摘要:
An apparatus for measuring a magnetic field is described, which comprises a core and an exciter coil for remagnetizing the core material. The remagnetizable core material is embodied as a layer or as multiple layers disposed at a distance from one another, and the core has a maximum total extension G where 2.5 mm≧G≧0.2 mm, a ratio of length to width that is greater than or equal to a value of twenty, and a thickness D where 2 μm≧D≧0.2 μm. Also described is a corresponding method for measuring a magnetic field.
摘要:
A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided.
摘要:
A magnetoresistive sensor element is provided, having a magnetoresistive layer system which, in top view, is at least regionally striated. The sensor element operates on the basis of the GMR effect and is constructed according to the spin valve principle, the striated layer system featuring a reference layer having a direction of magnetization substantially uninfluenced by a direction of an outer magnetic field acting on it. During operation, the sensor element provides a measuring signal which changes as a function of a measurement angle between the component of the field strength of the outer magnetic field lying in the plane of the layer system, and the direction of magnetization, and from which this measurement angle is able to be ascertained. In addition, observed in a top view of the striated layer system, the angle between the direction of magnetization in the absence of the outer magnetic field and the longitudinal direction of the striated layer system is set in such a way that in response to an influence of the outer magnetic field having a defined field strength, which is selected from a predefined work interval, the angle error of the layer system, as a function of this angle and the field strength, is minimal.
摘要:
An expansion of the functional scope of a hybrid integrated component including an MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC element having circuit components is provided. In this component, the circuit components of the ASIC element interact with the micromechanical structure of the MEMS element. The MEMS element is mounted on the ASIC element in such a way that the micromechanical structure of the MEMS element is situated in a cavity between the cap and the ASIC element. The ASIC element is additionally equipped with the circuit components of a magnetic sensor system. These circuit components are produced in or on the CMOS back-end stack of the ASIC element. The magnetic sensor system may thus be implemented without enlarging the chip area.
摘要:
A semiconductor chip having contact surfaces on an upper side parallel to the wafer plane has terminal pads on a terminal-pad side perpendicular to the upper side, each terminal pad being conductively connected to an assigned contact surface. This allows vertical mounting of the chip on a substrate and contacting with the aid of customary bonding techniques. A manufacturing method and two mounting methods are described.
摘要:
A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided.
摘要:
A magnetic sensor system (1) is provided that contains sensor elements (5, 6) that are sensitive to magnetic fields, the electrical properties of said sensor elements being modifiable according to a magnetic field that can be influenced by a mobile, passive transmitter element (8). The magnetic sensor system (1) includes two sensor elements (5, 6) in a gradiometer system, each of which is assigned to one of two permanent magnets (2, 3) having a predetermined separation. In terms of their dimensions, separation and position relative to the sensor elements (5, 6), the permanent magnets (2, 3) are located such that the offset of the output signal of the sensor elements (5, 6) is minimized in the gradiometer system.
摘要:
A magnetic sensor system (1) is provided that contains sensor elements (5, 6) that are sensitive to magnetic fields, the electrical properties of said sensor elements being modifiable according to a magnetic field that can be influenced by a mobile, passive transmitter element (8). The magnetic sensor system (1) includes two sensor elements (5, 6) in a gradiometer system, each of which is assigned to one of two permanent magnets (2, 3) having a predetermined separation. In terms of their dimensions, separation and position relative to the sensor elements (5, 6), the permanent magnets (2, 3) are located such that the offset of the output signal of the sensor elements (5, 6) is minimized in the gradiometer system.
摘要:
An expansion of the functional scope of a hybrid integrated component including an MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC element having circuit components is provided. In this component, the circuit components of the ASIC element interact with the micromechanical structure of the MEMS element. The MEMS element is mounted on the ASIC element in such a way that the micromechanical structure of the MEMS element is situated in a cavity between the cap and the ASIC element. The ASIC element is additionally equipped with the circuit components of a magnetic sensor system. These circuit components are produced in or on the CMOS back-end stack of the ASIC element. The magnetic sensor system may thus be implemented without enlarging the chip area.