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    Microwave plasma processing device
    2.
    发明授权
    Microwave plasma processing device 有权
    微波等离子体处理装置

    公开(公告)号：US08680424B2

    公开(公告)日：2014-03-25

    申请号：US12457497

    申请日：2009-06-12

    申请人： Akira Kobayashi ,  Kouji Yamada ,  Hideo Kurashima ,  Tsunehisa Namiki ,  Takeshi Aihara ,  Yasunori Onozawa

    发明人： Akira Kobayashi ,  Kouji Yamada ,  Hideo Kurashima ,  Tsunehisa Namiki ,  Takeshi Aihara ,  Yasunori Onozawa

    IPC分类号： B23K10/00

    CPC分类号： H01J37/3244 ,  C23C16/045 ,  C23C16/45568 ,  C23C16/45578 ,  C23C16/511 ,  H01J37/32192 ,  H05H1/46 ,  H05H2001/463

    摘要： A microwave plasma processing device includes a fixing device for fixing a substrate as a processing target on a central axis in a plasma processing chamber, a exhausting device for depressurizing an inside and outside of the substrate, a metal processing gas supply member which is present in the substrate and forms a reentrant cylindrical resonating system along with the plasma processing chamber, and a microwave introducing device for introducing a microwave into the plasma processing chamber to perform processing. A microwave sealing member is provided at a substrate-holding portion of the fixing device, and a connection position of the microwave introducing device is located at a node of an electric field intensity distribution formed on the processing gas supply member by introducing the microwave.

    摘要翻译： 微波等离子体处理装置包括：固定装置，用于将作为加工对象的基板固定在等离子体处理室的中心轴上;排气装置，用于对基板的内部和外部进行减压;金属加工气体供应部件， 基板并与等离子体处理室一起形成可折入的圆柱形谐振系统，以及微波引入装置，用于将微波引入等离子体处理室以进行处理。 微波密封件设置在定影装置的基板保持部分处，并且微波引入装置的连接位置位于通过引入微波而形成在处理气体供给构件上的电场强度分布的节点处。

    Electronic device with power generation function
    3.
    发明授权
    Electronic device with power generation function 失效
    具有发电功能的电子装置

    公开(公告)号：US08664910B2

    公开(公告)日：2014-03-04

    申请号：US12447518

    申请日：2007-10-26

    申请人： Kouji Yamada

    发明人： Kouji Yamada

    IPC分类号： H01M10/44

    CPC分类号： H01L31/04 ,  G06F3/0202 ,  H01H13/83 ,  H01H2219/011 ,  H01H2219/062 ,  H01L31/035281 ,  H02J7/355 ,  H04M1/21 ,  H04M1/23 ,  Y02E10/50

    摘要： The present invention provides an electronic device with a secondary cell which has a simple structure and is capable of extending a continuous operating period by compensating for power consumption through effective utilization of a light source and external light. On a rear face of a casing 201 of a mobile phone, a light source 204, a conductive key sheet 203 having a plurality of operation keys 206 and a solar battery 202 are layered. Each of the operation keys 206 is exposed outwards through a through-hole 208 of the solar battery 202 and a through-hole 207 of the casing 201. The key sheet 203 guides the light from the light source 204 and the light from the outside of the casing 201 to the solar battery 202 and guides the light from the light source 204 onto the operation key 206. The solar battery 202 receives the light from the light source 204 and the outside of the casing 201 through the key sheet 203 and converts the light into electric energy to be charged into a secondary cell.

    摘要翻译： 本发明提供一种具有二次电池的电子器件，其具有简单的结构，并且能够通过有效利用光源和外部光来补偿功率消耗来延长连续工作周期。 在移动电话的壳体201的后表面上分层有光源204，具有多个操作键206的导电键片203和太阳能电池202。 每个操作键206通过太阳能电池202的通孔208和壳体201的通孔207向外露出。按键板203将来自光源204的光和来自外部的光 壳体201到太阳能电池202，并将来自光源204的光引导到操作键206上。太阳能电池202通过按键板203从光源204和外壳201的外部接收光，并将 将光转换成电能以充入二次电池。

    Electronic component mounting structure
    5.
    发明授权
    Electronic component mounting structure 有权
    电子元件安装结构

    公开(公告)号：US08325489B2

    公开(公告)日：2012-12-04

    申请号：US12941265

    申请日：2010-11-08

    申请人： Masaaki Togashi ,  Kouji Yamada

    发明人： Masaaki Togashi ,  Kouji Yamada

    IPC分类号： H05K7/00

    CPC分类号： H05K1/0231 ,  H05K1/112 ,  H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10674 ,  Y02P70/611

    摘要： An electronic component mounting structure which can reduce the ESL while saving the space when mounting electronic components is provided. A first electronic component 7 is electrically connected to surface-mounted electrode parts 11A, 12A at metal terminals 26, 27 such that a first capacitor 24 having a greater capacitance and a mounting surface 4a of a multilayer substrate 4 are separated from each other. A second electronic component 8 is arranged between the first capacitor 24 and the mounting surface 4a and electrically connected to surface-mounted electrode parts 12B, 11B at second terminal electrodes 32, 33. The second electronic component 8 overlaps the first capacitor 24 when seen in the laminating direction. The first electronic component 7 is mounted to the multilayer substrate 4 such that first terminal electrodes 22, 23 oppose each other in a predetermined direction D1. The second electronic component 8 is mounted to the multilayer substrate 4 such that the second terminal electrodes 32, 33 oppose each other in the predetermined direction D1.

    摘要翻译： 提供一种电子部件安装结构，其能够在安装电子部件的同时节省空间的同时减小ESL。 第一电子部件7在金属端子26,27处电连接到表面安装电极部分11A，12A，使得具有较大电容的第一电容器24和多层基板4的安装表面4a彼此分离。 第二电子部件8布置在第一电容器24和安装表面4a之间，并且在第二端子电极32,33处与表面安装的电极部分12B，11B电连接。第二电子部件8与第一电容器24重叠， 层压方向。 第一电子部件7安装到多层基板4，使得第一端子电极22,23在预定方向D1上彼此相对。 第二电子部件8安装到多层基板4，使得第二端子电极32,33在预定方向D1上彼此相对。

    Circuit for following up synchronization of a spread-coded signal by power comparison and phase adjustment
    6.
    发明授权
    Circuit for following up synchronization of a spread-coded signal by power comparison and phase adjustment 失效
    用于通过功率比较和相位调整跟踪扩展编码信号的同步电路

    公开(公告)号：US07471718B2

    公开(公告)日：2008-12-30

    申请号：US11142261

    申请日：2005-06-02

    申请人： Kouji Yamada

    发明人： Kouji Yamada

    IPC分类号： H04B1/00

    CPC分类号： H04B1/7085 ,  H04B1/709

    摘要： A synchronous follow-up circuit carries out correlation operation with a spread code on a receive signal, generated from a received signal in a symbol timing generator, by three symbol correlators, one for shifting the phase forward with respect to a symbol timing signal, another for synchronizing with the same and remaining one for shifting the same backward. Correlation power operators calculate respective correlation powers, and a correlation power comparator compares them with each other. The symbol timing generator adjusts the receive signal in phase on the basis of the comparison result. On the basis of the result of determining the correlation power in a correlation power decision circuit, the correlation powers are nullified, thereby preventing out-of-synchronization otherwise caused by a received signal including noise.

    摘要翻译： 同步跟随电路通过三个符号相关器对符号定时发生器中的接收信号产生的接收信号上的扩展码执行相关操作，一个用于相对于符号定时信号向前移位，另一个 用于与相同的和剩余的一个用于同步向后移动。 相关功率运算器计算各自的相关功率，相关功率比较器将它们相互比较。 符号定时发生器基于比较结果同步地调整接收信号。 基于确定相关功率判定电路中的相关功率的结果，相关功率无效，从而防止由包括噪声的接收信号引起的失步。

    Microwave plasma processing method
    7.
    发明授权
    Microwave plasma processing method 有权
    微波等离子体处理方法

    公开(公告)号：US07170027B2

    公开(公告)日：2007-01-30

    申请号：US10550509

    申请日：2004-04-12

    申请人： Hideo Kurashima ,  Akira Kobayashi ,  Kouji Yamada ,  Tsunehisa Namiki

    发明人： Hideo Kurashima ,  Akira Kobayashi ,  Kouji Yamada ,  Tsunehisa Namiki

    IPC分类号： B23K9/00

    CPC分类号： H01J37/32284 ,  C23C16/045 ,  C23C16/511 ,  H01J37/32192 ,  H05B6/80

    摘要： A microwave plasma processing method is provided which enables a uniform thin film layer to be formed on a surface to be processed and which enables a short time processing. In the microwave plasma processing method, microwaves are introduced into a plasma processing chamber 1, and a processing gas is transformed into plasma to form a thin film layer on a base substance 13 disposed in the plasma processing chamber 13, and the method comprises: fixing the base substance 13 coaxially with a central axis of the plasma processing chamber 1; setting a standing wave mode of the microwaves in the plasma processing chamber to a TE mode or a TEM mode from a mouth portion 131 to a body portion 133 of the base substance; and setting a mode having both the TE mode and a TM mode in a bottom portion 132 of the base substance.

    摘要翻译： 提供一种微波等离子体处理方法，其能够在待处理的表面上形成均匀的薄膜层，并且能够进行短时间的处理。 在微波等离子体处理方法中，将微波引入等离子体处理室1中，将处理气体转化为等离子体，在设置在等离子体处理室13中的基体物质13上形成薄膜层，该方法包括：固定 基体13与等离子体处理室1的中心轴同轴; 将等离子体处理室中的微波的驻波模式从基体的口部131向主体部133设定为TE模式或TEM模式; 并且在基础物质的底部132中设置具有TE模式和TM模式的模式。

    Microwave plasma processing device and plasma processing gas supply member
    8.
    发明申请
    Microwave plasma processing device and plasma processing gas supply member 有权
    微波等离子体处理装置和等离子体处理气体供应部件

    公开(公告)号：US20060289401A1

    公开(公告)日：2006-12-28

    申请号：US10546283

    申请日：2004-03-11

    申请人： Akira Kobayashi ,  Kouji Yamada ,  Hideo Kurashima ,  Tsunehisa Namiki ,  Takeshi Aihara ,  Yasunori Onozawa

    发明人： Akira Kobayashi ,  Kouji Yamada ,  Hideo Kurashima ,  Tsunehisa Namiki ,  Takeshi Aihara ,  Yasunori Onozawa

    IPC分类号： B23K9/02

    CPC分类号： H01J37/3244 ,  C23C16/045 ,  C23C16/45568 ,  C23C16/45578 ,  C23C16/511 ,  H01J37/32192 ,  H05H1/46 ,  H05H2001/463

    摘要： A microwave plasma processing device and a gas supply member capable of forming a uniform thin film on a substrate to be processed. The microwave plasma processing device comprises fixing means of fixing a substrate to be processed onto the center axis in a plasma processing chamber, exhaust means of depressurizing the inside and outside of the substrate, a metal processing gas supply member present in the substrate and forming a reentrant cylindrical resonating system along with the plasma processing chamber, and microwave introducing means of introducing a microwave into the plasma processing chamber to process it, wherein a microwave sealing member is provided in a specified position of the substrate-holding portion of the fixing means, and the connection position of the microwave introducing means is set to a specified weak-field position out of a field intensity distribution formed in the interior of the plasma processing chamber.

    摘要翻译： 微波等离子体处理装置和能够在待加工基板上形成均匀薄膜的气体供给部件。 微波等离子体处理装置包括固定装置，将待处理基板固定在等离子体处理室中的中心轴上，对基板内部和外部进行减压的排气装置，存在于基板中的金属加工气体供应部件， 和等离子体处理室的可重入圆柱形谐振系统，以及将微波引入等离子体处理室进行处理的微波引入装置，其中微波密封构件设置在固定装置的基板保持部分的指定位置， 并且微波引入装置的连接位置被设置在形成在等离子体处理室内部的场强分布之外的指定的弱磁场位置。

    Vehicle bumper mounting structure
    10.
    发明授权
    Vehicle bumper mounting structure 失效
    车辆保险杠安装结构

    公开(公告)号：US5803514A

    公开(公告)日：1998-09-08

    申请号：US893997

    申请日：1997-07-17

    申请人： Akihiro Shibuya ,  Kouji Yamada ,  Yoshinobu Kanazawa

    发明人： Akihiro Shibuya ,  Kouji Yamada ,  Yoshinobu Kanazawa

    IPC分类号： B60R19/24 ,  B60R19/18 ,  B60R19/34

    CPC分类号： B60R19/18 ,  B60R19/24 ,  B60R2019/1826

    摘要： A structure for mounting a bumper beam 2 extending transversely of a vehicle covered with a bumper face 6 and mounted to a chassis 3 through a support 4, in which the bumper beam 2 is formed into a hollow body made of high-tension steel, the front end of the support 4 extends forward beyond the rear portion of the bumper beam 2. Thus, when a large collision energy works on the lightweight bumper beam formed into a hollow body made of high-tension steel, the collision energy is quickly transferred to the vehicle chassis through the front end of the beam.

    摘要翻译： 一种用于安装保险杠梁2的结构，该保险杠梁2横跨覆盖有保险杠表面6的车辆延伸并且通过支撑件4安装到底盘3，其中保险杠梁2形成为由高压钢制成的中空体， 支撑件4的前端向前延伸超​​过保险杠梁2的后部。因此，当大型碰撞能量作用在形成由高压钢制成的中空体的轻量级保险杠梁上时，碰撞能量迅速转移到 车辆底盘通过梁的前端。