公开(公告)号：US07733666B2

公开(公告)日：2010-06-08

申请号：US11215038

申请日：2005-08-31

申请人： Yasuhiro Ichihara ,  Shozo Suzuki ,  Shoichi Hayashi

发明人： Yasuhiro Ichihara ,  Shozo Suzuki ,  Shoichi Hayashi

IPC分类号： H05K5/00

CPC分类号： B65D25/04 ,  B65D75/04 ,  B65D85/38

摘要： A circuit board storage bag and a storage rack are disclosed. A plurality of printed circuit board storage bags for accommodating a circuit board comprise a front surface portion and a rear surface portion opposed to the obverse and reverse surfaces, respectively, of the circuit board accommodated in the circuit board storage bag and connecting portions for connecting the front surface portion and the rear surface portion. The front surface portion and the rear surface portion bend at the connecting portions to open and close the circuit board storage bag for use in transporting the circuit board. The circuit boards are stored in a storage rack having an inclined mounting surface for mounting the storage bags and a bag stopper at the lower end of the mounting surface. The bags are stored in vertical position on one side at the lower end of the mounting surface.

摘要翻译： 公开了电路板存储袋和存放架。 用于容纳电路板的多个印刷电路板存储袋包括分别与容纳在电路板存储袋中的电路板的正面和反面相对的前表面部分和后表面部分，以及连接部分 前表面部分和后表面部分。 前表面部分和后表面部分在连接部分处弯曲以打开和闭合用于传送电路板的电路板存储袋。 电路板存储在具有用于安装存储袋的倾斜安装表面和在安装表面的下端处的袋塞的存储架中。 袋子在安装表面的下端的一侧的垂直位置被储存。

公开(公告)号：US06727718B2

公开(公告)日：2004-04-27

申请号：US10298640

申请日：2002-11-19

申请人： Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

发明人： Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

IPC分类号： G01R3126

CPC分类号： H01L23/49838 ,  H01L23/49816 ,  H01L2224/16 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10969 ,  H05K2201/2018 ,  Y02P70/613

摘要： A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

摘要翻译： 一种球栅阵列（BGA）电子部件封装，其具有能够提高安装效率以及防止在电子部件封装的电路连接部分处的占用空隙的构造。 BGA封装具有形成在布置常规电路连接凸块的预定区域外侧的区域中的增强凸块。 因此，即使在BGA封装的外部或周边部分对BGA封装施加冲击，对于这种冲击最为敏感，冲击也被不受电连接的加强凸起和加强覆盖物吸收 电子部件封装的电路。 因此，可以防止形成在BGA封装的安装部分上的印迹和形成在印刷电路板上的印迹破碎或破裂。

公开(公告)号：US5828128A

公开(公告)日：1998-10-27

申请号：US604429

申请日：1996-02-21

申请人： Yutaka Higashiguchi ,  Toshio Kumai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

发明人： Yutaka Higashiguchi ,  Toshio Kumai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

IPC分类号： H01L23/12 ,  G01R31/04 ,  H01L21/60 ,  H01L21/66 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  G01R31/046 ,  H01L22/12 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1403 ,  H01L2924/01322 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/116 ,  H05K2201/0367 ,  H05K2201/094 ,  H05K2201/09745 ,  H05K2201/10666 ,  H05K2203/0455 ,  H05K2203/0465 ,  H05K2203/162 ,  H05K3/3431 ,  Y02P70/613

摘要： A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

摘要翻译： BGA型半导体器件具有焊接凸块，其焊接状态可以通过目视检查容易地检查。 当半导体器件安装在布线板上时，封装具有面向布线板的底表面。 多个焊接凸块设置在封装的底表面上。 焊接凸块具有多个不同的尺寸，并且当将半导体器件安装在布线板上时，位于从封装外部观察焊接凸块的位置。

公开(公告)号：US20070007976A1

公开(公告)日：2007-01-11

申请号：US11215038

申请日：2005-08-31

申请人： Yasuhiro Ichihara ,  Shozo Suzuki ,  Shoichi Hayashi

发明人： Yasuhiro Ichihara ,  Shozo Suzuki ,  Shoichi Hayashi

IPC分类号： G01R31/02

CPC分类号： B65D25/04 ,  B65D75/04 ,  B65D85/38

摘要： A circuit board storage bag and a storage rack are disclosed. The stock in process, of the printed circuit boards between processes, is reduced while at the same time saving the space otherwise required for the stock, and the inward and outward delivery of the printed circuit boards are facilitated. A plurality of printed circuit board storage bags (1) each for accommodating a circuit board (90) each comprise a front surface portion (11) and a rear surface portion (12) opposed to the obverse and reverse surfaces, respectively, of the circuit board (90) accommodated in the circuit board storage bag (1) in closed state and connecting portions (13 to 15) for connecting the front surface portion (11) and the rear surface portion (12). The front surface portion (11) and the rear surface portion (12) connected to each other are adapted to bend at the connecting portions (13 to 15) thereby to open and close the circuit board storage bag (1) for use in transporting the circuit board (90) between processes. In each process, the circuit boards (90) are stored in a storage rack having an inclined mounting surface (51) for mounting the storage bags (1) and a bag stopper (52) at the lower end of the mounting surface (51). The bags (1) are stored in vertical position on one side at the lower end of the mounting surface (51).

摘要翻译： 公开了电路板存储袋和存放架。 在处理过程中的印刷电路板的库存减少，同时节省了库存所需的空间，并且便于印刷电路板的向内和向外输送。 每个用于容纳电路板（90）的多个印刷电路板存储袋（1）分别包括与电路的正面和反面相对的前表面部分（11）和后表面部分（12） （90），以及用于连接前表面部分（11）和后表面部分（12）的连接部分（13至15）。 彼此连接的前表面部分（11）和后表面部分（12）适于在连接部分（13至15）处弯曲，从而打开和关闭电路板存储袋（1），用于运输 电路板（90）之间。 在每个处理中，电路板（90）被存储在具有用于安装存放袋（1）的倾斜安装表面（51）和在安装表面（51）的下端处的袋塞（52）的存放架中， 。 袋（1）在安装表面（51）的下端的一侧的垂直位置被储存。

公开(公告)号：US5760469A

公开(公告)日：1998-06-02

申请号：US602421

申请日：1996-02-16

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Hideaki Tamura ,  Hiroshi Iimura ,  Seishi Chiba ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Hideaki Tamura ,  Hiroshi Iimura ,  Seishi Chiba ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

IPC分类号： H01L23/12 ,  H01L23/057 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K3/34 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L23/057 ,  H01L23/3107 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10477 ,  H05K2201/10568 ,  H05K2201/10666 ,  H05K3/3431 ,  Y02P70/613

摘要： A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

摘要翻译： 半导体器件包括具有相对表面的封装，用于由所述封装支撑的外部连接的第一端子和由所述封装支撑的电子部件，并且封装的相对表面具有狭缝，使得封装的形状可以在 安装状态。 因此，施加到第一端子和第二端子的焊接接头的应力减小。

公开(公告)号：US07004646B2

公开(公告)日：2006-02-28

申请号：US10688967

申请日：2003-10-21

申请人： Yasuhiro Ichihara ,  Yasuhide Kuroda

发明人： Yasuhiro Ichihara ,  Yasuhide Kuroda

IPC分类号： G02B6/36 ,  H04B10/00

CPC分类号： H04B10/801 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A receptacle type opto-electrical module including a printed wiring board having a first segment, a second segment arranged substantially perpendicularly to the first segment, and a flexible portion for connecting the first segment and the second segment. The opto-electrical module further includes a first electric circuit component mounted on the first segment, a second electric circuit component mounted on a first surface of the second segment, a socket mounted on a second surface of the second segment opposite to the first surface, and an optical module detachably mounted to the socket.

摘要翻译： 一种插座型光电模块，包括具有第一段的印刷线路板，基本上垂直于第一段布置的第二段，以及用于连接第一段和第二段的柔性部分。 光电模块还包括安装在第一段上的第一电路部件，安装在第二段的第一表面上的第二电路部件，安装在与第一表面相对的第二段的第二表面上的插座， 以及可拆卸地安装到插座的光学模块。

公开(公告)号：US06749347B1

公开(公告)日：2004-06-15

申请号：US09714225

申请日：2000-11-17

申请人： Yasuhiro Ichihara ,  Takashi Shiotani ,  Toshiya Kishida

发明人： Yasuhiro Ichihara ,  Takashi Shiotani ,  Toshiya Kishida

IPC分类号： G02B636

CPC分类号： G02B6/4204 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4263

摘要： A laser diode module including a laser diode assembly having a laser diode and a holder, a lens-fiber assembly having a lens and an optical fiber fixed in a given positional relationship, and a sleeve. The lens-fiber assembly includes a casing having a first hole and a second hole offset from the first hole. The lens is inserted and fixed in the first hole, and a ferrule in which the optical fiber is embedded is press-fitted with the second hole. The ferrule has a slant polished first end and a second end projecting from an end surface of the casing by a given distance. The lens and the ferrule are fixed in the casing so that a given distance is defined between the lens and the first end of the ferrule.

摘要翻译： 一种激光二极管模块，包括具有激光二极管和保持器的激光二极管组件，具有以给定位置关系固定的透镜和光纤的透镜光纤组件和套筒。 透镜 - 光纤组件包括具有第一孔和从第一孔偏移的第二孔的壳体。 将透镜插入并固定在第一孔中，并且嵌入有光纤的套圈与第二孔压配合。 套圈具有倾斜抛光的第一端和从壳体的端面突出给定距离的第二端。 透镜和套圈固定在壳体中，使得在透镜和套圈的第一端之间限定给定的距离。

公开(公告)号：US06498307B2

公开(公告)日：2002-12-24

申请号：US09124509

申请日：1998-07-29

申请人： Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

发明人： Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

IPC分类号： H05K116

CPC分类号： H01L23/49838 ,  H01L23/49816 ,  H01L2224/16 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10969 ,  H05K2201/2018 ,  Y02P70/613

摘要： A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package e.g. when a printed circuit board having the BGA package mounted thereon is carelessly dropped during the manufacturing work, at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

摘要翻译： 一种球栅阵列（BGA）电子部件封装，具有能够提高安装效率的结构，并且防止在电子部件封装的电路连接部分处的占用空间。 BGA封装具有形成在布置常规电路连接凸块的预定区域外侧的区域中的增强凸块。 因此，即使对BGA封装施加冲击也是如此。 当在制造工作期间安装其上具有BGA封装的印刷电路板时，在对这种冲击最敏感的BGA封装的外部或周边部分处，不小心掉落了冲击，该冲击被加强凸块和加强脚印吸收 它们与电子部件封装的电路没有电连接。 因此，可以防止形成在BGA封装的安装部分上的印迹和形成在印刷电路板上的印迹破碎或破裂。