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公开(公告)号：US5760469A
公开(公告)日：1998-06-02
申请号：US602421
申请日：1996-02-16
申请人： Yutaka Higashiguchi , Mitsuo Inagaki , Toshio Kumai , Ryoichi Ochiai , Yasuhiro Teshima , Mamoru Niishiro , Yasushi Kobayashi , Hideaki Tamura , Hiroshi Iimura , Seishi Chiba , Yukio Sekiya , Shuzo Igarashi , Yasuhiro Ichihara
发明人： Yutaka Higashiguchi , Mitsuo Inagaki , Toshio Kumai , Ryoichi Ochiai , Yasuhiro Teshima , Mamoru Niishiro , Yasushi Kobayashi , Hideaki Tamura , Hiroshi Iimura , Seishi Chiba , Yukio Sekiya , Shuzo Igarashi , Yasuhiro Ichihara
IPC分类号： H01L23/12 , H01L23/057 , H01L23/31 , H01L23/498 , H01L23/50 , H05K1/02 , H05K3/34 , H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/3436 , H01L23/057 , H01L23/3107 , H01L23/49816 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15159 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/181 , H05K1/0271 , H05K2201/068 , H05K2201/09036 , H05K2201/10477 , H05K2201/10568 , H05K2201/10666 , H05K3/3431 , Y02P70/613
摘要： A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.
摘要翻译： 半导体器件包括具有相对表面的封装，用于由所述封装支撑的外部连接的第一端子和由所述封装支撑的电子部件，并且封装的相对表面具有狭缝，使得封装的形状可以在 安装状态。 因此，施加到第一端子和第二端子的焊接接头的应力减小。
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2.发明授权Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device 失效具有从外部检查的凸块的半导体器件和与这种半导体器件一起使用的电路板
公开(公告)号：US5828128A
公开(公告)日：1998-10-27
申请号：US604429
申请日：1996-02-21
申请人： Yutaka Higashiguchi , Toshio Kumai , Yasuhiro Teshima , Mamoru Niishiro , Yasushi Kobayashi , Yukio Sekiya , Shuzo Igarashi , Yasuhiro Ichihara
发明人： Yutaka Higashiguchi , Toshio Kumai , Yasuhiro Teshima , Mamoru Niishiro , Yasushi Kobayashi , Yukio Sekiya , Shuzo Igarashi , Yasuhiro Ichihara
IPC分类号： H01L23/12 , G01R31/04 , H01L21/60 , H01L21/66 , H01L23/498 , H05K1/02 , H05K1/11 , H05K3/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/3436 , H01L23/49816 , G01R31/046 , H01L22/12 , H01L2224/0401 , H01L2224/0603 , H01L2224/1403 , H01L2924/01322 , H01L2924/3011 , H05K1/0269 , H05K1/116 , H05K2201/0367 , H05K2201/094 , H05K2201/09745 , H05K2201/10666 , H05K2203/0455 , H05K2203/0465 , H05K2203/162 , H05K3/3431 , Y02P70/613
摘要： A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.
摘要翻译： BGA型半导体器件具有焊接凸块，其焊接状态可以通过目视检查容易地检查。 当半导体器件安装在布线板上时，封装具有面向布线板的底表面。 多个焊接凸块设置在封装的底表面上。 焊接凸块具有多个不同的尺寸，并且当将半导体器件安装在布线板上时，位于从封装外部观察焊接凸块的位置。
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公开(公告)号：US08769069B2
公开(公告)日：2014-07-01
申请号：US12892396
申请日：2010-09-28
IPC分类号： H04L29/06
CPC分类号： G06F11/079 , G06F11/0709 , G06F11/0715
摘要： A data collection apparatus includes an information storing unit which stores application information collected from a server providing a service by running an application and includes detail information indicating a detail of the application, an information collecting unit which collects the application information from the server, an information identifying unit which identifies application information in which an abnormality has occurred and application information, affected by the abnormality, a first comparing unit which compares, as to the application information identified by the information identifying unit, all application information including the detail information and all application information including the detail information collected in the previous point, and extracts application information different from the application information collected in a previous point, and an information sending unit which sends the application information, extracted by the first comparing unit, to a data management apparatus which manages the application information.
摘要翻译： 数据收集装置包括信息存储单元，其存储通过运行应用而从提供服务的服务器收集的应用信息，并且包括指示应用的细节的详细信息，从服务器收集应用信息的信息收集单元，信息 识别发生了异常的应用信息的识别单元和受该异常影响的应用信息的第一比较单元，其对由信息识别单元识别的应用信息进行比较，包括详细信息和所有应用的所有应用信息 包括前一点收集的详细信息的信息，并且提取与先前点收集的应用信息不同的应用信息，以及信息发送单元，其发送由第一比较提取的应用信息 单元，连接到管理应用信息的数据管理装置。
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4.发明授权Process for producing silicic coating, silicic coating and semiconductor device 有权硅涂层，硅涂层和半导体器件的生产工艺公开(公告)号：US08431464B2
公开(公告)日：2013-04-30
申请号：US12700215
申请日：2010-02-04
IPC分类号： H01L21/76
CPC分类号： H01L23/53295 , C08G77/20 , C09D183/04 , H01L21/02123 , H01L21/02216 , H01L21/02222 , H01L21/02282 , H01L21/02348 , H01L21/31144 , H01L21/3121 , H01L21/3125 , H01L21/3212 , H01L21/76807 , H01L21/76829 , H01L23/53238 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： A silicic coating of 2.4 g/cm3 or higher density, obtained by forming a silicic coating precursor with the use of at least one type of silane compound having a photosensitive functional group and thereafter irradiating the silicic coating precursor with at least one type of light. This silicic coating can be used as a novel barrier film or stopper film for semiconductor device.
摘要翻译： 通过使用至少一种具有光敏官能团的硅烷化合物形成硅涂层前体，然后用至少一种类型的光照射硅涂层前体，得到2.4g / cm 3或更高密度的硅质涂层。 这种硅涂层可用作半导体器件的新型阻挡膜或阻挡膜。
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公开(公告)号：US08269274B2
公开(公告)日：2012-09-18
申请号：US12613150
申请日：2009-11-05
IPC分类号： H01L29/78
CPC分类号： H01L29/7816 , H01L29/0878 , H01L29/66689
摘要： In a semiconductor substrate of a first conductivity type, first to third drain offset regions of a second conductivity type are formed in that order in a bottom up manner. A body region of the first conductivity type is formed partly in the second drain offset region and partly in the third drain offset region. The second drain offset region has a lower impurity concentration than the first and third drain offset regions. A curvature portion of the body region is located in the second drain offset region.
摘要翻译： 在第一导电类型的半导体衬底中，以自下而上的顺序形成第二导电类型的第一至第三漏极偏移区域。 第一导电类型的主体区域部分地形成在第二漏极偏移区域中，部分地形成在第三漏极偏移区域中。 第二漏极偏移区域具有比第一和第三漏极偏移区域更低的杂质浓度。 身体区域的曲率部分位于第二漏极偏移区域中。
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6.发明申请公开(公告)号：US20110237829A1
公开(公告)日：2011-09-29
申请号：US13155863
申请日：2011-06-08
CPC分类号： C07C51/235 , B01J23/002 , B01J27/199 , B01J35/08 , B01J37/0045 , B01J37/0221 , B01J2231/70 , B01J2523/00 , C07C51/00 , C07C51/377 , C07C57/04 , B01J2523/15 , B01J2523/17 , B01J2523/51 , B01J2523/53 , B01J2523/55 , B01J2523/68
摘要： It is an object of the present invention to provide a catalyst having excellent performance and high mechanical strength for use in the production of methacrylic acid.A method for manufacturing a catalyst comprising essential active components of molybdenum, phosphorus, vanadium, cesium, ammonia, copper, and antimony for use in the production of methacrylic acid, comprising drying a slurry prepared by mixing a compound(s) containing the essential active components with water and then calcining the resulting dry powder and molding the calcined powder.
摘要翻译： 本发明的目的是提供一种用于生产甲基丙烯酸的具有优异性能和高机械强度的催化剂。 一种用于制造催化剂的方法，其包括用于生产甲基丙烯酸的钼，磷，钒，铯，氨，铜和锑的必需活性组分，包括干燥通过将含有必需活性物质的化合物 用水组分，然后煅烧所得干粉，并将煅烧粉末成型。
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7.发明授权公开(公告)号：US08017547B2
公开(公告)日：2011-09-13
申请号：US11919911
申请日：2006-05-11
IPC分类号： B01J23/00
CPC分类号： C07C51/235 , B01J23/002 , B01J27/199 , B01J35/08 , B01J37/0045 , B01J37/0221 , B01J2231/70 , B01J2523/00 , C07C51/00 , C07C51/377 , C07C57/04 , B01J2523/15 , B01J2523/17 , B01J2523/51 , B01J2523/53 , B01J2523/55 , B01J2523/68
摘要： It is an object of the present invention to provide a catalyst having excellent performance and high mechanical strength for use in the production of methacrylic acid.A method for manufacturing a catalyst comprising essential active components of molybdenum, phosphorus, vanadium, cesium, ammonia, copper, and antimony for use in the production of methacrylic acid, comprising drying a slurry prepared by mixing a compound(s) containing the essential active components with water and then calcining the resulting dry powder and molding the calcined powder.
摘要翻译： 本发明的目的是提供一种用于生产甲基丙烯酸的具有优异性能和高机械强度的催化剂。 一种用于制造催化剂的方法，其包括用于生产甲基丙烯酸的钼，磷，钒，铯，氨，铜和锑的必需活性组分，包括干燥通过将含有必需活性物质的化合物 用水组分，然后煅烧所得干粉，并将煅烧粉末成型。
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公开(公告)号：US20110187002A1
公开(公告)日：2011-08-04
申请号：US13019509
申请日：2011-02-02
申请人： Sadahiro Kishii , Tsuyoshi Kanki , Yoshihiro Nakata , Yasushi Kobayashi , Masato Tanaka , Akio Rokugawa
发明人： Sadahiro Kishii , Tsuyoshi Kanki , Yoshihiro Nakata , Yasushi Kobayashi , Masato Tanaka , Akio Rokugawa
CPC分类号： H01L23/488 , H01L24/18 , H01L24/19 , H01L24/97 , H01L2224/04105 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/14 , H01L2924/15153 , H01L2924/15787 , H01L2924/15788 , H01L2224/82 , H01L2224/83 , H01L2924/00 , H01L2224/03
摘要： A support substrate includes a first surface and a second surface located above the level of the first surface. Chips are mounted on the first surface. A first insulating film is disposed over each chip. First conductive plugs are connected to the chip extending through each first insulating film. Filler material made of resin filling a space between chips. Wirings are disposed over the first insulating film and the filler material for interconnecting different chips. The second surface, an upper surface of the first insulating film and an upper surface of the filler material are located at the same level.
摘要翻译： 支撑基板包括位于第一表面的高度之上的第一表面和第二表面。 芯片安装在第一个表面上。 第一绝缘膜设置在每个芯片上。 第一导电插头连接到延伸穿过每个第一绝缘膜的芯片。 由树脂填充的填充材料填充芯片之间的空间。 布线布置在第一绝缘膜和用于互连不同芯片的填充材料之上。 第二表面，第一绝缘膜的上表面和填充材料的上表面位于同一水平。
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公开(公告)号：US20110078298A1
公开(公告)日：2011-03-31
申请号：US12892396
申请日：2010-09-28
IPC分类号： G06F15/16
CPC分类号： G06F11/079 , G06F11/0709 , G06F11/0715
摘要： A data collection apparatus includes an information storing unit which stores application information collected from a server providing a service by running an application and includes detail information indicating a detail of the application, an information collecting unit which collects the application information from the server, an information identifying unit which identifies application information in which an abnormality has occurred and application information, affected by the abnormality, a first comparing unit which compares, as to the application information identified by the information identifying unit, all application information including the detail information and all application information including the detail information collected in the previous point, and extracts application information different from the application information collected in a previous point, and an information sending unit which sends the application information, extracted by the first comparing unit, to a data management apparatus which manages the application information.
摘要翻译： 数据收集装置包括信息存储单元，其存储通过运行应用而从提供服务的服务器收集的应用信息，并且包括指示应用的细节的详细信息，从服务器收集应用信息的信息收集单元，信息 识别发生了异常的应用信息的识别单元和受该异常影响的应用信息的第一比较单元，其对由信息识别单元识别的应用信息进行比较，包括详细信息和所有应用的所有应用信息 包括前一点收集的详细信息的信息，并且提取与先前点收集的应用信息不同的应用信息，以及信息发送单元，其发送由第一比较提取的应用信息 单元，连接到管理应用信息的数据管理装置。
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公开(公告)号：US20060051108A1
公开(公告)日：2006-03-09
申请号：US11220322
申请日：2005-09-06
申请人： Yasushi Kobayashi
发明人： Yasushi Kobayashi
IPC分类号： G03G15/00
CPC分类号： G03G15/50 , G03G15/0863 , G03G15/55 , G03G2215/0695 , G03G2221/1823
摘要： A cartridge information managing unit reads a kind of toner cartridge which is detachable to an image forming apparatus main body and ID information stored in a toner cartridge identification information storing unit and manages them. A process switching unit of a image forming unit switches a processing method of received image information on the basis of the read ID information of the toner cartridge. Even if the toner cartridge is incompatible with the apparatus, deterioration in image quality is suppressed.
摘要翻译： 盒信息管理单元读取可拆卸到成像设备主体的一种调色剂盒和存储在调色剂盒识别信息存储单元中的ID信息并对其进行管理。 图像形成单元的处理切换单元基于调色剂盒的读取ID信息来切换接收到的图像信息的处理方法。 即使调色剂盒与设备不兼容，也抑制了图像质量的劣化。
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