Abstract:
The present invention discloses a III-nitride compound semiconductor light emitting device having an n-type nitride compound semiconductor layer, an active layer grown on the n-type nitride compound semiconductor layer, for generating light by recombination of electron and hole, and a p-type nitride compound semiconductor layer grown on the active layer. The III-nitride compound semiconductor light emitting device includes a plurality of semiconductor layers including a nitride compound semiconductor layer with a pinhole structure grown on the p-type nitride compound semiconductor layer.
Abstract:
The present invention relates to a nitride semiconductor light emitting device including a plurality of nitride semi-conductor layers with a p-type nitride semiconductor formed using as nitrogen precursor ammonia together with hydrazine-based material which upon thermal decomposition generates a radical being combined with a hydrogen radical to eliminate the hydrogen radical, thereby eliminates the need for a subsequent annealing process for removing hydrogen and prevents the active layer from being thermally damaged due to the subsequent annealing process.
Abstract:
Disclosed herein is a IE-nitride semiconductor light emitting device comprising a plurality of nitride semiconductor layers including a substrate and an active layer deposited on the substrate, in which the substrate is provided with protrusions to let the lights generated in the active layer emit out of the light emitting device and each of the protrusions has a first scattering plane and a second scattering plane, which are not parallel to each other.
Abstract:
The present invention is to provide a group III nitride tunneling junction structure with a low tunneling potential barrier, in which Si layer or a group III-V compound semiconductor In(a)Ga(b)Al(c)As(d)[N]P(e) (0≦a≦1, 0≦b≦1, 0≦c≦1, 0≦d≦1, 0≦e≦1) which has a smaller band gap than that of Al(x)Ga(y)In(z)N (0≦x≦1, 0≦y≦1, 0≦z≦1) and can be doped with a high concentration of p is inserted into a tunneling junction based on a P++—Al(x)Ga(y)In(z)N (0≦x≦1, 0≦y≦1, 0≦z≦1) layer and a N++—Al(x)Ga(y)In(z)N (0≦x≦1, 0≦y≦1, 0≦z≦1) layer. This tunneling junction structure will be useful for the fabrication of a highly reliable ultrahigh-speed optoelectronic device.
Abstract translation:本发明提供具有低隧穿势垒的III族氮化物隧道结结构,其中Si层或III-V族化合物半导体In(a)Ga(b)Al(c)As(d)[N ] P(e)(0 <= a <= 1,0,0 <= b <= 1,0 <= c <= 1,0 <= d <= 1,0 <= e <= 1) 带隙比Al(x)Ga(y)In(z)N(0 <= x <=1,0,0≤y≤1,0<= z <= 1)的带隙,并且可以掺杂高 基于P +++(x)Ga(y)In(z)N(0≤x≤1,0<= y <1)将p的浓度插入到隧穿结中, = 1,0 <= z <= 1)层和平均值-Al(x)Ga(y)In(z)N(0≤x≤1,0<= y <= 1,0 <= z <= 1)层。 该隧道结结构对于制造高度可靠的超高速光电子器件将是有用的。
Abstract:
A semiconductor optical device and a method for fabricating the same. The semiconductor optical device comprises a substrate, a semiconductor electrode layer of a first conductive type formed on the substrate and having a groove formed to a desired depth therein, a semiconductor layer of the first conductive type formed from side walls of the groove up to a part of the semiconductor electrode layer of the first conductive type on the periphery of the groove, a cladding layer of the first conductive type, an active layer of the first conductive type, a cladding layer of a second condcutive type and a semiconductor electrode layer of the second conductive type sequentially formed on the semiconductor layer of the first conductive type, and electrodes of the first and second conductive types formed respectively on the semiconductor electrode layers of the first and second conductive types.
Abstract:
The present invention relates to an AlGaInN based optical device fabricated by a new p-type AlGaInN:Mg growth method and method for manufacturing the same, including a p-type nitride semiconductor layer that is grown using both NH3 and a hydrazine based source as a nitrogen precursor, thereby an additional subsequent annealing process for extracting hydrogen is not necessary and thus the process is simple and an active layer can be prevented from being thermally damaged by subsequent annealing.
Abstract:
The present invention is to provide a group III nitride tunneling junction structure with a low tunneling potential barrier, in which Si layer or a group III-V compound semiconductor In(a)Ga(b)Al(c)As(d)[N]P(e) (0≦a≦1, 0≦b≦1, 0≦c≦1, 0≦d≦1, 0≦e≦1) which has a smaller band gap than that of Al(x)Ga(y)In(z)N (0≦x≦1, 0≦y≦1, 0≦z≦1) and can be doped with a high concentration of p is inserted into a tunneling junction based on a P++-Al(x)Ga(y)In(z)N (0≦x≦1, 0≦y≦1, 0≦z≦1) layer and a N++-Al(x)Ga(y)In(z)N (0≦x≦1, 0≦y≦1, 0≦z≦1) layer. This tunneling junction structure will be useful for the fabrication of a highly reliable ultrahigh-speed optoelectronic device.
Abstract translation:本发明提供具有低隧穿势垒的III族氮化物隧道结结构,其中Si层或III-V族化合物半导体In(a)Ga(b)Al(c)As(d)[N ] P(e)(0 <= a <= 1,0,0 <= b <= 1,0 <= c <= 1,0 <= d <= 1,0 <= e <= 1) 带隙比Al(x)Ga(y)In(z)N(0 <= x <=1,0,0≤y≤1,0<= z <= 1)的带隙,并且可以掺杂高 基于P +++(x)Ga(y)In(z)N(0≤x≤1,0<= y <1)将p的浓度插入到隧穿结中, = 1,0 <= z <= 1)层和平均值-Al(x)Ga(y)In(z)N(0≤x≤1,0<= y <= 1,0 <= z <= 1)层。 该隧道结结构对于制造高度可靠的超高速光电子器件将是有用的。
Abstract:
The present invention relates to an III-nitride semiconductor light emitting device in which a single layer or plural layers made of SixCyNz(x≧0, y≧0, x+y>0, z>0) are inserted into or under an active layer and it is directed to a technology in which Al(x)Ga(y)In(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1) of the hexagonal structure and SixCyNz(x≧0, y≧0, x+y>0, z>0) of the hexagonal structure are combined together in view of the properties of the SixCyNz(x≧0, y≧0, x+y>0, z>0) material.
Abstract translation:本发明涉及一种III族氮化物半导体发光器件,其中单层或多层由Si x Si x N z N z (x> = 0,y> = 0,x + y> 0,z> 0)插入到有源层中或下面,并且涉及一种技术,其中Al(x)Ga(y)In xy)N(0 <= x <=1,0,0≤y≤1,0<= x + y <= 1)的六方结构和Si x x C y 根据Si = 0,y> = 0,x + y> 0,z> 0) (x> = 0,y> = 0,x + y> 0,z> 0)材料。
Abstract:
Quantum dot infrared detection device and method for fabricating the same, which is a new concept of detection device in which quantum dots in the quantum dot part having a stack of alternative quantum dots and separating layers are doped with impurities, so that the quantum dot part itself absorbs infrared ray and serves as a channel for transferring electrons generated by the infrared ray absorption, for enhancing device performance and a device uniformity, and simplifying a device structure and a device fabrication process.
Abstract:
A semiconductor optical device and a method for fabricating the same. The semiconductor optical device comprises a substrate, a semiconductor electrode layer of a first conductive type formed on the substrate and having a groove formed to a desired depth therein, a semiconductor layer of the first conductive type formed from side walls of the groove up to a part of the semiconductor electrode layer of the first conductive type on the periphery of the groove, a cladding layer of the first conductive type, an active layer of the first conductive type, a cladding layer of a second conductive type and a semiconductor electrode layer of the second conductive type sequentially formed on the semiconductor layer of the first conductive type, and electrodes of the first and second conductive types formed respectively on the semiconductor electrode layers of the first and second conductive types.