公开(公告)号：US20100032336A1

公开(公告)日：2010-02-11

申请号：US12491831

申请日：2009-06-25

申请人： Hiromitsu Yokoyama ,  Katsuyuki Fukuda

发明人： Hiromitsu Yokoyama ,  Katsuyuki Fukuda

IPC分类号： B65D81/02

CPC分类号： B65D81/052

摘要： A package member includes a first cushioning member and a bottom supporting member that supports the first cushioning member. The first cushioning member includes concave portions in which bottoms of a plurality of packaged articles are fitted, and a convex portion that is inserted between the packaged articles. A predetermined space is formed at backsides of the concave portions. The bottom supporting member is arranged in the predetermined space in contact with the backside of any of the concave portions of the first cushioning member and is inflatable when filled with air.

摘要翻译： 包装件包括第一缓冲构件和支撑第一缓冲构件的底部支撑构件。 第一缓冲构件包括多个封装物品的底部嵌合的凹部和插入在包装物品之间的凸部。 在凹部的背面形成规定的空间。 底部支撑构件布置在与第一缓冲构件的任何凹部的背面接触的预定空间中，并且当充满空气时可充气。

公开(公告)号：US5081070A

公开(公告)日：1992-01-14

申请号：US268195

申请日：1989-01-30

申请人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

发明人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

IPC分类号： H01L39/02 ,  B32B18/00 ,  C01G1/00 ,  C01G3/00 ,  C04B35/00 ,  C04B35/45 ,  H01B12/00 ,  H01B13/00 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L39/06 ,  H01L39/24 ,  H05K1/09

CPC分类号： H01L21/4846 ,  B32B18/00 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B37/005 ,  C04B37/006 ,  H01L21/76891 ,  H01L23/49888 ,  H01L39/2429 ,  C04B2235/483 ,  C04B2235/6567 ,  C04B2237/06 ,  C04B2237/066 ,  C04B2237/09 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/59 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

摘要翻译： 提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。 通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。 使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

公开(公告)号：US4761325A

公开(公告)日：1988-08-02

申请号：US762310

申请日：1985-08-02

申请人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

发明人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

IPC分类号： C03C10/00 ,  C04B35/14 ,  C04B35/16 ,  C04B35/18 ,  C04B35/632 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4667 ,  C03C10/0009 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H05K1/0306 ,  H05K3/46 ,  H05K3/4629 ,  C03C2214/04 ,  C03C2214/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  H05K2203/086 ,  H05K2203/088 ,  H05K2203/1126 ,  H05K3/1291 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252

摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

公开(公告)号：US4313026A

公开(公告)日：1982-01-26

申请号：US88467

申请日：1979-10-26

申请人： Seiichi Yamada ,  Nobuo Kamehara ,  Kaoru Hashimoto ,  Hiromitsu Yokoyama ,  Koichi Niwa ,  Kyohei Murakawa

发明人： Seiichi Yamada ,  Nobuo Kamehara ,  Kaoru Hashimoto ,  Hiromitsu Yokoyama ,  Koichi Niwa ,  Kyohei Murakawa

IPC分类号： B32B15/04 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K3/4664 ,  H01L23/15 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011

摘要： A multilayer circuit board (10) for putting semiconductor devices thereon consists of conductor layers (6, 60, 61, 62, 63) made of a metal selected from the group consisting of Au, Ag, Cu and an alloy thereof, insulating material (2, 7) made of glass-ceramic and an alumina sintered plate (1). The glass-ceramic is comprised of borosilicate glass and alumina and has a low dielectric constant and a thermal expansion coefficient approaching that of the semiconductor devices. The alumina sintered plate (1) is placed between the ground and supply voltage conductor layers (62, 63) and the signal conductor layers (60).

摘要翻译： 用于将半导体器件放置在其上的多层电路板（10）由选自Au，Ag，Cu及其合金的金属制成的导体层（6,60,61,62,63），绝缘材料（ 2，7）由玻璃陶瓷和氧化铝烧结板（1）制成。 玻璃陶瓷由硼硅酸盐玻璃和氧化铝组成，并且具有接近半导体器件的低介电常数和热膨胀系数。 氧化铝烧结板（1）放置在接地电源电压导体层（62,63）和信号导体层（60）之间。

公开(公告)号：US5549778A

公开(公告)日：1996-08-27

申请号：US519178

申请日：1995-08-25

申请人： Hiromitsu Yokoyama ,  Katsuto Takeuchi ,  Koji Soekawa ,  Kenichiro Abe ,  Syouichi Hattori ,  Hitoshi Suzuki ,  Nobuhide Okada

发明人： Hiromitsu Yokoyama ,  Katsuto Takeuchi ,  Koji Soekawa ,  Kenichiro Abe ,  Syouichi Hattori ,  Hitoshi Suzuki ,  Nobuhide Okada

IPC分类号： H05K3/40 ,  H05K3/46 ,  B32B31/00

CPC分类号： B32B38/1841

摘要： A manufacturing method for a multilayer ceramic substrate superior in adhesion between the substrate and thick film pads formed on the surface of the substrate. Copper paste is screen-printed on a glass-ceramics green sheet for forming a surface layer to form a plurality of surface thick film pads respectively connected to a plurality of vias formed in the green sheet. Each of the surface thick film pads is partially covered with a dielectric material. Then, a plurality of green sheets for forming inner layers and the surface-layer green sheet are laminated together so that the surface-layer green sheet forms an uppermost layer. The laminated sheets are bonded integrally with each other by applying heat and pressure, and are then fired at a predetermined temperature for a predetermined time.

摘要翻译： 一种层叠陶瓷基板的制造方法，其特征在于，在基板表面上形成的基板和厚膜焊盘之间的粘合性优异。 将铜膏丝网印刷在用于形成表面层的玻璃陶瓷生片上，以形成分别连接到在生片中形成的多个通孔的多个表面厚膜垫。 每个表面厚膜垫部分地被电介质材料覆盖。 然后，将多个用于形成内层的生片和表面层生片层压在一起，使得表面层生片形成最上层。 通过施加热和压力将层叠片彼此一体地接合，然后在预定温度下烧制预定时间。

公开(公告)号：US5443786A

公开(公告)日：1995-08-22

申请号：US700163

申请日：1991-12-17

申请人： Hiromitsu Yokoyama ,  Koji Omote ,  Hitoshi Suzuki ,  Mineharu Tsukada ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Hiromitsu Yokoyama ,  Koji Omote ,  Hitoshi Suzuki ,  Mineharu Tsukada ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H01B1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  B22F7/00 ,  H01B1/04

CPC分类号： H05K3/4061 ,  H01B1/02 ,  H01B1/023 ,  H01B1/026 ,  H01L21/486 ,  H01L23/49866 ,  H01L23/49883 ,  H05K1/092 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2203/121 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49165

摘要： A composition for the formation of vias on a ceramic substrate, the composition including (a) at least one powder containing copper, gold, silver, tungsten, molybdenum, nickel, palladium, platinum, aluminium, or an alloy thereof; and (b) 5 to 40 wt %, based on the weight of the powder in the composition, of one or more of an organosilicic compound, an organoaluminium compound, an organozirconium compound, and an organomagnesium compound. A further embodiment of a composition for the formation of vias includes (a) and (b) above and, in addition, (c) a binder material including a cellulose derivative or a heat decomposable polymethamethyl acrylate binder, and (d) a high boiling point organic solvent. The invention also includes a method for use in the formation of vias on a substrate having perforating holes therein. Such a substrate could be a glass ceramic composite substrate, an alumina substrate, a magnesia substrate, a zirconia substrate, or green sheets thereof. The holes are filled and the substrate is calcinated with the composition.

摘要翻译： PCT No.PCT / JP90 / 01202 Sec。 371 1991年12月17日第 102（e）1991年12月17日PCT PCT 1990年9月19日PCT公布。 公开号WO91 / 04650 1991年4月4日。用于在陶瓷基材上形成通孔的组合物，所述组合物包含（a）至少一种含有铜，金，银，钨，钼，镍，钯，铂，铝或 合金; 和（b）基于组合物中粉末重量的5-40重量％的一种或多种有机硅化合物，有机铝化合物，有机锆化合物和有机镁化合物。 用于形成通孔的组合物的另一实施方案包括上述（a）和（b），另外，（c）包含纤维素衍生物或可热分解的聚甲基丙烯酸甲酯粘合剂的粘合剂材料，和（d）高沸点 有机溶剂。 本发明还包括用于在其中具有穿孔的基板上形成通孔的方法。 这样的基板可以是玻璃陶瓷复合基板，氧化铝基板，氧化镁基板，氧化锆基板或其生坯片。 填充孔，并用该组合物煅烧底物。

公开(公告)号：US5286713A

公开(公告)日：1994-02-15

申请号：US64668

申请日：1993-05-21

申请人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

发明人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

IPC分类号： B32B18/00 ,  C04B35/45 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L39/24 ,  B05D3/02 ,  B05D5/12

CPC分类号： H01L21/4846 ,  B32B18/00 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B37/005 ,  H01L21/76891 ,  H01L23/49888 ,  H01L39/2429 ,  C04B2235/6567 ,  C04B2235/6585 ,  C04B2237/066 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/592 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/703 ,  Y10S505/741

摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

摘要翻译： 提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。 通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。 使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

公开(公告)号：US4954480A

公开(公告)日：1990-09-04

申请号：US197583

申请日：1988-04-27

申请人： Yoshihiko Imanaka ,  Takato Machi ,  Kazunori Yamanaka ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Yoshihiko Imanaka ,  Takato Machi ,  Kazunori Yamanaka ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H05K3/46 ,  B32B18/00 ,  C04B35/45 ,  C04B35/634 ,  C04B35/636 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/538 ,  H01L39/24

CPC分类号： C04B35/63416 ,  B32B18/00 ,  C04B35/45 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B35/634 ,  C04B35/63424 ,  C04B35/6365 ,  C04B35/645 ,  H01L21/4857 ,  H01L21/76891 ,  H01L23/49888 ,  H01L23/5383 ,  H01L39/2429 ,  H01L39/2464 ,  C04B2235/6567 ,  C04B2235/663 ,  C04B2237/343 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10T428/23 ,  Y10T428/239 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A multi-layer superconducting circuit substrate, including insulating layers, and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material are preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.

公开(公告)号：US4679320A

公开(公告)日：1987-07-14

申请号：US801783

申请日：1985-11-26

申请人： Yoshihiko Imanaka ,  Hiromi Ogawa ,  Mineharu Tsukada ,  Etsuro Udagawa ,  Kazuaki Kurihara ,  Hiromitsu Yokoyama ,  Nobuo Kamehara

发明人： Yoshihiko Imanaka ,  Hiromi Ogawa ,  Mineharu Tsukada ,  Etsuro Udagawa ,  Kazuaki Kurihara ,  Hiromitsu Yokoyama ,  Nobuo Kamehara

IPC分类号： C04B35/622 ,  C04B35/632 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  H01K3/22

CPC分类号： H01L21/4867 ,  H05K1/0306 ,  H05K1/092 ,  Y10T29/49144 ,  Y10T29/49158

摘要： A process for producing a multilayer ceramic circuit board with copper including the steps of:forming green sheets by doctoring a slurry which includes 100 parts by weight of glass ceramic particles, 5 to 20 parts by weight of a thermally depolymerizable resin binder, 2 to 10 parts by weight of a plasticizer, and up to 2 parts by weight of a fatty acid ethylene oxide adduct type, deflorculant. The glass ceramic includes 20 to 70% by weight of alumina, and 30 to 80% by weight of SiO.sub.2 -B.sub.2 O.sub.3 glass. The process further includes the steps of forming via holes through the green sheets, screen-printing a copper paste on the green sheets, and laminating the green sheets, thereby forming a multilayer structure and firing the multilayer structure in a non-oxidizable atmosphere.

摘要翻译： 一种用于制造具有铜的多层陶瓷电路板的方法，包括以下步骤：通过将包含100重量份的玻璃陶瓷颗粒，5至20重量份的热解聚树脂粘合剂，2至10重量份的浆料 重量份的增塑剂和至多2重量份的脂肪酸环氧乙烷加合物类型的脱氯剂。 玻璃陶瓷包含20至70重量％的氧化铝和30至80重量％的SiO 2 -B 2 O 3玻璃。 该方法还包括以下步骤：在生片上形成通孔，在生片上丝网印刷铜膏，并层压生片，由此形成多层结构，并在不可氧化的气氛中烧结多层结构。

公开(公告)号：US4346516A

公开(公告)日：1982-08-31

申请号：US252214

申请日：1981-04-08

申请人： Kishio Yokouchi ,  Hiromi Ogawa ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa ,  Kyohei Murakawa

发明人： Kishio Yokouchi ,  Hiromi Ogawa ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa ,  Kyohei Murakawa

IPC分类号： H05K3/46 ,  H01L21/48 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/00 ,  H05K3/36

CPC分类号： H05K3/4046 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/5384 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2203/0195 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49153 ,  Y10T29/49694

摘要： A method of forming a ceramic circuit substrate allowing mounting of high integration density semiconductor elements. The method provides a multilayered ceramic circuit substrate having via holes formed with high accuracy and high integration density wiring patterns by forming metallic conductive balls to connect the conductive wiring patterns of upper and lower layers; a ball arranging plate having many holes placing on a green sheet uniformly in close contact; filling the holes of the plate with the embedding the conductive balls by pressure into the green sheet; and thereafter baking the green sheet individually or in a stacked layered arrangement.

摘要翻译： 一种形成陶瓷电路基板的方法，允许安装高集成度密度的半导体元件。 该方法通过形成金属导电球以连接上层和下层的导电布线图案，提供具有形成有高精度和高集成度的布线图案的通孔的多层陶瓷电路基板; 具有多个孔的球排列板，其均匀地放置在生片上; 通过压力将导电球嵌入生片中来填充板的孔; 然后单独地或以堆叠的层叠布置烘烤生片。