公开(公告)号：US4761325A

公开(公告)日：1988-08-02

申请号：US762310

申请日：1985-08-02

申请人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

发明人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

IPC分类号： C03C10/00 ,  C04B35/14 ,  C04B35/16 ,  C04B35/18 ,  C04B35/632 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4667 ,  C03C10/0009 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H05K1/0306 ,  H05K3/46 ,  H05K3/4629 ,  C03C2214/04 ,  C03C2214/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  H05K2203/086 ,  H05K2203/088 ,  H05K2203/1126 ,  H05K3/1291 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252

摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

公开(公告)号：US4642148A

公开(公告)日：1987-02-10

申请号：US738658

申请日：1985-05-28

申请人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

发明人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

IPC分类号： C03C10/00 ,  C04B35/14 ,  C04B35/16 ,  C04B35/18 ,  C04B35/632 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B31/06

CPC分类号： H05K3/4667 ,  C03C10/0009 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H05K1/0306 ,  H05K3/46 ,  H05K3/4629 ,  C03C2214/04 ,  C03C2214/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  H05K2203/086 ,  H05K2203/088 ,  H05K2203/1126 ,  H05K3/1291 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252

摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

摘要翻译： 一种制造多层陶瓷电路板的方法，包括以下步骤：形成由铜基糊料和玻璃 - 陶瓷层的图案组成的多层结构，所述玻璃陶瓷层由10％至75％重量的α - 氧化铝，20％至60％重量的可结晶或不可结晶的玻璃，其可以在低于铜的熔点的温度下烧结，以及5％至70％重量的石英玻璃，基于玻璃的总重量 - 陶瓷，与含有可热解聚树脂的粘合剂共混; 在除去热可解聚树脂的温度下，在分压为0.005〜0.3个大气压的含有水蒸气的惰性气氛中预热多层结构体; 在低于铜熔点的温度下，在不含水蒸气的惰性气氛中烧成多层结构，烧结玻璃陶瓷。

公开(公告)号：US4679320A

公开(公告)日：1987-07-14

申请号：US801783

申请日：1985-11-26

申请人： Yoshihiko Imanaka ,  Hiromi Ogawa ,  Mineharu Tsukada ,  Etsuro Udagawa ,  Kazuaki Kurihara ,  Hiromitsu Yokoyama ,  Nobuo Kamehara

发明人： Yoshihiko Imanaka ,  Hiromi Ogawa ,  Mineharu Tsukada ,  Etsuro Udagawa ,  Kazuaki Kurihara ,  Hiromitsu Yokoyama ,  Nobuo Kamehara

IPC分类号： C04B35/622 ,  C04B35/632 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  H01K3/22

CPC分类号： H01L21/4867 ,  H05K1/0306 ,  H05K1/092 ,  Y10T29/49144 ,  Y10T29/49158

摘要： A process for producing a multilayer ceramic circuit board with copper including the steps of:forming green sheets by doctoring a slurry which includes 100 parts by weight of glass ceramic particles, 5 to 20 parts by weight of a thermally depolymerizable resin binder, 2 to 10 parts by weight of a plasticizer, and up to 2 parts by weight of a fatty acid ethylene oxide adduct type, deflorculant. The glass ceramic includes 20 to 70% by weight of alumina, and 30 to 80% by weight of SiO.sub.2 -B.sub.2 O.sub.3 glass. The process further includes the steps of forming via holes through the green sheets, screen-printing a copper paste on the green sheets, and laminating the green sheets, thereby forming a multilayer structure and firing the multilayer structure in a non-oxidizable atmosphere.

摘要翻译： 一种用于制造具有铜的多层陶瓷电路板的方法，包括以下步骤：通过将包含100重量份的玻璃陶瓷颗粒，5至20重量份的热解聚树脂粘合剂，2至10重量份的浆料 重量份的增塑剂和至多2重量份的脂肪酸环氧乙烷加合物类型的脱氯剂。 玻璃陶瓷包含20至70重量％的氧化铝和30至80重量％的SiO 2 -B 2 O 3玻璃。 该方法还包括以下步骤：在生片上形成通孔，在生片上丝网印刷铜膏，并层压生片，由此形成多层结构，并在不可氧化的气氛中烧结多层结构。

公开(公告)号：US5081070A

公开(公告)日：1992-01-14

申请号：US268195

申请日：1989-01-30

申请人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

发明人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

IPC分类号： H01L39/02 ,  B32B18/00 ,  C01G1/00 ,  C01G3/00 ,  C04B35/00 ,  C04B35/45 ,  H01B12/00 ,  H01B13/00 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L39/06 ,  H01L39/24 ,  H05K1/09

CPC分类号： H01L21/4846 ,  B32B18/00 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B37/005 ,  C04B37/006 ,  H01L21/76891 ,  H01L23/49888 ,  H01L39/2429 ,  C04B2235/483 ,  C04B2235/6567 ,  C04B2237/06 ,  C04B2237/066 ,  C04B2237/09 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/59 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

摘要翻译： 提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。 通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。 使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

公开(公告)号：US5286713A

公开(公告)日：1994-02-15

申请号：US64668

申请日：1993-05-21

申请人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

发明人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

IPC分类号： B32B18/00 ,  C04B35/45 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L39/24 ,  B05D3/02 ,  B05D5/12

CPC分类号： H01L21/4846 ,  B32B18/00 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B37/005 ,  H01L21/76891 ,  H01L23/49888 ,  H01L39/2429 ,  C04B2235/6567 ,  C04B2235/6585 ,  C04B2237/066 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/592 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/703 ,  Y10S505/741

摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

摘要翻译： 提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。 通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。 使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

公开(公告)号：US4954480A

公开(公告)日：1990-09-04

申请号：US197583

申请日：1988-04-27

申请人： Yoshihiko Imanaka ,  Takato Machi ,  Kazunori Yamanaka ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Yoshihiko Imanaka ,  Takato Machi ,  Kazunori Yamanaka ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H05K3/46 ,  B32B18/00 ,  C04B35/45 ,  C04B35/634 ,  C04B35/636 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/538 ,  H01L39/24

CPC分类号： C04B35/63416 ,  B32B18/00 ,  C04B35/45 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B35/634 ,  C04B35/63424 ,  C04B35/6365 ,  C04B35/645 ,  H01L21/4857 ,  H01L21/76891 ,  H01L23/49888 ,  H01L23/5383 ,  H01L39/2429 ,  H01L39/2464 ,  C04B2235/6567 ,  C04B2235/663 ,  C04B2237/343 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10T428/23 ,  Y10T428/239 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A multi-layer superconducting circuit substrate, including insulating layers, and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material are preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.

公开(公告)号：US5196384A

公开(公告)日：1993-03-23

申请号：US761006

申请日：1991-09-17

申请人： Hiroshi Kamezaki ,  Masato Wakamura ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Nobuo Kamehara

发明人： Hiroshi Kamezaki ,  Masato Wakamura ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Nobuo Kamehara

IPC分类号： C04B38/08 ,  C03C11/00 ,  C03C14/00 ,  C03C17/02 ,  C03C17/25 ,  C04B35/622 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K1/0306 ,  C03C11/002 ,  C03C14/004 ,  C03C17/02 ,  C03C17/25 ,  H01L21/4807 ,  C03C2214/04 ,  C03C2218/113

摘要： Methods for preparing a green sheet and a glass ceramic substrate are herein disclosed.The object of these methods is to make green sheets and glass ceramic substrates practically acceptable, the green sheets and the glass ceramic substrates having a low dielectric constant and low scattering in properties, and the method comprises the steps of preparing a mixture of hollow silica microspheres, borosilicate glass powder and ceramic powder as a principal ingredient, adding a plasticizer, a binder and a solvent to the mixture, kneading the mixture and forming it into a green sheet, wherein the shell-thickness of the hollow silica microspheres is controlled so that the specific gravity of the hollow silica microspheres is approximately equal to that of the solvent and wherein an inorganic substance containing aluminum as a constituent element such as alumina, mullite or aluminum nitride is used as the ceramic powder for forming the green sheet; or the method further comprises the step of calcining the resulting green sheet.

摘要翻译： 本文公开了制备生片和玻璃陶瓷衬底的方法。 这些方法的目的是使生片和玻璃陶瓷基板实际上可接受，生片和玻璃陶瓷基片具有低介电常数和低散射特性，并且该方法包括制备中空二氧化硅微球的混合物的步骤 ，硼硅酸盐玻璃粉末和陶瓷粉末作为主要成分，向混合物中加入增塑剂，粘合剂和溶剂，捏合混合物并将其形成生片，其中控制中空二氧化硅微球的壳厚度，使得 中空二氧化硅微球的比重近似等于溶剂的比重，其中使用含有铝作为构成元素的无机物质如氧化铝，莫来石或氮化铝作为形成生片的陶瓷粉末; 或者该方法还包括煅烧所得生片的步骤。

公开(公告)号：US08404134B2

公开(公告)日：2013-03-26

申请号：US12366874

申请日：2009-02-06

申请人： Yoshihiko Imanaka ,  Hitoshi Yamada ,  Hideyuki Amada

发明人： Yoshihiko Imanaka ,  Hitoshi Yamada ,  Hideyuki Amada

IPC分类号： B31D3/00

CPC分类号： C25F3/04 ,  H01G9/045 ,  H01G9/055 ,  Y10T428/24926 ,  Y10T428/31678

摘要： A method of manufacturing a electrode foil composed of a valve metal layer of a first valve metal and a metal foil of a second valve metal supporting the valve metal layer, the method includes coating fine particles of the first valve metal with a resin to form composite fine particles, forming the composite fine particles into an aerosol, jetting the aerosol to the metal foil in an atmosphere under a reduced pressure, depositing the composite fine particles onto the metal foil to form a aerosol deposition layer, and removing selectively the resin from the aerosol deposition layer to form the valve metal layer.

摘要翻译： 一种制造由第一阀金属的阀金属层和支撑阀金属层的第二阀金属的金属箔构成的电极箔的方法，该方法包括用树脂涂覆第一阀金属的细颗粒以形成复合物 细小颗粒，将复合细颗粒形成气雾剂，在减压气氛下将气溶胶喷射到金属箔上，将复合细颗粒沉积到金属箔上以形成气溶胶沉积层，并从 气溶胶沉积层形成阀门金属层。

公开(公告)号：US08080875B2

公开(公告)日：2011-12-20

申请号：US11968341

申请日：2008-01-02

申请人： Yoshihiko Imanaka

发明人： Yoshihiko Imanaka

IPC分类号： H01L23/48

CPC分类号： H05K3/4614 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/102 ,  H05K3/4069 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0245 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1344 ,  H05K2203/1461 ,  H01L2224/0401

摘要： An interconnection substrate including therein one or more resin layers, each of the resin layers including therein a via-hole penetrating from a top surface to a bottom surface of the resin layer. A via-plug of metal particles is formed in the via-hole. Each of the metal particles has a flattened shape generally parallel to a plane of the resin layer.

摘要翻译： 一种其中包括一个或多个树脂层的互连基板，每个树脂层包括从树脂层的顶表面延伸到底表面的通孔。 在通孔中形成金属颗粒的通孔。 每个金属颗粒具有大致平行于树脂层的平面的扁平形状。

公开(公告)号：US20100165544A1

公开(公告)日：2010-07-01

申请号：US12580708

申请日：2009-10-16

申请人： Yoshihiko Imanaka ,  Minoru Funahashi ,  Hidetoshi Ishizuka ,  Katsuharu Yamada

发明人： Yoshihiko Imanaka ,  Minoru Funahashi ,  Hidetoshi Ishizuka ,  Katsuharu Yamada

IPC分类号： H01G9/04 ,  H01G9/045 ,  H01G9/07 ,  H01G9/042 ,  H01G9/035 ,  H01G9/025 ,  H01G9/028 ,  B32B15/02 ,  B05D3/00 ,  B05D5/12 ,  C25F3/04

CPC分类号： H01G9/045 ,  H01G9/02 ,  H01G9/028 ,  H01G9/055 ,  H01G9/151 ,  H01G11/48 ,  Y02E60/13 ,  Y10T428/12049 ,  Y10T428/12139

摘要： An electrode foil includes a structure a structure in which metal particles and ceramic particles, which primarily include at least one of valve metal particles having a dielectric constant and ceramic particles, are deposited on a surface of a metal foil.

摘要翻译： 电极箔包括结构，其中主要包括具有介电常数的阀金属颗粒和陶瓷颗粒中的至少一种的金属颗粒和陶瓷颗粒沉积在金属箔的表面上。