公开(公告)号：US06992898B2

公开(公告)日：2006-01-31

申请号：US10160629

申请日：2002-06-03

申请人： Erik Heinemann ,  Frank Püschner ,  Detlef Houdeau

发明人： Erik Heinemann ,  Frank Püschner ,  Detlef Houdeau

IPC分类号： H05K7/02 ,  H05K3/30 ,  H05K1/02

CPC分类号： G06K19/07743

摘要： A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one surface of the semiconductor film, contact areas are applied directly. The substrate film is disposed between the semiconductor chip and the contact areas in such a way that it connects the connection points of the semiconductor chip to the contact areas in a manner of a direct contact.

公开(公告)号：US06469902B1

公开(公告)日：2002-10-22

申请号：US09440409

申请日：1999-11-15

申请人： Frank Püschner ,  Erik Heinemann ,  Ralf Henn

发明人： Frank Püschner ,  Erik Heinemann ,  Ralf Henn

IPC分类号： H05K114

CPC分类号： B32B27/08 ,  B32B7/12 ,  B32B27/308 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2405/00 ,  B32B2425/00 ,  G06K19/041 ,  G06K19/07722 ,  G06K19/07745 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an adhesive joint which connects a body made of a first material to a plastic body. The adhesive joint is formed by an adhesive laminate which includes a flexible core layer made of acrylate and outer layers made of hot-melt adhesive which respectively adjoin the first body and the plastic body, and a transition layer is respectively arranged between the outer layers and the core layer.

摘要翻译： 本发明涉及将由第一材料制成的本体连接到塑料体上的粘接接头。 粘合剂接合体由粘合剂层压体形成，该粘合剂层压体包括由丙烯酸酯制成的柔性芯层和由热熔粘合剂制成的外层，其分别邻接第一主体和塑料体，并且过渡层分别设置在外层和 核心层。

公开(公告)号：US07069652B2

公开(公告)日：2006-07-04

申请号：US10264873

申请日：2002-10-04

申请人： Erik Heinemann ,  Frank Püschner

发明人： Erik Heinemann ,  Frank Püschner

IPC分类号： H01K3/10

CPC分类号： G06K19/07718 ,  G06K19/077 ,  G06K19/0775 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01004 ,  Y10S174/34 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A smart card is laminated from at least two layers of paper or film as a mounting material. A first of the layers is fitted with a semiconductor chip and a second layer has connecting contacts as well as conductor tracks or external connecting surfaces. The contacts of the semiconductor chips are electrically conductively connected to the connecting contacts on the second layer. No chip modules are required to produce the smart cards. The mounting materials provided with ICs and contacts can be laminated in an endless roll format, in the same way as for paper production.

公开(公告)号：US06472250B1

公开(公告)日：2002-10-29

申请号：US09494776

申请日：2000-01-31

申请人： Frank Püschner ,  Jürgen Fischer ,  Erik Heinemann

发明人： Frank Püschner ,  Jürgen Fischer ,  Erik Heinemann

IPC分类号： H01L2144

CPC分类号： G06K19/07747 ,  G06K19/07745 ,  H01L2224/48091 ,  H01L2924/18301 ,  H01L2924/00014

摘要： A method for producing a chip module includes punching a chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance. The given distance is subsequently reduced to a dimension preventing a flow through of a sealing mass by a swaging operation carried out at least in a region close to the slots.

摘要翻译： 一种芯片模块的制造方法包括冲压芯片载体以形成芯片载体固定部分和芯片载体接触部分，该芯片载体接触部分通过限定给定距离的狭缝与芯片载体固定部分间隔开。 给定距离随后被减小到通过至少在靠近槽的区域中进行的模锻操作来防止密封块流过的尺寸。

公开(公告)号：US06557769B2

公开(公告)日：2003-05-06

申请号：US10083039

申请日：2002-02-26

申请人： Frank Püschner ,  Erik Heinemann ,  Jürgen Fischer

发明人： Frank Püschner ,  Erik Heinemann ,  Jürgen Fischer

IPC分类号： G06K1906

CPC分类号： G06K19/07747 ,  G06K19/07743 ,  G06K19/07745 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05599

摘要： Flip-chip bumps (solder bumps) are applied on the contact-connection points of a semiconductor chip. These bumps extend from there through a covering compound (mold) that is applied as a protective layer. The end of each one of the bumps that is remote from the semiconductor chip forms a pad. This pad lies approximately plane-parallel in the surface of the covering compound that is remote from the semiconductor chip. At least during the encapsulation process, the chips are preferably arranged on a carrier element, in particular a carrier strip.

公开(公告)号：US09368700B2

公开(公告)日：2016-06-14

申请号：US14233754

申请日：2012-06-27

申请人： Simon Jerebic ,  Erik Heinemann ,  Markus Pindl ,  Michael Bestele ,  Jan Marfeld

发明人： Simon Jerebic ,  Erik Heinemann ,  Markus Pindl ,  Michael Bestele ,  Jan Marfeld

IPC分类号： H01L33/54 ,  H01L33/50 ,  H01L33/60 ,  H01L25/075

CPC分类号： H01L33/508 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element.

摘要翻译： 光电子部件包括其上布置有半导体芯片和可吸湿吸引子元件的基板。 包括颜料的介质至少区域地覆盖未被半导体芯片和吸引元件覆盖的基板的暴露区域。 该介质至少部分地润湿半导体芯片和吸引元件。

公开(公告)号：US20130181247A1

公开(公告)日：2013-07-18

申请号：US13811524

申请日：2011-07-01

申请人： Simon Jerebic ,  Erik Heinemann ,  Christian Gaertner ,  Ales Markytan

发明人： Simon Jerebic ,  Erik Heinemann ,  Christian Gaertner ,  Ales Markytan

IPC分类号： H01L33/60 ,  H01L31/18 ,  H01L31/0232

CPC分类号： H01L33/60 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/46 ,  H01L2933/0025

摘要： A semiconductor component includes at least one optoelectronic semiconductor chip and a connecting carrier having a connecting surface on which the semiconductor chip is disposed. A reflective coating and a limiting structure are formed on the connecting carrier. The limiting structure at least partially encloses the semiconductor chip in the lateral direction, and the reflective coating at least partially extends in the lateral direction between a side surface of the semiconductor chip and the limiting structure.

摘要翻译： 半导体部件包括至少一个光电子半导体芯片和具有设置半导体芯片的连接表面的连接载体。 在连接载体上形成反射涂层和限制结构。 限制结构至少部分地将半导体芯片围绕在横向方向上，并且反射涂层在半导体芯片的侧表面和限制结构之间沿横向方向至少部分地延伸。

公开(公告)号：US07902683B2

公开(公告)日：2011-03-08

申请号：US11388327

申请日：2006-03-23

申请人： Frank Pueschner ,  Erik Heinemann ,  Stephan Janka

发明人： Frank Pueschner ,  Erik Heinemann ,  Stephan Janka

IPC分类号： H01L23/06

CPC分类号： H01L23/3157 ,  G06K19/07745 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/01084 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor arrangement having at least one semiconductor chip, which has, on one surface, an integrated circuit and at least one contact element which is electrically conductively connected to the latter, and having an edge protector, which at least partially covers an edge region on the surface of the semiconductor, the edge region extending along outer edges of the semiconductor chip. A method for manufacturing the above-mentioned semiconductor arrangement.

摘要翻译： 一种具有至少一个半导体芯片的半导体装置，该半导体芯片在一个表面上具有集成电路和至少一个与之导电连接的接触元件，并具有边缘保护器，该边缘保护器至少部分地覆盖 半导体的表面，边缘区域沿着半导体芯片的外边缘延伸。 一种制造上述半导体装置的方法。

公开(公告)号：US07019981B2

公开(公告)日：2006-03-28

申请号：US10762882

申请日：2004-01-21

申请人： Erik Heinemann ,  Frank Pueschner

发明人： Erik Heinemann ,  Frank Pueschner

IPC分类号： H05K1/14

CPC分类号： G06K19/07745 ,  G06K19/077 ,  G06K19/07743 ,  H01L23/49855 ,  H01L2224/16 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/3025 ,  H01L2924/00

摘要： A chip card having a chip card body, a semiconductor chip and a carrier substrate, the carrier substrate being provided on both sides with surface contacts and with contact-hole lines electrically connecting the upper and lower surface contacts to one another. The contact-hole lines are arranged so close to the edge of the carrier substrate that their lower ends open out into a base of an outer cavity, where they are closed off, to thereby prevent moisture from penetrating into the inner cavity, in which the semiconductor chip is located, without it being necessary to produce a dedicated cover for the contact-hole lines.

摘要翻译： 具有芯片卡体，半导体芯片和载体基板的芯片卡，载体基板在两面设置有表面触点，并且将上下表面触点彼此电连接的接触孔线。 接触孔线被布置成靠近载体基底的边缘，使得它们的下端打开到外部空腔的基部中，在那里它们被封闭，从而防止水分渗透到内腔中，其中 位于半导体芯片上，无需生产用于接触孔线的专用盖。

公开(公告)号：USD405779S

公开(公告)日：1999-02-16

申请号：US70054

申请日：1997-04-25

申请人： Michael Huber ,  Peter Stampka ,  Erik Heinemann ,  Christian Hauser ,  Frank Pueschner

设计人： Michael Huber ,  Peter Stampka ,  Erik Heinemann ,  Christian Hauser ,  Frank Pueschner