公开(公告)号：US20060169490A1

公开(公告)日：2006-08-03

申请号：US11366793

申请日：2006-03-02

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01L23/28

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US20060005672A1

公开(公告)日：2006-01-12

申请号：US10886825

申请日：2004-07-07

申请人： Gregory Chapman ,  Steven Heppler

发明人： Gregory Chapman ,  Steven Heppler

IPC分类号： B26D1/00

CPC分类号： B28D5/022 ,  B26D1/0006 ,  B26D2001/0046 ,  B26D2001/0053 ,  Y10T83/04 ,  Y10T83/7797

摘要： Blades, saws, and methods for cutting microfeature workpieces are disclosed herein. In one embodiment, a saw includes a shaft for attachment to a spindle, an annular blade coupled to the shaft, and a support member coupled to the shaft and juxtaposed to the annular blade. The blade has a first thickness at a first diameter and a second thickness at a second diameter. The second thickness is different than the first thickness and sized to cut the microfeature workpiece. For example, the first thickness can be greater than the second thickness, and the second diameter can be greater than the first diameter.

摘要翻译： 本文公开了用于切割微型工件的刀片，锯和方法。 在一个实施例中，锯包括用于连接到主轴的轴，联接到轴的环形叶片，以及联接到轴并且并入到环形叶片的支撑构件。 叶片具有第一直径的第一厚度和第二直径的第二厚度。 第二厚度不同于第一厚度并且尺寸被切割成微特征的工件。 例如，第一厚度可以大于第二厚度，并且第二直径可以大于第一直径。

公开(公告)号：US20050263312A1

公开(公告)日：2005-12-01

申请号：US11180493

申请日：2005-07-13

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01G4/00 ,  H01L21/48 ,  H01L23/055 ,  H01L23/28 ,  H01L27/146 ,  H05K5/06

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US20050057883A1

公开(公告)日：2005-03-17

申请号：US10663959

申请日：2003-09-16

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01G4/00 ,  H01L21/48 ,  H01L23/055 ,  H01L23/28 ,  H01L27/146 ,  H05K5/06

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

公开(公告)号：US20060194373A1

公开(公告)日：2006-08-31

申请号：US11411287

申请日：2006-04-25

申请人： Setho Fee ,  Lim Chye ,  Steven Heppler ,  Leng Yin ,  Keith Tan ,  Patrick Guay ,  Edmund Tian ,  Yap Eng ,  Eric Seng

发明人： Setho Fee ,  Lim Chye ,  Steven Heppler ,  Leng Yin ,  Keith Tan ,  Patrick Guay ,  Edmund Tian ,  Yap Eng ,  Eric Seng

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitation securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.

摘要翻译： 一种用于将一个或多个半导体器件与内插器组装的方法包括将一个或多个半导体器件定位在延伸穿过插入件的插座内，在保持元件上，该保持元件在容器的至少一部分上延伸。 可以在一个或多个半导体器件的外周边的至少一部分与插入器的内周之间引入材料，以便使一个或多个半导体器件相对于插入件有利地固定就位。 保留元件可以从半导体器件移除。 一旦一个或多个半导体器件就位，它们可以电连接到插入器。