公开(公告)号：US06707158B2

公开(公告)日：2004-03-16

申请号：US10095579

申请日：2002-03-13

申请人： Sachiyuki Nose

发明人： Sachiyuki Nose

IPC分类号： H01L2348

CPC分类号： H05K3/4038 ,  H01L21/4846 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0235 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014

摘要： A semiconductor device includes a circuit board, a semiconductor element that is mounted on an upper surface of the circuit board and has an electrode terminal, and a sealing resin for sealing a periphery of the semiconductor element that is mounted on the upper surface of the circuit board. The circuit board includes a plurality of conductive members and an insulating substance for binding and fixing the plurality of conductive members. Each of the plurality of conductive members includes a conductive material formed integrally from the upper surface through the lower surface of the circuit board, and an insulating material covering an outer circumference of the conductive material. The conductive material of at least one conductive member of the plurality of conductive members is exposed to the upper surface of the circuit board. The electrode terminal of the semiconductor element is electrically connected to the conductive material of the conductive member exposed to the upper surface of the circuit board via a connecting member.

摘要翻译： 半导体器件包括电路板，安装在电路板的上表面上并具有电极端子的半导体元件和用于密封安装在电路的上表面上的半导体元件的周边的密封树脂 板。 电路板包括多个导电构件和用于绑定和固定多个导电构件的绝缘物质。 多个导电构件中的每一个包括从电路板的下表面的上表面一体地形成的导电材料和覆盖导电材料的外周的绝缘材料。 多个导电构件中的至少一个导电构件的导电材料暴露于电路板的上表面。 半导体元件的电极端子通过连接部件电连接到暴露于电路板的上表面的导电部件的导电材料。

公开(公告)号：US06772511B2

公开(公告)日：2004-08-10

申请号：US10350069

申请日：2003-01-24

申请人： Sachiyuki Nose

发明人： Sachiyuki Nose

IPC分类号： H05K330

CPC分类号： H05K3/4038 ,  H01L21/4846 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0235 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014

摘要： A semiconductor device includes a circuit board, a semiconductor element that is mounted on an upper surface of the circuit board and has an electrode terminal, and a sealing resin for sealing a periphery of the semiconductor element that is mounted on the upper surface of the circuit board. The circuit board includes a plurality of conductive members and an insulating substance for binding and fixing the plurality of conductive members. Each of the plurality of conductive members includes a conductive material formed integrally from the upper surface through the lower surface of the circuit board, and an insulating material covering an outer circumference of the conductive material. The conductive material of at least one conductive member of the plurality of conductive members is exposed to the upper surface of the circuit board. The electrode terminal of the semiconductor element is electrically connected to the conductive material of the conductive member exposed to the upper surface of the circuit board via a connecting member.

摘要翻译： 半导体器件包括电路板，安装在电路板的上表面上并具有电极端子的半导体元件和用于密封安装在电路的上表面上的半导体元件的周边的密封树脂 板。 电路板包括多个导电构件和用于绑定和固定多个导电构件的绝缘物质。 多个导电构件中的每一个包括从电路板的下表面的上表面一体地形成的导电材料和覆盖导电材料的外周的绝缘材料。 多个导电构件中的至少一个导电构件的导电材料暴露于电路板的上表面。 半导体元件的电极端子通过连接部件电连接到暴露于电路板的上表面的导电部件的导电材料。

公开(公告)号：US6040621A

公开(公告)日：2000-03-21

申请号：US45832

申请日：1998-03-23

申请人： Sachiyuki Nose

发明人： Sachiyuki Nose

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L24/49 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111

摘要： A semiconductor device is provided with a wiring body including an insulating supporting substrate, and signal lines, power lines and ground lines printed on first and second surfaces of the insulating supporting substrate. The wiring body is mounted on a semiconductor chip, inside pads of the lines of the wiring body are connected with bonding pads on the semiconductor chip through first metal lines, and outside pads of the lines are connected with leads of a lead frame. Since the wiring body has a structure in which the lines are supported by the insulating supporting substrate, refined and various line patterns can be formed by using the wiring body, and an impedance matching function can also be attained. Thus, the invention provides a semiconductor device which can exhibit high noise resistance for a high frequency signal and a high operation speed and a wiring body to be disposed in a high frequency circuit.

摘要翻译： 半导体器件具有包括绝缘性支撑基板的布线体以及印刷在绝缘支撑基板的第一和第二表面上的信号线，电力线和接地线。 布线体安装在半导体芯片上，布线体的线的内侧的衬垫通过第一金属线与半导体芯片上的接合焊盘连接，线的外部焊盘与引线框架的引线连接。 由于布线体具有由绝缘支撑基板支撑线路的结构，因此可以通过使用布线体形成精细的各种线图案，并且还可以获得阻抗匹配功能。 因此，本发明提供了一种可以对高频信号和高操作速度显示出高抗噪性的半导体器件以及布置在高频电路中的布线体。

公开(公告)号：US5397915A

公开(公告)日：1995-03-14

申请号：US834466

申请日：1992-02-12

申请人： Sachiyuki Nose

发明人： Sachiyuki Nose

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L29/46 ,  H01L29/54 ,  H01L29/62

CPC分类号： H01L23/49503 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/181

摘要： A semiconductor element mounting die pad is supported by tie bars. Plural slits and dimples are disposed on a flat surface. The slits are penetrating from the face to the back side of the semiconductor element mounting die pad. Slits are formed, for example, by a punching or chemical etching method. These forming methods are the same as the method of forming the lead frame. Accordingly, if slits are disposed simultaneously when forming the lead frame, the process is not complicated. It is also possible to form these slits using the prior art. Slits of the same shape are formed at an interval of the width of dimples. The rear side is pushed out by press means to form dimples with the boundary of the slits. Thus, slits are formed in one body at both ends of the dimples. By thus composing, the thin type surface mount semiconductor device has a sufficient mechanical strength, and is capable of controlling the stress in a narrow region, so that a semiconductor device of high reliability is realized.

摘要翻译： 半导体元件安装芯片由连接杆支撑。 多个狭缝和凹坑设置在平坦的表面上。 狭缝从半导体元件安装芯片焊盘的表面贯穿到背面侧。 狭缝例如通过冲压或化学蚀刻方法形成。 这些形成方法与形成引线框架的方法相同。 因此，如果在形成引线框时同时设置狭缝，则处理不复杂。 也可以使用现有技术形成这些狭缝。 在凹坑宽度的间隔形成相同形状的狭缝。 后侧通过压制装置推出以形成具有狭缝边界的凹坑。 因此，在凹坑的两端形成有一个体。 通过这样构成，薄型表面安装半导体器件具有足够的机械强度，并且能够控制窄区域中的应力，从而实现了高可靠性的半导体器件。

公开(公告)号：US5817208A

公开(公告)日：1998-10-06

申请号：US691845

申请日：1996-08-01

申请人： Sachiyuki Nose ,  Minako Onoe

发明人： Sachiyuki Nose ,  Minako Onoe

IPC分类号： B29C45/37 ,  B29B31/00

CPC分类号： B29C45/372 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1815

摘要： The present invention intends to improve the productivity and reliability of a resin-sealed-type semiconductor device. Therefore, the invention provides a resin sealing die for integrally molding a semiconductor chip, a lead frame to which the semiconductor chip is fixed, and metal wires which electrically connect the electrode terminals of the semiconductor chip to the inner leads of a head frame with sealing resin to manufacture a resin-sealed-type semiconductor device, wherein a cavity of the resin sealing die is formed at a portion where separable upper and lower dies confront each other, at least one of the upper surface of the cavity of the upper die and the lower surface of the cavity of the lower die comprises an engraved hole, and a metal block having a mark carved on a reference surface thereof facing the cavity is detachably attached to the engraved hole. The mark is imprinted on the surface of the resin-sealed-type semiconductor device concurrently with the resin molding, thereby realizing a relief marking.

摘要翻译： 本发明旨在提高树脂密封型半导体器件的生产率和可靠性。 因此，本发明提供一种用于一体成型半导体芯片的树脂密封模具，固定半导体芯片的引线框架和将半导体芯片的电极端子与密封件的头架的内部引线电连接的金属线 树脂制造树脂密封型半导体器件，其中树脂密封模具的空腔形成在可分离的上模具和下模具相互面对的部分，上模腔的上表面和 下模具的腔的下表面包括雕刻孔，并且具有在其面向腔的基准表面上雕刻的标记的金属块可拆卸地附接到雕刻孔。 该树脂密封型半导体器件的表面与树脂成型体同时印刷，从而实现浮雕标记。