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公开(公告)号：US20140290996A1
公开(公告)日：2014-10-02
申请号：US14232489
申请日：2012-07-12
申请人： Sung Bae Moon , Hae Yeon Kim , Jae Man Park , Jong Heum Yoon , In Hee Cho
发明人： Sung Bae Moon , Hae Yeon Kim , Jae Man Park , Jong Heum Yoon , In Hee Cho
CPC分类号： H05K1/0373 , C08K3/22 , C08K3/28 , C08K3/36 , C08K3/38 , C08L21/00 , C08L63/00 , H05K1/0203 , H05K1/0346 , H05K1/056
摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要翻译： 公开了一种环氧树脂化合物和使用其的辐射热电路板。 环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。 环氧树脂包括结晶环氧树脂和将无机填料分散到环氧树脂中的橡胶添加剂。 在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。
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公开(公告)号：US20140318839A1
公开(公告)日：2014-10-30
申请号：US14235692
申请日：2012-07-27
申请人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
发明人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
CPC分类号： H05K1/0201 , C08G59/184 , C08K3/22 , C08K2003/2227 , C08L63/00 , H01L23/142 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K2201/0209 , H01L2924/00
摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要翻译： 公开了一种环氧树脂化合物和使用其的辐射热电路板。 环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。 固化剂包括形成以将固化剂添加到结晶环氧树脂中的环氧加合物。 在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。
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公开(公告)号：US20140318835A1
公开(公告)日：2014-10-30
申请号：US14241961
申请日：2012-08-30
申请人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
发明人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
CPC分类号： H05K1/056 , C08G59/226 , C08G59/245 , C08G59/38 , C08K3/013 , C08L63/00 , C08L63/04 , C09K5/14 , C08K3/0033
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂化合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂化合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，通过使用上述环氧树脂作为印刷电路板的绝缘材料，可以提供高辐射热板。
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公开(公告)号：US20140290986A1
公开(公告)日：2014-10-02
申请号：US14232510
申请日：2012-07-12
申请人： Eun Jin Kim , Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Hyun Gyu Park , Jong Heum Yoon , In Hee Cho , Jin Hwan Kim , Thanh Kieu Giang
发明人： Eun Jin Kim , Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Hyun Gyu Park , Jong Heum Yoon , In Hee Cho , Jin Hwan Kim , Thanh Kieu Giang
CPC分类号： H05K1/0373 , C08K3/013 , C08L63/00 , H05K1/0212 , H05K1/0346 , H05K1/056
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
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公开(公告)号：US09974172B2
公开(公告)日：2018-05-15
申请号：US14241961
申请日：2012-08-30
申请人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
发明人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
IPC分类号： H05K1/05 , B32B27/38 , C08L63/00 , C09J163/00 , C08K3/22 , C08G59/22 , C08G59/24 , C08G59/38 , C08L63/04 , C09K5/14
CPC分类号： H05K1/056 , C08G59/226 , C08G59/245 , C08G59/38 , C08K3/013 , C08L63/00 , C08L63/04 , C09K5/14 , C08K3/0033
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
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公开(公告)号：US09357630B2
公开(公告)日：2016-05-31
申请号：US14235692
申请日：2012-07-27
申请人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
发明人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
IPC分类号： C08G59/18 , C08G59/20 , C08G59/50 , C08L63/00 , H05K1/05 , H01L23/14 , H01L23/373 , H05K1/02 , H05K1/03
CPC分类号： H05K1/0201 , C08G59/184 , C08K3/22 , C08K2003/2227 , C08L63/00 , H01L23/142 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K2201/0209 , H01L2924/00
摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要翻译： 公开了一种环氧树脂化合物和使用其的辐射热电路板。 环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。 固化剂包括形成以将固化剂添加到结晶环氧树脂中的环氧加合物。 在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。
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7.发明申请RADIANT HEAT CIRCUIT BOARD, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT UNIT 有权辐射热电路板，具有该发光装置的发热装置包和背光单元公开(公告)号：US20130206459A1
公开(公告)日：2013-08-15
申请号：US13878319
申请日：2011-10-05
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： H05K1/02
CPC分类号： H05K1/021 , H01L23/3677 , H01L23/49838 , H01L25/0753 , H01L33/642 , H01L2224/73203 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10106
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。
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公开(公告)号：US09451695B2
公开(公告)日：2016-09-20
申请号：US14119122
申请日：2012-05-21
申请人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
发明人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
IPC分类号： C08L63/00 , C08K3/10 , C08K3/22 , C08K3/36 , C08K3/38 , H05K1/05 , C08G59/62 , C08G59/68 , C09K5/14 , C08K3/28 , C08K3/00
CPC分类号： H05K1/05 , C08G59/621 , C08G59/686 , C08K3/013 , C08K3/36 , C08K2003/2227 , C08K2003/282 , C08K2003/385 , C08L63/00 , C09K5/14 , H05K1/056 , H05K2201/0209 , H05K2201/10106
摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂组合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂组合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，可以通过使用上述环氧树脂作为印刷电路板的绝缘材料来提供高辐射热板。
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公开(公告)号：US20140231122A1
公开(公告)日：2014-08-21
申请号：US14119122
申请日：2012-05-21
申请人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
发明人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
CPC分类号： H05K1/05 , C08G59/621 , C08G59/686 , C08K3/013 , C08K3/36 , C08K2003/2227 , C08K2003/282 , C08K2003/385 , C08L63/00 , C09K5/14 , H05K1/056 , H05K2201/0209 , H05K2201/10106
摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂组合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂组合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，通过使用上述环氧树脂作为印刷电路板的绝缘材料，可以提供高辐射热板。
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10.发明授权Radiant heat circuit board, heat generating device package having the same, and backlight unit 有权辐射热电路板，具有相同的发热装置封装和背光单元公开(公告)号：US09549458B2
公开(公告)日：2017-01-17
申请号：US13878319
申请日：2011-10-05
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： H05K1/02 , H01L25/075 , H05K1/05 , H01L23/367 , H01L23/498 , H01L33/64
CPC分类号： H05K1/021 , H01L23/3677 , H01L23/49838 , H01L25/0753 , H01L33/642 , H01L2224/73203 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10106
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。
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