filter the received signal to obtain the differential processed signal. The bandpass filter mode is operable to bandpass filter the received signal to obtain the differential processed signal. The wideband gain mode is operable to amplify the received signal to obtain the differential processed signal.
Abstract:
A modular power device is used for mounting on a main plate. The modular power system includes a first substrate, a driving module and a converting module. The first substrate having a first axial direction and a second axial direction substantially perpendicular to the first axial direction is inserted into the main plate, such that the second axial direction is substantially perpendicular to the main plate. The driving module is located on one side of the first substrate and electrically connected thereon. The converting module is located on the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction.
Abstract:
One embodiment of the present invention provides a system stored on a non-transitory computer-readable storage medium for invoking a plug-in that is dynamically associated with a database operation. During operation, a client sends a request to a database system to perform an operation on the database, wherein the request includes a control-message which specifies a plug-in which needs to be executed. Next, the system executes the plug-in at a plug-in server to obtain a plug-in result. Then, the system determines if the plug-in result is an error identifier. If so, the system sends the error identifier to the client. On the other hand, if the plug-in result is not an error identifier, the system performs the operation to obtain an operation result. The system then sends the operation result to the client.
Abstract:
A light emitting device and a method of fabricating a light emitting device are provided. The light emitting device includes a carrier substrate, at least one epitaxy structure, a high resistant ring wall, a first electrode, and a second electrode. The epitaxy structure is disposed on the carrier substrate and includes a first semiconductor layer, an active layer, and a second semiconductor layer stacked in sequence. The first semiconductor layer is relatively away from the carrier substrate and the second semiconductor layer is relatively close to the carrier substrate. The high resistant ring wall surrounds the epitaxy structure and a width of the high resistant ring wall is greater than 5 μm. The first electrode is disposed between the carrier substrate and the epitaxy structure. The second electrode is disposed at a side of the epitaxy structure away from the carrier substrate.
Abstract:
A novel black ink composition is provided. In the black ink composition of the present invention, the dye compounds include a blue dye compound of formula (I), a red dye compound of formula (II) and a yellow dye compound of formula (III). The black ink composition of the present invention is suitable for inkjet printing to improve light-fastness and printing property.
Abstract:
A cross-coupled bandpass filter includes first, second and third resonators such that a positive mutual inductance is generated between the first and third resonators and mutual inductance generated between the first and second resonators and mutual inductance generated between the second and third resonators have the same polarity, thereby generating a transmission zero in a high frequency rejection band.
Abstract:
A stack structure of semiconductor packages and a method for fabricating the stack structure are provided. A plurality of electrical connection pads and dummy pads are formed on a surface of a substrate of an upper semiconductor package and at positions corresponding to those around an encapsulant of a lower semiconductor package. Solder balls are implanted to the electrical connection pads and the dummy pads. The upper semiconductor package is mounted on the lower semiconductor package. The upper semiconductor package is electrically connected to the lower semiconductor package by the solder balls implanted to the electrical connection pads, and the encapsulant of the lower semiconductor package is surrounded and confined by the solder balls implanted to the dummy pads. Thereby, the upper semiconductor package is properly and securely positioned on the lower semiconductor package, without the occurrence of misalignment between the upper and lower semiconductor packages.
Abstract:
A pillow with better neck support structure in accordance with the present invention comprises: a head support portion connected to a correction support portion, the head support portion is softer than the correction support portion. The user's head can be well positioned when laid on the head support portion which is softer than the correction support portion, and the correction support portion which is relatively harder can support the user's head in such a manner that the scapula of the user is supported on the second support section of the correction support portion, while the user's neck is suspended with respect to the traction section, so that the cervical spine, under its gravity, can be returned to a pressure-free and most ergonomic position, thus improving blood circulation in the brain cells.