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    Composition for the formation of ceramic vias
    3.
    发明授权
    Composition for the formation of ceramic vias 失效
    用于形成陶瓷通孔的组成

    公开(公告)号：US5443786A

    公开(公告)日：1995-08-22

    申请号：US700163

    申请日：1991-12-17

    申请人： Hiromitsu Yokoyama ,  Koji Omote ,  Hitoshi Suzuki ,  Mineharu Tsukada ,  Nobuo Kamehara ,  Koichi Niwa

    发明人： Hiromitsu Yokoyama ,  Koji Omote ,  Hitoshi Suzuki ,  Mineharu Tsukada ,  Nobuo Kamehara ,  Koichi Niwa

    IPC分类号： H01B1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  B22F7/00 ,  H01B1/04

    CPC分类号： H05K3/4061 ,  H01B1/02 ,  H01B1/023 ,  H01B1/026 ,  H01L21/486 ,  H01L23/49866 ,  H01L23/49883 ,  H05K1/092 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2203/121 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49165

    摘要： A composition for the formation of vias on a ceramic substrate, the composition including (a) at least one powder containing copper, gold, silver, tungsten, molybdenum, nickel, palladium, platinum, aluminium, or an alloy thereof; and (b) 5 to 40 wt %, based on the weight of the powder in the composition, of one or more of an organosilicic compound, an organoaluminium compound, an organozirconium compound, and an organomagnesium compound. A further embodiment of a composition for the formation of vias includes (a) and (b) above and, in addition, (c) a binder material including a cellulose derivative or a heat decomposable polymethamethyl acrylate binder, and (d) a high boiling point organic solvent. The invention also includes a method for use in the formation of vias on a substrate having perforating holes therein. Such a substrate could be a glass ceramic composite substrate, an alumina substrate, a magnesia substrate, a zirconia substrate, or green sheets thereof. The holes are filled and the substrate is calcinated with the composition.

    摘要翻译： PCT No.PCT / JP90 / 01202 Sec。 371 1991年12月17日第 102（e）1991年12月17日PCT PCT 1990年9月19日PCT公布。 公开号WO91 / 04650 1991年4月4日。用于在陶瓷基材上形成通孔的组合物，所述组合物包含（a）至少一种含有铜，金，银，钨，钼，镍，钯，铂，铝或 合金; 和（b）基于组合物中粉末重量的5-40重量％的一种或多种有机硅化合物，有机铝化合物，有机锆化合物和有机镁化合物。 用于形成通孔的组合物的另一实施方案包括上述（a）和（b），另外，（c）包含纤维素衍生物或可热分解的聚甲基丙烯酸甲酯粘合剂的粘合剂材料，和（d）高沸点 有机溶剂。 本发明还包括用于在其中具有穿孔的基板上形成通孔的方法。 这样的基板可以是玻璃陶瓷复合基板，氧化铝基板，氧化镁基板，氧化锆基板或其生坯片。 填充孔，并用该组合物煅烧底物。

    Process of producing multiple-layer glass-ceramic circuit board
    5.
    发明授权
    Process of producing multiple-layer glass-ceramic circuit board 失效
    生产多层玻璃陶瓷电路板的工艺

    公开(公告)号：US5287620A

    公开(公告)日：1994-02-22

    申请号：US894984

    申请日：1992-06-08

    申请人： Hitoshi Suzuki ,  Wataru Yamagishi ,  Koichi Niwa ,  Kaoru Hashimoto ,  Nobuo Kamehara

    发明人： Hitoshi Suzuki ,  Wataru Yamagishi ,  Koichi Niwa ,  Kaoru Hashimoto ,  Nobuo Kamehara

    IPC分类号： H01L23/15 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10

    CPC分类号： H01L21/486 ,  H01L21/4867 ,  H05K3/4061 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0266 ,  H05K2203/1126 ,  H05K2203/1476 ,  H05K3/1291 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49165

    摘要： A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.

    摘要翻译： 一种制造具有铜导体的多层玻璃 - 陶瓷电路板的方法，包括以下步骤：在玻璃 - 陶瓷生片中形成通孔，该通孔将形成通孔接触点; 用与陶瓷粉末混合的铜粉末的粉末混合物填充通孔，所述铜粉末和陶瓷粉末具有提供与玻璃 - 陶瓷生片相当或更大的填充密度的粉末粒度，当填充在 通孔 在具有填充有粉末混合物的通孔的生片上印刷导体膏，以在生片上形成电路导体图案; 层叠形成有导体图案的多个生片，以形成层压体; 加热层压体，从而除去粘合剂，预热层压体; 并开火初烧机构。

    Manufacturing method for multilayer ceramic substrate
    6.
    发明授权
    Manufacturing method for multilayer ceramic substrate 失效
    多层陶瓷基板的制造方法

    公开(公告)号：US5549778A

    公开(公告)日：1996-08-27

    申请号：US519178

    申请日：1995-08-25

    申请人： Hiromitsu Yokoyama ,  Katsuto Takeuchi ,  Koji Soekawa ,  Kenichiro Abe ,  Syouichi Hattori ,  Hitoshi Suzuki ,  Nobuhide Okada

    发明人： Hiromitsu Yokoyama ,  Katsuto Takeuchi ,  Koji Soekawa ,  Kenichiro Abe ,  Syouichi Hattori ,  Hitoshi Suzuki ,  Nobuhide Okada

    IPC分类号： H05K3/40 ,  H05K3/46 ,  B32B31/00

    CPC分类号： B32B38/1841

    摘要： A manufacturing method for a multilayer ceramic substrate superior in adhesion between the substrate and thick film pads formed on the surface of the substrate. Copper paste is screen-printed on a glass-ceramics green sheet for forming a surface layer to form a plurality of surface thick film pads respectively connected to a plurality of vias formed in the green sheet. Each of the surface thick film pads is partially covered with a dielectric material. Then, a plurality of green sheets for forming inner layers and the surface-layer green sheet are laminated together so that the surface-layer green sheet forms an uppermost layer. The laminated sheets are bonded integrally with each other by applying heat and pressure, and are then fired at a predetermined temperature for a predetermined time.

    摘要翻译： 一种层叠陶瓷基板的制造方法，其特征在于，在基板表面上形成的基板和厚膜焊盘之间的粘合性优异。 将铜膏丝网印刷在用于形成表面层的玻璃陶瓷生片上，以形成分别连接到在生片中形成的多个通孔的多个表面厚膜垫。 每个表面厚膜垫部分地被电介质材料覆盖。 然后，将多个用于形成内层的生片和表面层生片层压在一起，使得表面层生片形成最上层。 通过施加热和压力将层叠片彼此一体地接合，然后在预定温度下烧制预定时间。

    Optical coupling member and optical connector using the same, and optical coupling member holding member
    7.
    发明授权
    Optical coupling member and optical connector using the same, and optical coupling member holding member 有权
    光耦合构件和使用其的光连接器，以及光耦合构件保持构件

    公开(公告)号：US09372313B2

    公开(公告)日：2016-06-21

    申请号：US14347490

    申请日：2012-05-23

    申请人： Hitoshi Suzuki ,  Naohiko Moriya ,  Kiyoshi Iwamoto

    发明人： Hitoshi Suzuki ,  Naohiko Moriya ,  Kiyoshi Iwamoto

    IPC分类号： G02B6/42 ,  G02B6/32

    CPC分类号： G02B6/322 ,  G02B6/4204 ,  G02B6/423 ,  G02B6/424 ,  G02B6/4244

    摘要： An optical coupling member includes an optical fiber (13), a holder (11) that holds the optical fiber inserted from an insertion hole (11a) formed at one end, and a lens such as a collimator lens (12) accommodated in an accommodation section (11c) formed at the other end of the holder (11), the optical coupling member performing positioning by causing at least one of the lens and the end face of the optical fiber (13) to come into contact with an abutting surface (11e1, 11e2) formed in the vicinity of the accommodation section (11c) by providing a recess (11e) on an outer circumference near the accommodation section (11c) of the holder (11), in which a plurality of the recesses (11e) are provided on an identical plane orthogonal to an insertion direction of the optical fiber (13).

    摘要翻译： 光耦合构件包括光纤（13），保持器（11），保持器（11），其保持从形成在一端的插入孔（11a）插入的光纤，以及容纳在容纳部中的准直透镜（12）的透镜 形成在保持器（11）的另一端的部分（11c），光耦合部件通过使光纤（13）的透镜和端面中的至少一个与邻接表面接触而进行定位（ 11e），在所述保持器（11）的容纳部（11c）附近的外周设置有凹部（11e），形成在所述收纳部（11c）附近，所述凹部（11e） 设置在与光纤（13）的插入方向正交的同一平面上。