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公开(公告)号：US20190200451A1
公开(公告)日：2019-06-27
申请号：US16328532
申请日：2016-09-29
Applicant: SASHA OSTER , Georgios Dogiamis , TELESPHOR KAMGAING , Adel Elsherbini , Shawna Liff , Aleksandar Aleksov , JOHANNA SWAN
Inventor： SASHA OSTER , Georgios Dogiamis , TELESPHOR KAMGAING , Adel Elsherbini , Shawna Liff , Aleksandar Aleksov , JOHANNA SWAN
CPC classification number: H05K1/0243 , H01L23/66 , H01L25/0655 , H01L25/117 , H01L25/16 , H01L25/165 , H05K1/141 , H05K3/366 , H05K2201/10545
Abstract: A millimeter wave (mm-wave) communication interface includes a first semiconductor package coupled to a first substrate and a second semiconductor package coupled to a second substrate. The second substrate may be coupled at approximately a 90° angle to the first substrate. The second semiconductor package may include a mm-wave die that modulates digital data on a high frequency microwave signal and a mm-wave launcher that launches the modulated high-frequency microwave signal into a waveguide member operably coupled to the second substrate. In such an implementation, the waveguide member may beneficially exit the second substrate along a longitudinal axis parallel to the principal plane of the first substrate. Advantageously, all high-frequency components are close coupled to the second substrate without the use of an intervening interface.
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公开(公告)号：US20170086510A1
公开(公告)日：2017-03-30
申请号：US14865440
申请日：2015-09-25
Applicant: Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Braxton Lathrop , Nadine L. Dabby , Feras Eid
Inventor： Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Braxton Lathrop , Nadine L. Dabby , Feras Eid
CPC classification number: A41D1/002 , G06F1/163 , H05K1/0283 , H05K1/0296 , H05K1/038 , H05K2201/0133 , H05K2201/09263 , H05K2201/10098 , H05K2201/10151
Abstract: Some forms relate to an electronic system that includes a textile. The electronic system includes a stretchable body that includes an integrated circuit that is configured to compute and communicate with an external device, wherein the stretchable body further includes at least one of (i) a power source that provides power to at least one of the electronic components; (ii) at least one sensor; (iii) a sensing node that receives signals from each sensor and sends signals to the integrated circuit; and (iv) an antenna that is configured to send and receive signals to and from the integrated circuit and the external device; and a textile attached to the stretchable body.
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公开(公告)号：US20190003854A1
公开(公告)日：2019-01-03
申请号：US15636599
申请日：2017-06-28
Applicant: Sasha Oster , Feras Eid , Thomas L. Sounart , Georgios C. Dogiamis
Inventor： Sasha Oster , Feras Eid , Thomas L. Sounart , Georgios C. Dogiamis
IPC: G01C25/00 , G01C19/5656
CPC classification number: G01C25/005 , G01C19/5656 , G01P1/00 , G01P1/023 , G01P15/0802 , G01P15/097 , G01P15/18 , G01P21/00 , G01P2015/084
Abstract: An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.
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公开(公告)号：US20180097268A1
公开(公告)日：2018-04-05
申请号：US15282050
申请日：2016-09-30
Applicant: Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
Inventor： Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
CPC classification number: H01P3/122 , H01P3/14 , H01P3/16 , H01P11/006
Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.
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公开(公告)号：US20170083051A1
公开(公告)日：2017-03-23
申请号：US14859894
申请日：2015-09-21
Applicant: Nadine L. Dabby , Lakshman Krishnamurthy , Braxton Lathrop , Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Tom L. Simmons
Inventor： Nadine L. Dabby , Lakshman Krishnamurthy , Braxton Lathrop , Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Tom L. Simmons
IPC: G06F1/16
CPC classification number: G06F1/1633 , H01L23/5385 , H01L23/5387 , H01L25/105 , H01L2225/1017 , H01L2225/1047 , H01L2924/00
Abstract: Some forms relate to a method of making a stretchable computing system. The method includes attaching a first set of conductive traces to a stretchable member; attaching a first electronic component to the first set of conductive traces; adding a first set of flexible conductors to the stretchable member such that the first set of flexible conductors is electrically connected to the first set of conductive traces; adding stretchable material to the stretchable member such that the first set of conductive traces is surrounded by the stretchable member; forming an opening in the stretchable member that exposes the first set of conductive traces; and attaching a second set of conductive traces to the stretchable member such that the second set of conductive traces fills the opening to form a via in the stretchable member that electrically connects the first set of conductive traces with the second set of conductive traces.
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Patent Agency Ranking
公开(公告)号：US20170287736A1
公开(公告)日：2017-10-05
申请号：US15085538
申请日：2016-03-30
Applicant: Sasha Oster , Adel A. Elsherbini , Joshua D. Heppner , Shawna M. Liff
Inventor： Sasha Oster , Adel A. Elsherbini , Joshua D. Heppner , Shawna M. Liff
CPC classification number: H01L23/315 , H01L21/56 , H01L23/3128 , H01L23/42 , H01L23/4334 , H01L23/467 , H01L2224/16227 , H01L2224/97 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/19105 , H01L2924/3511 , H01L2224/81
Abstract: Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial material. The electronics package that includes this sacrificial material is then overmolded, with little or no change needed in the overmolding process. Following overmolding, the sacrificial material is removed such as using a thermal, chemical, optical, or other decomposing process. This proposed use of sacrificial material allows for formation of complex 3-D cavities, and reduces or eliminates the need for precise material removal tolerances. Multiple instances of the sacrificial material may be removed simultaneously, replacing a serial drilling process with a parallel material removal manufacturing process.
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公开(公告)号：US20190190106A1
公开(公告)日：2019-06-20
申请号：US16328524
申请日：2016-09-30
Applicant: TELESPHOR KAMGAING , SASHA OSTER , Georgios Dogiamis , Adel Elsherbini , Shawna Liff , Aleksandar Aleksov , JOHANNA SWAN , Brandon Rawlings
Inventor： TELESPHOR KAMGAING , SASHA OSTER , Georgios Dogiamis , Adel Elsherbini , Shawna Liff , Aleksandar Aleksov , JOHANNA SWAN , Brandon Rawlings
Abstract: Generally, this disclosure provides apparatus and systems for coupling waveguides to a server package with a modular connector system, as well as methods for fabricating such a connector system. Such a system may be formed with connecting waveguides that turn a desired amount, which in turn may allow a server package to send a signal through a waveguide bundle in any given direction without bending waveguides.
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公开(公告)号：US20170172421A1
公开(公告)日：2017-06-22
申请号：US14971800
申请日：2015-12-16
Applicant: Nadine L. Dabby , Adel A. Elsherbini , Sasha Oster , Braxton Lathrop , Aleksandar Aleksov , Feras Eid
Inventor： Nadine L. Dabby , Adel A. Elsherbini , Sasha Oster , Braxton Lathrop , Aleksandar Aleksov , Feras Eid
IPC: A61B5/0205 , G06F3/01 , A61B5/00
CPC classification number: A61B5/0205 , A61B5/024 , A61B5/08 , A61B5/11 , A61B5/113 , A61B5/6804 , A61B2562/0219 , A61B2562/12 , G06F3/011 , G06F3/014 , G06F3/017
Abstract: A sensor assembly configured to monitor one or more physiological characteristics includes a deformable substrate. The deformable substrate includes a body side interface. Substrate conductive traces are coupled with the deformable substrate. Two or more physiological sensor elements are coupled with the deformable substrate. The two or more physiological sensor elements include at least first and second sensor elements. The first sensor element includes a first piezo element in a first orientation along the deformable substrate, the first sensor element is electrically coupled with the substrate conductive traces. The second sensor element includes a second piezo element in a second orientation along the deformable substrate different than the first orientation, the second sensor element is electrically coupled with the substrate conductive traces.
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公开(公告)号：US20180084643A1
公开(公告)日：2018-03-22
申请号：US15267872
申请日：2016-09-16
Applicant: Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
Inventor： Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
CPC classification number: H05K1/147 , A61B5/00 , A61B5/6833 , A61B2562/164 , A61B2562/166 , H05K1/0283 , H05K1/112 , H05K1/181 , H05K3/365 , H05K2201/10151 , H05K2201/10265 , H05K2201/10303 , H05K2201/10318
Abstract: A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.
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公开(公告)号：US20170094749A1
公开(公告)日：2017-03-30
申请号：US14866625
申请日：2015-09-25
Applicant: Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
Inventor： Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
CPC classification number: H05B33/28 , A41B1/08 , A41D1/002 , A42B1/004 , A42B1/242 , F21V33/0008 , H05B33/04 , H05B33/06
Abstract: Some forms relate to a stretchable computing display device. The stretchable computing display device includes a stretchable base; a patterned conductive section mounted on the stretchable base, wherein the patterned conductive section includes a first portion and a second portion that is electrically isolated from the first portion; an electroluminescent material mounted on the stretchable base such that the electroluminescent material is between the first portion and the second portion of the patterned conductive section; an encapsulant that covers at least a portion of the patterned conductive section; and a textile such that the stretchable base is mounted on the textile, wherein the textile is part of a garment.
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