公开(公告)号：US11550393B1

公开(公告)日：2023-01-10

申请号：US17853962

申请日：2022-06-30

申请人： Ching Lee ,  Ruey Yuan Lee

发明人： Ching Lee ,  Ruey Yuan Lee

IPC分类号： G06F3/01 ,  A61B5/00 ,  A61B5/374

摘要： A metaverse multimedia system based on user brainwaves causes that emotional messages, voice messages and color messages could be captured from the brainwaves of the users. The emotional messages are integrated to the role of the user in the metaverse space. Hence, the role in the metaverse can respond the emotions of the user, while the voice messages and color messages are integrated into the sceneries in the metaverse, which is selected by the user. As a result, the metaverse space completely presents user's states of mind which are captured from the brainwaves of the users. Furthermore the whole sceneries and presentations of the roles in the metaverse space are adjustable with the changes of the users. It can also express user's personalities. Interaction modes between the users and visitors entering into the metaverse space of the user could be analyzed based on the method disclosed in the present invention.

公开(公告)号：US10921981B2

公开(公告)日：2021-02-16

申请号：US16278177

申请日：2019-02-18

申请人： Meng-Huan Tsai ,  Yen-Hua Hsiao ,  Yun-Tung Pai ,  Chih-Yuan Lee ,  Chien-Hao Ho ,  Chia-Hua Wu ,  Kung-Ju Chen ,  Chia-Chi Lin ,  Chia-Chi Sun

发明人： Meng-Huan Tsai ,  Yen-Hua Hsiao ,  Yun-Tung Pai ,  Chih-Yuan Lee ,  Chien-Hao Ho ,  Chia-Hua Wu ,  Kung-Ju Chen ,  Chia-Chi Lin ,  Chia-Chi Sun

IPC分类号： G06F3/0488 ,  G06F3/041

摘要： An electronic device includes a keyboard module, a silicone film, a light-emitting module, and a touch module. The keyboard module has a plurality of buttons and a point stick. The silicone film has a virtual touch region. The light-emitting module is configured below the silicone film and corresponds to the virtual touch region. The light-emitting module includes a first light-emitting unit and a second light-emitting unit. The touch module is configured below the silicone film and corresponds to the virtual touch region. The touch module includes a control chip and a sensing layer. The point stick, the first light-emitting unit, the second light-emitting unit, and the sensing layer are electrically connected to the control chip, respectively.

公开(公告)号：US09421048B2

公开(公告)日：2016-08-23

申请号：US13846344

申请日：2013-03-18

申请人： Metal Industries Research & Development Centre ,  Pei-Yuan Lee

发明人： Pei-Yuan Lee ,  Yen-Nien Chen ,  Wei-The Chen ,  Wei-Ching Wang

IPC分类号： A61B17/72

CPC分类号： A61B17/7283 ,  A61B17/7208 ,  A61B17/7258

摘要： A supporting instrument with a modular intramedullary nail includes a plurality of intramedullary nails and a coupling module. Each intramedullary nail is in a form of a long rod and has a coupling portion arranged between two ends of the intramedullary nail and an abutting surface along a longitudinal face of the intramedullary nail. The coupling module is mounted to the coupling portions of the plurality of intramedullary nails for the abutting surfaces of the plurality of intramedullary nails to abut against each other and for assembling the plurality of intramedullary nails.

公开(公告)号：US09369175B2

公开(公告)日：2016-06-14

申请号：US11930213

申请日：2007-10-31

申请人： Jin-Yuan Lee ,  Ming-Ta Lei ,  Ching-Cheng Huang ,  Chuen-Jye Lin

发明人： Jin-Yuan Lee ,  Ming-Ta Lei ,  Ching-Cheng Huang ,  Chuen-Jye Lin

IPC分类号： H01L23/00 ,  H04B1/7113 ,  H01L21/56 ,  H01L23/31 ,  H04B1/712

CPC分类号： H04B1/7113 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/14 ,  H01L24/15 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/11901 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H04B1/712 ,  H01L2224/13099 ,  H01L2924/00

摘要： The invention provides a new method and chip scale package is provided. The inventions starts with a substrate over which a contact point is provided, the contact point is exposed through an opening created in the layer of passivation and a layer of polymer or elastomer. A barrier/seed layer is deposited, a first photoresist mask is created exposing the barrier/seed layer where this layer overlies the contact pad and, contiguous therewith, over a surface area that is adjacent to the contact pad and emanating in one direction from the contact pad. The exposed surface of the barrier/seed layer is electroplated for the creation of interconnect traces. The first photoresist mask is removed from the surface of the barrier/seed layer. A second photoresist mask, defining the solder bump, is created exposing the surface area of the barrier/seed layer that is adjacent to the contact pad and emanating in one direction from the contact pad. The solder bump is created in accordance with the second photoresist mask, the second photoresist mask is removed from the surface of the barrier/seed layer, exposing the electroplating and the barrier/seed layer with the metal plating overlying the barrier/seed layer. The exposed barrier/seed layer is etched in accordance with the pattern formed by the electroplating, reflow of the solder bump is optionally performed.

公开(公告)号：US09107301B2

公开(公告)日：2015-08-11

申请号：US13688182

申请日：2012-11-28

申请人： Hung-Sung Pan ,  Chung-Hao Kuo ,  Jui-Wen Chou ,  Hung-Jui Lin ,  Tzu-Chien Lai ,  Hsin Yeh ,  Long-Cheng Chang ,  Chuang-Yueh Chen ,  Po-Chin Yu ,  Chuan-Hao Wen ,  Yung-Hsiang Chen ,  Ting-Wei Wu ,  Hui-Lian Chang ,  Ming-Wang Lin ,  Jui-Yuan Lee

发明人： Hung-Sung Pan ,  Chung-Hao Kuo ,  Jui-Wen Chou ,  Hung-Jui Lin ,  Tzu-Chien Lai ,  Hsin Yeh ,  Long-Cheng Chang ,  Chuang-Yueh Chen ,  Po-Chin Yu ,  Chuan-Hao Wen ,  Yung-Hsiang Chen ,  Ting-Wei Wu ,  Hui-Lian Chang ,  Ming-Wang Lin ,  Jui-Yuan Lee

IPC分类号： G06F1/16 ,  H05K5/02

CPC分类号： H05K5/0226 ,  G06F1/1616 ,  G06F1/1618 ,  G06F1/1681 ,  G06F1/1688 ,  G06F1/1698

摘要： A foldable electronic device includes a first body, a second body and a hinge body. The hinge body is pivoted to the first body around a first pivoting axis and pivoted to the second body around a second pivoting axis so that the first body is able to rotate relatively to the second body. When the first body rotates to a first position relatively to the second body, a first front surface of the first body is closed to a second front surface of the second body on a closing plane, and a pivoting plane where the first pivoting axis and the second pivoting axis are located on and the closing plane are oblique to each other.

摘要翻译： 可折叠电子装置包括第一主体，第二主体和铰链主体。 铰链主体围绕第一枢转轴线枢转到第一主体并围绕第二枢转轴线枢转到第二主体，使得第一主体能够相对于第二主体旋转。 当第一主体相对于第二主体旋转到第一位置时，第一主体的第一前表面在关闭平面上关闭到第二主体的第二前表面，以及枢转平面，其中第一枢转轴线和 第二枢转轴线位于并且闭合平面彼此倾斜。

公开(公告)号：US09030029B2

公开(公告)日：2015-05-12

申请号：US10055568

申请日：2002-01-22

申请人： Mou-Shiung Lin ,  Jin-Yuan Lee ,  Ching-Cheng Huang

发明人： Mou-Shiung Lin ,  Jin-Yuan Lee ,  Ching-Cheng Huang

IPC分类号： H01L29/00 ,  H01L29/40 ,  H01L23/00 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H01L23/64

CPC分类号： H01L24/97 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/642 ,  H01L23/645 ,  H01L24/19 ,  H01L2221/68363 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： An integrated chip package structure and method of manufacturing the same is by adhering dies on a silicon substrate and forming a thin-film circuit layer on top of the dies and the silicon substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

摘要翻译： 集成芯片封装结构及其制造方法是通过在硅基板上附着模具并在芯片和硅基板的顶部上形成薄膜电路层。 其中薄膜电路层具有电连接到模具的金属焊盘的外部电路，其延伸到模具的有效表面外部的区域，以扇出模具的金属焊盘。 此外，多个有源器件和内部电路位于管芯的有效表面上。 有源器件的信号通过内部电路传输到外部电路，并通过内部电路从外部电路传输回其他有源器件。 此外，芯片封装结构允许将具有不同功能的多个裸片封装在集成封装中并通过外部电路电连接裸片。

公开(公告)号：US08974907B2

公开(公告)日：2015-03-10

申请号：US13900217

申请日：2013-05-22

申请人： Pal Wonn (Taiwan) Co., Ltd. ,  Chun-Yuan Lee

发明人： Chun-Yuan Lee

IPC分类号： C03C17/34 ,  C03C17/42 ,  C03C17/44

CPC分类号： C03C17/34 ,  C03C17/3405 ,  C03C17/44 ,  C03C2217/231 ,  C03C2218/355 ,  Y10T428/1414 ,  Y10T428/23 ,  Y10T428/24752 ,  Y10T428/24942 ,  Y10T428/2848 ,  Y10T428/31525 ,  Y10T428/31601 ,  Y10T428/31612 ,  Y10T428/31645 ,  Y10T428/31649

摘要： The present invention provides a method for reinforcing a glass of a touch panel and a reinforcement structure thereof. The method provides at least one protective film and at least one glass substrate. One side of the glass substrate is adhered to one side of the protective film. The glass substrate adhered with the protective film is dipped in an adhesive reservoir. The glass substrate adhered with the protective film is taken out of the adhesive reservoir. After the adhesive is hardened, a reinforcement layer is formed on the other side and the periphery of the glass substrate. The present invention makes the surface of the glass to be more flat with an increased strength.

摘要翻译： 本发明提供了一种用于加强触摸面板的玻璃及其加强结构的方法。 该方法提供至少一个保护膜和至少一个玻璃基底。 玻璃基板的一侧粘附在保护膜的一侧。 将粘附有保护膜的玻璃基板浸入粘合剂储存器中。 粘附有保护膜的玻璃基板从粘合剂储存器中取出。 在粘合剂硬化之后，在玻璃基板的另一侧和周边上形成加强层。 本发明使玻璃的表面更加平坦，强度增加。

公开(公告)号：US08952458B2

公开(公告)日：2015-02-10

申请号：US13086491

申请日：2011-04-14

申请人： Wei-Yang Lee ,  Xiong-Fei Yu ,  Da-Yuan Lee ,  Kuang-Yuan Hsu

发明人： Wei-Yang Lee ,  Xiong-Fei Yu ,  Da-Yuan Lee ,  Kuang-Yuan Hsu

IPC分类号： H01L21/70 ,  H01L21/02 ,  H01L21/8238 ,  H01L29/423 ,  H01L21/28 ,  H01L29/51 ,  H01L29/66

CPC分类号： H01L29/66477 ,  H01L21/28185 ,  H01L21/823857 ,  H01L29/42368 ,  H01L29/513 ,  H01L29/66545

摘要： A semiconductor device includes a substrate having a first active region, a first gate structure over the first active region, wherein the first gate structure includes a first interfacial layer having a convex top surface, a first high-k dielectric over the first interfacial layer, and a first gate electrode over the first high-k dielectric.

摘要翻译： 一种半导体器件包括具有第一有源区，第一有源区上的第一栅结构的衬底，其中第一栅结构包括具有凸顶表面的第一界面层，第一界面层上的第一高k电介质， 以及在第一高k电介质上的第一栅电极。

公开(公告)号：US20150022910A1

公开(公告)日：2015-01-22

申请号：US14063881

申请日：2013-10-25

申请人： Princeton Wen-Yuan LEE

发明人： Princeton Wen-Yuan LEE

IPC分类号： G02B7/04

CPC分类号： G02B7/04 ,  G02B7/02 ,  G02B7/023 ,  G03B21/14

摘要： Disclosed is an adjustable attaching lens device comprising a lens holding member including a flexible confining strip and an adjustable fastener that is for adjusting a fastening position of the flexible confining strip, wherein the flexible confining strip is bent to confine a lens attaching hole with a given size and a given shape for holding an optical lens; and an attaching member, provided on the lens holding member in a manner that the attaching member is facing toward the same side of the lens attaching hole, for attaching with an attaching surface so that the lens attaching hole corresponds to an optical image grabbing element of an external device. The various kinds of detachable lenses are applied to an electric device with lens, and thus the detachable lens compatible to a specific electric device can be used for a different device.

摘要翻译： 公开了一种可调节的附接透镜装置，其包括透镜保持构件，该透镜保持构件包括柔性限制条和用于调节柔性限制条的紧固位置的可调紧固件，其中柔性限制条被弯曲以将透镜附接孔与给定的 尺寸和用于保持光学透镜的给定形状; 以及安装构件，其以使得所述安装构件面向所述透镜安装孔的相同侧的方式设置在所述透镜保持构件上，用于附接安装表面，使得所述透镜安装孔对应于所述透镜安装孔的光学图像抓取元件 外部设备。 各种可拆卸透镜被应用于具有透镜的电子装置，因此与特定电气装置兼容的可拆卸透镜可用于不同的装置。

公开(公告)号：US20140366346A1

公开(公告)日：2014-12-18

申请号：US14084914

申请日：2013-11-20

申请人： PEI-YUAN LEE ,  CHUN-LIANG KUO

发明人： PEI-YUAN LEE ,  CHUN-LIANG KUO

IPC分类号： D04B1/14 ,  D06B9/00 ,  D06B1/00

CPC分类号： D04B1/14 ,  D03D15/0027 ,  D06B1/00 ,  D06B9/00 ,  D06P3/8214 ,  D06P5/2055 ,  D06P7/00 ,  D10B2321/022 ,  D10B2331/02 ,  D10B2331/04

摘要： A polyester fiber and lightweight woven nylon yarn blended process may include a lightweight weaving procedure, a secondary lightweight procedure, a dyeing procedure; and a water rinsing and drying procedure. In one embodiment, in the lightweight weaving procedure, a plurality of chemical monofilament fibers is twirled into bunched chemical monofilament fibers by a kneading process, the bunched chemical monofilament fibers and a woven complex yarn (polyester fiber and woven nylon yarn) are fed into a loom simultaneously, the loom is equipped with a fiber opening knife for performing a fiber opening process for the woven complex yarn, the fiber opening knife performs the fiber opening process to cut the woven complex yarn into a plurality of equal sized furcal structures longitudinally to cause wear and tear to achieve lightweight preliminarily, then the furcal structures and the bunched chemical monofilament fibers are undergone a knitting process to obtain a lightweight fabric;

摘要翻译： 聚酯纤维和轻质编织尼龙纱线混纺工艺可以包括轻质织造程序，二次轻质程序，染色程序; 和水洗和干燥程序。 在一个实施方案中，在轻质织造过程中，多个化学单丝纤维通过捏合过程旋转成聚束化学单丝纤维，将聚束化学单丝纤维和编织复合纱（聚酯纤维和编织尼龙纱）进料到 织机同时装有用于进行编织复合纱线的纤维打开处理的纤维开口刀，纤维开口刀进行纤维开口处理，以将纵向复合纱线纵向切割成多个相等尺寸的毛皮结构，从而使 磨损预先实现轻量化，然后通过编织工艺获得轻质织物，然后将毛束结构和聚束化学单丝纤维进行编织处理。