公开(公告)号：US20080169568A1

公开(公告)日：2008-07-17

申请号：US11897200

申请日：2007-08-29

Applicant: Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

Inventor： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC: H01L21/768 ,  H01L23/538

CPC classification number: H05K3/4614 ,  H01L23/48 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00

Abstract: A multilayer interconnect element is provided which includes at least one dielectric element in which metal interconnect patterns are exposed at an outer surface thereof, the metal interconnect patterns having outer surfaces which are co-planar with an exposed outer surface of the dielectric element. In addition, multilayer interconnect elements are provided in which second interconnect elements which do not have co-planar interconnect patterns are integrated therewith as intermediate elements, and the resulting multilayer interconnect element has co-planar interconnect patterns.

Abstract translation: 提供了一种多层互连元件，其包括至少一个电介质元件，其中金属互连图案在其外表面处露出，金属互连图案具有与介电元件的暴露的外表面共平面的外表面。 此外，提供了多层互连元件，其中不具有共面互连图案的第二互连元件作为中间元件与其集成，并且所得到的多层互连元件具有共面互连图案。

公开(公告)号：US20110057324A1

公开(公告)日：2011-03-10

申请号：US12941511

申请日：2010-11-08

Applicant: Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

Inventor： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC: H01L23/522

CPC classification number: H05K3/4038 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/20 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns.

Abstract translation: 提供互连元件。 单片电介质元件具有第一暴露的主表面，从第一主表面向内延伸的多个第一凹槽和远离第一主表面的第二暴露的主表面，从第二主表面向内延伸的多个第二凹槽。 多个第一金属互连图案被嵌入在多个第一凹部中并沿着第一主表面沿一个或多个方向延伸。 多个第二金属互连图案被嵌入在多个第二凹部中并沿着第二主表面沿一个或多个方向延伸。 多个非中空金属柱在多个第一金属互连图案中的至少一些和多个第二金属互连图案中的至少一些之间延伸穿过介质元件。

公开(公告)号：US20080136041A1

公开(公告)日：2008-06-12

申请号：US11805300

申请日：2007-05-23

Applicant: Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

Inventor： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC: H01L23/48 ,  H01L21/4763

CPC classification number: H05K3/4038 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/20 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An interconnect element is provided which includes a dielectric element having a major surface. Metal interconnect patterns are embedded in recesses which extend inwardly from the major surface, the outer surfaces of the interconnect patterns being substantially co-planar with the major surface and extending in one or more directions of the major surface. A projecting conductive film extends over the major surface in at least one direction parallel to a plane defined by the major surface such that it contacts the dielectric element along at least a portion of the major surface and conductively contacts an outer surface of at least one of the metal interconnect patterns.

Abstract translation: 提供一种互连元件，其包括具有主表面的电介质元件。 金属互连图案嵌入从主表面向内延伸的凹槽中，互连图案的外表面与主表面基本共面并且在主表面的一个或多个方向上延伸。 突出的导电膜在平行于由主表面限定的平面的至少一个方向上在主表面上延伸，使得其沿着主表面的至少一部分接触电介质元件，并且导电地接触至少一个的外表面 金属互连图案。

公开(公告)号：US06893576B1

公开(公告)日：2005-05-17

申请号：US09713036

申请日：2000-11-16

Applicant: Akitaka Nakayama ,  Akio Ikeda ,  Kiyoshi Hyodo ,  Kazuo Uchida

Inventor： Akitaka Nakayama ,  Akio Ikeda ,  Kiyoshi Hyodo ,  Kazuo Uchida

IPC: H05K3/28 ,  G03F7/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/46 ,  H01B13/00 ,  G03F7/26

CPC classification number: G03F7/0035 ,  H05K1/0266 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/28 ,  H05K2201/09936 ,  H05K2203/0505 ,  H05K2203/0551 ,  H05K2203/107

Abstract: This invention is a method of manufacturing a multi-layer printed wiring board including an internal layer circuit forming step, a outer layer circuit forming step, and a solder resist forming step. In the solder resist forming step, the surface of a board subjected to the outer layer circuit forming step is coated with a photosensitive solder resist material, the solder resist material is coated with a photosensitive film; a light shielding mask is formed by irradiating a laser beam on the photosensitive film according to a formed pattern of the solder resist, the solder resist material is exposed by using the light shielding mask, the light shielding mask is removed, and the solder resist material which is not exposed is removed.

Abstract translation: 本发明是一种制造包括内层电路形成步骤，外层电路形成步骤和阻焊剂形成步骤的多层印刷线路板的方法。 在阻焊剂形成工序中，将经过外层电路形成工序的板的表面涂敷有感光性阻焊材料，使阻光材料涂布感光性膜。 通过根据形成的阻焊剂图案将激光束照射在感光膜上形成遮光掩模，通过使用遮光掩模曝光阻焊材料，除去遮光掩模和阻焊材料 没有暴露的是被去除。

公开(公告)号：US20070221329A1

公开(公告)日：2007-09-27

申请号：US11585287

申请日：2006-10-23

Applicant: Kazuo Sakuma ,  Inetaro Kurosawa ,  Kiyoshi Hyodo

Inventor： Kazuo Sakuma ,  Inetaro Kurosawa ,  Kiyoshi Hyodo

IPC: H01L21/306 ,  B44C1/22

CPC classification number: H05K3/0085 ,  H01L21/6708 ,  H01L21/67706 ,  H01L21/67721 ,  H01L21/6776 ,  H05K1/0393 ,  H05K3/068 ,  H05K2201/09018 ,  H05K2203/0746 ,  H05K2203/1572

Abstract: An apparatus and method are provided for processing an item by distributing a liquid onto a surface of the item. The apparatus includes a conveyor which defines an undulating path which varies in vertical position relative to the direction of movement of the item conveyable along the path. Thus, the path has at least one apex at a location of the path higher than other locations in the direction of movement along the path. A sprayer is operable to spray the liquid onto the surface of the item at a location that is substantially aligned to the apex of the path.

Abstract translation: 提供了一种通过将液体分配到物品的表面上来处理物品的装置和方法。 该设备包括一个输送机，该输送机限定了一个波浪路径，该波纹路径相对于沿该路径可传送的物品的移动方向在垂直位置上变化。 因此，路径在路径的位置处具有比沿着路径的移动方向上的其他位置更高的位置处的至少一个顶点。 喷雾器可操作以在基本上与路径的顶点对准的位置处将液体喷射到物品的表面上。

公开(公告)号：US06917848B1

公开(公告)日：2005-07-12

申请号：US09715081

申请日：2000-11-20

Applicant: Akitaka Nakayama ,  Akio Ikeda ,  Kiyoshi Hyodo ,  Kazuo Uchida

Inventor： Akitaka Nakayama ,  Akio Ikeda ,  Kiyoshi Hyodo ,  Kazuo Uchida

IPC: G05B19/418 ,  H05K3/00 ,  G06F19/00

CPC classification number: G05B19/41865 ,  G05B2219/32256 ,  G05B2219/45031 ,  H05K3/0052 ,  H05K3/0097 ,  Y02P80/40 ,  Y02P90/20

Abstract: A manufacturing system for printed wiring boards divides printed wiring boards scheduled to be manufactured into non-fractional and fractional groups depending on the content of an order remainder list. The printed wiring boards categorized as non-fractional are panelized having the same shapes while the printed wiring boards categorized as fractional are grouped corresponding to manufacturing conditions thereof. Then, each group of the printed wiring boards are panelized with different shapes in a predetermined manufacturing block. Consequently, the generation of incidental products or the waste of material can be prevented.

Abstract translation: 印刷线路板的制造系统根据订单剩余列表的内容，将计划制造成非分数和分数组的印刷电路板划分。 分类为非分数的印刷线路板被制成具有相同形状的板，而分类为分数的印刷线路板根据其制造条件分组。 然后，在预定的制造块中，各组印刷线路板被成形为不同的形状。 因此，可以防止附带产品的产生或材料的浪费。

公开(公告)号：US08736064B2

公开(公告)日：2014-05-27

申请号：US12941511

申请日：2010-11-08

Applicant: Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

Inventor： Hideki Kotake ,  Kiyoshi Hyodo ,  Inetaro Kurosawa ,  Yukio Hashimoto ,  Toku Yoshino ,  Tomoo Iijima

IPC: H01L23/522

CPC classification number: H05K3/4038 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/20 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns.

Abstract translation: 提供互连元件。 单片电介质元件具有第一暴露的主表面，从第一主表面向内延伸的多个第一凹槽和远离第一主表面的第二暴露的主表面，从第二主表面向内延伸的多个第二凹槽。 多个第一金属互连图案被嵌入在多个第一凹部中并沿着第一主表面沿一个或多个方向延伸。 多个第二金属互连图案被嵌入在多个第二凹部中并沿着第二主表面沿一个或多个方向延伸。 多个非中空金属柱在多个第一金属互连图案中的至少一些和多个第二金属互连图案中的至少一些之间延伸穿过介质元件。