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公开(公告)号：US20140290996A1
公开(公告)日：2014-10-02
申请号：US14232489
申请日：2012-07-12
申请人： Sung Bae Moon , Hae Yeon Kim , Jae Man Park , Jong Heum Yoon , In Hee Cho
发明人： Sung Bae Moon , Hae Yeon Kim , Jae Man Park , Jong Heum Yoon , In Hee Cho
CPC分类号： H05K1/0373 , C08K3/22 , C08K3/28 , C08K3/36 , C08K3/38 , C08L21/00 , C08L63/00 , H05K1/0203 , H05K1/0346 , H05K1/056
摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要翻译： 公开了一种环氧树脂化合物和使用其的辐射热电路板。 环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。 环氧树脂包括结晶环氧树脂和将无机填料分散到环氧树脂中的橡胶添加剂。 在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。
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公开(公告)号：US20140318839A1
公开(公告)日：2014-10-30
申请号：US14235692
申请日：2012-07-27
申请人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
发明人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
CPC分类号： H05K1/0201 , C08G59/184 , C08K3/22 , C08K2003/2227 , C08L63/00 , H01L23/142 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K2201/0209 , H01L2924/00
摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要翻译： 公开了一种环氧树脂化合物和使用其的辐射热电路板。 环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。 固化剂包括形成以将固化剂添加到结晶环氧树脂中的环氧加合物。 在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。
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公开(公告)号：US20140318835A1
公开(公告)日：2014-10-30
申请号：US14241961
申请日：2012-08-30
申请人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
发明人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
CPC分类号： H05K1/056 , C08G59/226 , C08G59/245 , C08G59/38 , C08K3/013 , C08L63/00 , C08L63/04 , C09K5/14 , C08K3/0033
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂化合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂化合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，通过使用上述环氧树脂作为印刷电路板的绝缘材料，可以提供高辐射热板。
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公开(公告)号：US20140290986A1
公开(公告)日：2014-10-02
申请号：US14232510
申请日：2012-07-12
申请人： Eun Jin Kim , Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Hyun Gyu Park , Jong Heum Yoon , In Hee Cho , Jin Hwan Kim , Thanh Kieu Giang
发明人： Eun Jin Kim , Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Hyun Gyu Park , Jong Heum Yoon , In Hee Cho , Jin Hwan Kim , Thanh Kieu Giang
CPC分类号： H05K1/0373 , C08K3/013 , C08L63/00 , H05K1/0212 , H05K1/0346 , H05K1/056
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
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5.发明申请PHOTORESIST COMPOSITION, METHOD OF FORMING PATTERN BY USING THE PHOTORESIST COMPOSITION, AND METHOD OF MANUFACTURING THIN-FILM TRANSISTOR SUBSTRATE 审中-公开光电组合物，使用光电组合物形成图案的方法，以及制造薄膜晶体管基板的方法公开(公告)号：US20110269309A1
公开(公告)日：2011-11-03
申请号：US12981304
申请日：2010-12-29
申请人： Pil-Soon HONG , Gwui-Hyun PARK , Jin-Ho JU , Jean-Ho SONG , Sang-Tae KIM , Seong-Hyeon KIM , Won-Young CHANG , Jong-Heum YOON , Eun-Sang LEE , Min-Ju IM
发明人： Pil-Soon HONG , Gwui-Hyun PARK , Jin-Ho JU , Jean-Ho SONG , Sang-Tae KIM , Seong-Hyeon KIM , Won-Young CHANG , Jong-Heum YOON , Eun-Sang LEE , Min-Ju IM
IPC分类号： H01L21/3213 , G03F7/20 , G03F7/004
CPC分类号： H01L27/1288 , G03F7/0226 , G03F7/0236 , G03F7/085 , G03F7/40 , H01L21/32139 , H01L27/1214
摘要： Provided are a photoresist composition having superior adhesion to an etch target film, a method of forming a pattern by using the photoresist composition, and a method of manufacturing a thin-film transistor (TFT) substrate. The photoresist composition includes an alkali-soluble resin; a photosensitive compound; a solvent; and 0.01 to 0.1 parts by weight of a compound represented by Formula 1: wherein R is one of hydrogen, an alkyl having 1 to 10 carbon atoms, a cycloalkyl having 4 to 8 carbon atoms, and a phenyl group.
摘要翻译： 提供了具有优异的与蚀刻目标膜的粘附性的光致抗蚀剂组合物，通过使用光致抗蚀剂组合物形成图案的方法，以及制造薄膜晶体管（TFT）基板的方法。 光致抗蚀剂组合物包括碱溶性树脂; 光敏化合物; 溶剂; 和0.01〜0.1重量份的由式1表示的化合物：其中R是氢，具有1至10个碳原子的烷基，具有4至8个碳原子的环烷基和苯基之一。
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公开(公告)号：US09974172B2
公开(公告)日：2018-05-15
申请号：US14241961
申请日：2012-08-30
申请人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
发明人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
IPC分类号： H05K1/05 , B32B27/38 , C08L63/00 , C09J163/00 , C08K3/22 , C08G59/22 , C08G59/24 , C08G59/38 , C08L63/04 , C09K5/14
CPC分类号： H05K1/056 , C08G59/226 , C08G59/245 , C08G59/38 , C08K3/013 , C08L63/00 , C08L63/04 , C09K5/14 , C08K3/0033
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
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公开(公告)号：US09357630B2
公开(公告)日：2016-05-31
申请号：US14235692
申请日：2012-07-27
申请人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
发明人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
IPC分类号： C08G59/18 , C08G59/20 , C08G59/50 , C08L63/00 , H05K1/05 , H01L23/14 , H01L23/373 , H05K1/02 , H05K1/03
CPC分类号： H05K1/0201 , C08G59/184 , C08K3/22 , C08K2003/2227 , C08L63/00 , H01L23/142 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K2201/0209 , H01L2924/00
摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要翻译： 公开了一种环氧树脂化合物和使用其的辐射热电路板。 环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。 固化剂包括形成以将固化剂添加到结晶环氧树脂中的环氧加合物。 在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。
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