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1.发明申请公开(公告)号：US20180279954A1
公开(公告)日：2018-10-04
申请号：US15476097
申请日：2017-03-31
发明人： Gal Hayam , Natan Sharon Katz , Takehiro Kimura
IPC分类号： A61B5/00 , A61B5/0408 , A61B5/0464 , A61B5/06 , A61B18/14
CPC分类号： A61B5/6852 , A61B5/0084 , A61B5/0408 , A61B5/0464 , A61B5/065 , A61B18/1482 , A61B2018/00351 , A61B2018/00577 , A61B2018/00642 , A61B2576/023 , G16H30/40 , G16H50/50
摘要： A three-dimensional (3D) electrical mapping system and method may be used to generate a 3D image of the epicardial surface of a heart by integrating one or more epicardial images with a 3D image of the cardiac structure that may be generated by real-time 3D location and mapping system for cardiac mapping and ablation. The visual textural representation of the epicardial surface of the heart may be reconstructed using, for example, an image sensor or camera-based catheter to collect images of the epicardial surface. For each image that is captured, the system and method may store the image data along with the corresponding catheter location, orientation and/or distance information relative to the cardiac structure. The location, orientation, and/or distance information may be used to reconstruct a 3D textural model of the epicardial surface of the cardiac structure.
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公开(公告)号：US09393001B2
公开(公告)日：2016-07-19
申请号：US13532922
申请日：2012-06-26
申请人： Shunichiro Miyoshi , Takehiro Kimura , Yoshiro Okazaki , Masayuki Kobayashi , Michihiro Sugahara
发明人： Shunichiro Miyoshi , Takehiro Kimura , Yoshiro Okazaki , Masayuki Kobayashi , Michihiro Sugahara
CPC分类号： A61B17/00234 , A61B1/00082 , A61B1/01 , A61B1/3132 , A61B2017/00243
摘要： Disclosed is an operation method of an endoscope, the method comprising: a sheath insertion step of percutaneously inserting at least one sheath in a pericardial cavity of a heart; an insertion step of inserting a rigid scope in the sheath; a view field securing step for securing the view field for a surgical site within the pericardial cavity; a guide step for guiding the rigid scope to the surgical site; and an observation step of observing the surgical site with the rigid scope.
摘要翻译： 本发明公开了一种内窥镜的操作方法，所述方法包括：在心脏的心包腔内经皮插入至少一个鞘的鞘插入步骤; 将刚性范围插入护套中的插入步骤; 视野固定步骤，用于将手术部位的视场固定在心包腔内; 用于将刚性范围引导到外科手术部位的引导步骤; 以及用刚性范围观察手术部位的观察步骤。
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公开(公告)号：US20100327427A1
公开(公告)日：2010-12-30
申请号：US12662805
申请日：2010-05-04
申请人： Takehiro Kimura , Yoichiro Kurita
发明人： Takehiro Kimura , Yoichiro Kurita
CPC分类号： H01L21/563 , H01L23/295 , H01L23/3128 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/83104 , H01L2924/00014 , H01L2924/12044 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device includes a wiring layer, a semiconductor chip which is arranged on the wiring layer with a gap there between, the semiconductor chip being electrically connected to the wiring layer through a connecting portion, a first sealing member which is filled in a space between the wiring layer and the semiconductor chip, and a second sealing member which coats the semiconductor chip. The first sealing member and the second sealing member include same organic resin, the organic resin including inorganic filler. The second sealing member has larger content of inorganic filler than the first sealing member.
摘要翻译： 半导体器件包括布线层，半导体芯片，布置在布线层之间，其间具有间隙，半导体芯片通过连接部分电连接到布线层;第一密封构件，其填充在 布线层和半导体芯片，以及涂覆半导体芯片的第二密封构件。 第一密封构件和第二密封构件包括相同的有机树脂，有机树脂包括无机填料。 第二密封构件具有比第一密封构件更大的无机填料含量。
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公开(公告)号：US20070224798A1
公开(公告)日：2007-09-27
申请号：US11802131
申请日：2007-05-21
申请人： Takashi Miyazaki , Takehiro Kimura
发明人： Takashi Miyazaki , Takehiro Kimura
IPC分类号： H01L21/44 , H01L21/4763
CPC分类号： H01L24/05 , G01R3/00 , H01L22/32 , H01L24/03 , H01L2224/02166 , H01L2224/0392 , H01L2224/0401 , H01L2224/05073 , H01L2224/05556 , H01L2224/05624 , H01L2224/0603 , H01L2224/13144 , H01L2224/13147 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/00014
摘要： A highly-reliable semiconductor device and a method of fabricating the semiconductor device, while stably carrying out IC test, are proposed. A pad portion after an IC test using a probe is covered with a second passivation film. It is therefore made possible to protect the pad, which has partially been thinned by the IC test, from a chemical solution of wet etching used, after the IC test, for removing a barrier metal. This consequently makes it possible to suppress intrusion of a chemical solution through the pad portion into an IC chip. In the semiconductor device, the pad portion provided for the IC test using the probe and the opening provided for formation of the metal bump electrode are separated. It is therefore made possible to suppress any influence of the probe mark produced by the IC test exerted on the geometry of the metal bump electrode.
摘要翻译： 提出了一种稳定地进行IC测试的高度可靠的半导体器件和制造半导体器件的方法。 在使用探针的IC测试之后的焊盘部分被第二钝化膜覆盖。 因此，可以通过IC测试部分地被薄化的焊盘从IC测试之后使用的湿蚀刻的化学溶液保护用于去除阻挡金属。 因此，可以抑制化学溶液通过焊盘部分侵入到IC芯片中。 在半导体器件中，分离用于使用探针的IC测试的焊盘部分和用于形成金属凸块电极的开口。 因此，可以抑制由IC测试产生的探针标记对金属凸块电极的几何形状的影响。
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公开(公告)号：US06288445B1
公开(公告)日：2001-09-11
申请号：US09366539
申请日：1999-08-04
申请人： Takehiro Kimura
发明人： Takehiro Kimura
IPC分类号： H01L2348
CPC分类号： H01L23/49816 , H01L23/13 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81203 , H01L2224/81801 , H01L2224/83192 , H01L2224/83194 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/20108 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device has a substrate for bumps having a first and a second surface opposite to each other. At least one groove or a plurality of holes are formed at the first surface of the substrate for bumps. A semiconductor chip is mounted on the second surface of the substrate for bumps. The semiconductor chip and the substrate for bumps are bonded by an adhesive. A plurality of bumps are formed on the first surface of the substrate for bumps.
摘要翻译： 半导体器件具有用于具有彼此相对的第一和第二表面的凸块用基板。 在用于凸块的基板的第一表面处形成至少一个凹槽或多个孔。 半导体芯片安装在用于凸块的基板的第二表面上。 半导体芯片和用于凸块的基板通过粘合剂粘合。 在用于凸块的基板的第一表面上形成多个凸块。
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公开(公告)号：US10765371B2
公开(公告)日：2020-09-08
申请号：US15476097
申请日：2017-03-31
发明人： Gal Hayam , Natan Sharon Katz , Takehiro Kimura
IPC分类号： A61B5/00 , G16H30/40 , G16H50/50 , A61B5/0408 , A61B5/0464 , A61B5/06 , A61B18/14 , A61B18/00
摘要： A three-dimensional (3D) electrical mapping system and method may be used to generate a 3D image of the epicardial surface of a heart by integrating one or more epicardial images with a 3D image of the cardiac structure that may be generated by real-time 3D location and mapping system for cardiac mapping and ablation. The visual textural representation of the epicardial surface of the heart may be reconstructed using, for example, an image sensor or camera-based catheter to collect images of the epicardial surface. For each image that is captured, the system and method may store the image data along with the corresponding catheter location, orientation and/or distance information relative to the cardiac structure. The location, orientation, and/or distance information may be used to reconstruct a 3D textural model of the epicardial surface of the cardiac structure.
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公开(公告)号：US20130027531A1
公开(公告)日：2013-01-31
申请号：US13532922
申请日：2012-06-26
申请人： Shunichiro MIYOSHI , Takehiro KIMURA , Yoshiro OKAZAKI , Masayuki KOBAYASHI , Michihiro SUGAHARA
发明人： Shunichiro MIYOSHI , Takehiro KIMURA , Yoshiro OKAZAKI , Masayuki KOBAYASHI , Michihiro SUGAHARA
IPC分类号： H04N7/18
CPC分类号： A61B17/00234 , A61B1/00082 , A61B1/01 , A61B1/3132 , A61B2017/00243
摘要： Disclosed is an operation method of an endoscope, the method comprising: a sheath insertion step of percutaneously inserting at least one sheath in a pericardial cavity of a heart; an insertion step of inserting a rigid scope in the sheath; a view field securing step for securing the view field for a surgical site within the pericardial cavity; a guide step for guiding the rigid scope to the surgical site; and an observation step of observing the surgical site with the rigid scope.
摘要翻译： 本发明公开了一种内窥镜的操作方法，所述方法包括：在心脏的心包腔内经皮插入至少一个鞘的鞘插入步骤; 将刚性范围插入护套中的插入步骤; 视野固定步骤，用于将手术部位的视场固定在心包腔内; 用于将刚性范围引导到外科手术部位的引导步骤; 以及用刚性范围观察手术部位的观察步骤。
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公开(公告)号：US20110001226A1
公开(公告)日：2011-01-06
申请号：US12783857
申请日：2010-05-20
申请人： Toshiyuki YAMADA , Takehiro KIMURA
发明人： Toshiyuki YAMADA , Takehiro KIMURA
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/49503 , H01L23/4952 , H01L23/49541 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A lead frame includes a die pad on which at least one IC chip is mounted, a plurality of leads that electrically connect the IC chip and at least one external element, and a plurality of projections that are formed in at least one edge of the die pad. The projections are used as at least one bonding point that connect with at least one free terminal of the IC chip or as references of positioning when the IC chip is arranged on the die pad.
摘要翻译： 引线框架包括其上安装有至少一个IC芯片的芯片焊盘，将IC芯片和至少一个外部元件电连接的多个引线和形成在模具的至少一个边缘中的多个突起 垫。 这些突起用作与IC芯片的至少一个自由端子连接的至少一个接合点，或者当IC芯片布置在管芯焊盘上时作为定位的参考。
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9.发明授权公开(公告)号：US07667312B2
公开(公告)日：2010-02-23
申请号：US10658170
申请日：2003-09-09
IPC分类号： H01L23/02
CPC分类号： H01L24/83 , H01L21/67092 , H01L21/6838 , H01L23/3128 , H01L23/4334 , H01L23/552 , H01L24/34 , H01L24/37 , H01L24/48 , H01L24/49 , H01L24/75 , H01L25/0657 , H01L2224/05624 , H01L2224/16145 , H01L2224/2919 , H01L2224/32145 , H01L2224/37147 , H01L2224/37599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/83121 , H01L2224/83192 , H01L2224/8385 , H01L2224/85399 , H01L2225/0651 , H01L2225/06527 , H01L2225/06572 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In a multi-chip package having vertically stacked semiconductor integrated circuits (chips), a heat transmitting conductive plate (5) can be interposed between a lower layer semiconductor chip (3) and an upper layer semiconductor chip (4) and connected to a ground wiring of a substrate (2) through a bonding wire (9). A heating transmitting conductive plate (5) at the ground potential can block propagation of noise between the lower layer semiconductor chip (3) and upper layer semiconductor chip (4). Thus, the addition of noise to signals of an analog circuit in the upper layer semiconductor chip (4) can be avoided, reducing noise induced malfunctions. Furthermore, heat generated by the lower layer semiconductor chip (3) and upper layer semiconductor chip (4) can be transmitted through contact points with the heat transmitting conductive plate (5) for dissipation therefrom. This can improve heat dissipating capabilities of the semiconductor device (1) contributing to more stable operation.
摘要翻译： 在具有垂直堆叠的半导体集成电路（芯片）的多芯片封装中，传热导电板（5）可以插入在下层半导体芯片（3）和上层半导体芯片（4）之间并连接到地 基板（2）通过接合线（9）的布线。 处于地电势的加热传导导电板（5）可以阻挡下层半导体芯片（3）和上层半导体芯片（4）之间的噪声传播。 因此，可以避免对上层半导体芯片（4）中的模拟电路的信号增加噪声，从而减少噪声引起的故障。 此外，由下层半导体芯片（3）和上层半导体芯片（4）产生的热量可以通过与传热导电板（5）的接触点传输，从而从其中消散。 这可以改善有助于更稳定操作的半导体器件（1）的散热能力。
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公开(公告)号：US20060164110A1
公开(公告)日：2006-07-27
申请号：US11336882
申请日：2006-01-23
申请人： Takashi Miyazaki , Takehiro Kimura
发明人： Takashi Miyazaki , Takehiro Kimura
CPC分类号： H01L24/05 , G01R3/00 , H01L22/32 , H01L24/03 , H01L2224/02166 , H01L2224/0392 , H01L2224/0401 , H01L2224/05073 , H01L2224/05556 , H01L2224/05624 , H01L2224/0603 , H01L2224/13144 , H01L2224/13147 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/00014
摘要： A highly-reliable semiconductor device and a method of fabricating the semiconductor device, while stably carrying out IC test, are proposed. A pad portion after an IC test using a probe is covered with a second passivation film. It is therefore made possible to protect the pad, which has partially been thinned by the IC test, from a chemical solution of wet etching used, after the IC test, for removing a barrier metal. This consequently makes it possible to suppress intrusion of a chemical solution through the pad portion into an IC chip. In the semiconductor device, the pad portion provided for the IC test using the probe and the opening provided for formation of the metal bump electrode are separated. It is therefore made possible to suppress any influence of the probe mark produced by the IC test exerted on the geometry of the metal bump electrode.
摘要翻译： 提出了一种稳定地进行IC测试的高度可靠的半导体器件和制造半导体器件的方法。 在使用探针的IC测试之后的焊盘部分被第二钝化膜覆盖。 因此，可以通过IC测试部分地被薄化的焊盘从IC测试之后使用的湿蚀刻的化学溶液保护用于去除阻挡金属。 因此，可以抑制化学溶液通过焊盘部分侵入到IC芯片中。 在半导体器件中，分离用于使用探针的IC测试的焊盘部分和用于形成金属凸块电极的开口。 因此，可以抑制由IC测试产生的探针标记对金属凸块电极的几何形状的影响。
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