公开(公告)号：US5760469A

公开(公告)日：1998-06-02

申请号：US602421

申请日：1996-02-16

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Hideaki Tamura ,  Hiroshi Iimura ,  Seishi Chiba ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Hideaki Tamura ,  Hiroshi Iimura ,  Seishi Chiba ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

IPC分类号： H01L23/12 ,  H01L23/057 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K3/34 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L23/057 ,  H01L23/3107 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10477 ,  H05K2201/10568 ,  H05K2201/10666 ,  H05K3/3431 ,  Y02P70/613

摘要： A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

摘要翻译： 半导体器件包括具有相对表面的封装，用于由所述封装支撑的外部连接的第一端子和由所述封装支撑的电子部件，并且封装的相对表面具有狭缝，使得封装的形状可以在 安装状态。 因此，施加到第一端子和第二端子的焊接接头的应力减小。

公开(公告)号：US5828128A

公开(公告)日：1998-10-27

申请号：US604429

申请日：1996-02-21

申请人： Yutaka Higashiguchi ,  Toshio Kumai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

发明人： Yutaka Higashiguchi ,  Toshio Kumai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

IPC分类号： H01L23/12 ,  G01R31/04 ,  H01L21/60 ,  H01L21/66 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  G01R31/046 ,  H01L22/12 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1403 ,  H01L2924/01322 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/116 ,  H05K2201/0367 ,  H05K2201/094 ,  H05K2201/09745 ,  H05K2201/10666 ,  H05K2203/0455 ,  H05K2203/0465 ,  H05K2203/162 ,  H05K3/3431 ,  Y02P70/613

摘要： A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

摘要翻译： BGA型半导体器件具有焊接凸块，其焊接状态可以通过目视检查容易地检查。 当半导体器件安装在布线板上时，封装具有面向布线板的底表面。 多个焊接凸块设置在封装的底表面上。 焊接凸块具有多个不同的尺寸，并且当将半导体器件安装在布线板上时，位于从封装外部观察焊接凸块的位置。

公开(公告)号：US5413164A

公开(公告)日：1995-05-09

申请号：US751944

申请日：1991-08-29

申请人： Yasuhiro Teshima ,  Mamoru Niishiro ,  Michinori Matsubayashi

发明人： Yasuhiro Teshima ,  Mamoru Niishiro ,  Michinori Matsubayashi

IPC分类号： F27B9/14 ,  B23K1/008 ,  G05D23/19 ,  H01L21/56 ,  H05K3/28 ,  H05K3/34 ,  F25B29/00 ,  B23K37/04 ,  B23K31/02 ,  F27B9/24

CPC分类号： G05D23/1934 ,  B23K1/008 ,  B23K2201/18

摘要： For use in the fabrication of electronic circuit modules, there is provided a heating furnace which can be arbitrarily set in a desired temperature profile. The furnace includes a plural number of independently controllable heaters located in spaced positions to provide a plural number of heating zones in the furnace, and a plural number of cooling panels provided in the heating zones of the respective heaters. Each heater is independently controlled according to a specified type of substrate to establish a temperature profile for the specified substrate type in the furnace to carry out the curing of a sealing synthetic resin material of a semiconductor device and the reflow soldering of surface mounting devices in one and single furnace.

摘要翻译： 为了用于电子电路模块的制造，提供了可以任意设置在所需温度分布中的加热炉。 该炉包括位于间隔位置的多个可独立控制的加热器，以在炉中提供多个加热区，以及设置在各加热器的加热区中的多个冷却板。 每个加热器根据指定类型的基板独立地控制，以建立炉中指定基板类型的温度曲线，以执行半导体器件的密封合成树脂材料的固化和表面安装装置的回流焊接 和单炉。

公开(公告)号：US5337467A

公开(公告)日：1994-08-16

申请号：US797128

申请日：1991-11-22

申请人： Seiji Kogure ,  Mamoru Niishiro

发明人： Seiji Kogure ,  Mamoru Niishiro

IPC分类号： H01L25/18 ,  H01L21/50 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L21/98 ,  H01L25/04 ,  H05K3/34 ,  H05K13/04

CPC分类号： H01L25/50 ,  H05K13/0465 ,  H05K3/3415 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K2203/0173 ,  H05K2203/049 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10S269/901 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A wire-bonded substrate assembly is made up of a substrate having a first surface and a second surface which is opposite to the first surface, and a plurality of elements mounted on the first and second surfaces of the substrate. The elements at least include resin encapsulated integrated circuit chips which are wire-bonded and encapsulated by a synthetic resin. A first one of the resin encapsulated integrated circuit chips is mounted at a first region on the first surface of the substrate, while a second one of the resin encapsulated integrated circuit chips is mounted at a second region on the second surface of the substrate. The second region is other than a region on the second surface opposite to the first region on the first surface.

摘要翻译： 引线键合衬底组件由具有与第一表面相对的第一表面和第二表面的衬底以及安装在衬底的第一和第二表面上的多个元件构成。 这些元件至少包括由合成树脂引线键合和封装的树脂封装的集成电路芯片。 树脂封装的集成电路芯片中的第一个安装在基板的第一表面上的第一区域，而第二个树脂封装的集成电路芯片安装在基板的第二表面上的第二区域。 第二区域不同于在第一表面上与第一区域相反的第二表面上的区域。