公开(公告)号：US20140044503A1

公开(公告)日：2014-02-13

申请号：US13961538

申请日：2013-08-07

Applicant: Applied Materials, Inc.

Inventor： Eric A. Englhardt ,  Steve Szudarski ,  Andrew Scott Cornelius ,  Amitabh Puri ,  Michael Robert Rice ,  Jeffrey C. Hudgens ,  Steven V. Sansoni ,  Robert Irwin Decottignies ,  Dean C. Hruzek ,  Peter Irwin ,  Nir Merry

IPC: H01L21/677

CPC classification number: H01L21/67739 ,  H01L21/67161 ,  H01L21/67184

Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.

Abstract translation: 在一些实施例中，提供了一种链接的加工工具系统，其包括（1）具有至少第一传送室的第一处理工具，所述第一传送室被配置为耦合到多个处理室; （2）具有至少第二传送室的第二处理工具，所述第二传送室被配置为耦合到多个处理室; （3）耦合在所述第一和第二处理工具之间并被配置为在所述第一和第二处理工具之间传送衬底的第三传送室; 以及（4）单个定序器，其控制所述连接的处理工具系统的第一处理工具，第二处理工具和第三传送室之间的衬底传送操作。 提供了许多其他方面。

公开(公告)号：US20190214284A1

公开(公告)日：2019-07-11

申请号：US16359561

申请日：2019-03-20

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US10971381B2

公开(公告)日：2021-04-06

申请号：US15029502

申请日：2014-11-03

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US10010912B2

公开(公告)日：2018-07-03

申请号：US14276289

申请日：2014-05-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Jared Ahmad Lee ,  Dmitry Lubomirsky ,  Martin Jeff Salinas ,  Andrew Nguyen ,  Tom K. Cho ,  Eric A. Englhardt ,  Fernando Silveira

IPC: F16K51/02 ,  B08B9/032 ,  F16K3/02 ,  H01L21/67

CPC classification number: B08B9/0325 ,  F16K3/02 ,  F16K51/02 ,  H01L21/67017 ,  H01L21/67253 ,  Y10T137/0419 ,  Y10T137/4259

Abstract: Methods and apparatus for particle reduction in throttle gate valves used in substrate process chambers are provided herein. In some embodiments, a gate valve for use in a process chamber includes a body having an opening disposed therethrough from a first surface to an opposing second surface of the body; a pocket extending into the body from a sidewall of the opening; a gate movably disposed within the pocket between a closed position that seals the opening and an open position that reveals the opening and disposes the gate completely within the pocket; and a plurality of gas ports disposed in the gate valve configured to direct a gas flow into a portion of the gate valve fluidly coupled to the opening.

公开(公告)号：US09524889B2

公开(公告)日：2016-12-20

申请号：US14202763

申请日：2014-03-10

Applicant: Applied Materials, Inc.

Inventor： Steve S. Hongkham ,  Paul B. Reuter ,  Eric A. Englhardt ,  Ganesh Balasubramanian ,  Xinglong Chen ,  JuanCarlos Rocha-Alvarez

IPC: B01J19/00 ,  H01L21/67

CPC classification number: H01L21/67184 ,  Y10T137/0318 ,  Y10T137/86187

Abstract: A via pass-through apparatus is disclosed. The via pass-through apparatus includes a pass-through chamber adapted to couple between a first mainframe section and a second mainframe section of a substrate processing system, the pass-through chamber including an entry and an exit each having a slit valve, and a via process chamber located at a different level than the pass-through chamber wherein the via process chamber is adapted to carry out a process on a substrate at the via location. Systems and methods of operating the system are provided, as are numerous other aspects.

Abstract translation: 公开了一种通孔传送装置。 通孔穿通装置包括适于联接在基板处理系统的第一主机部分和第二主机部分之间的通过室，所述通过室包括每个具有狭缝阀的入口和出口，以及 通过处理室位于与通过室不同的水平，其中通孔处理室适于在通孔位置处在基板上执行处理。 提供了操作系统的系统和方法，以及许多其它方面。

公开(公告)号：US09147592B2

公开(公告)日：2015-09-29

申请号：US13961538

申请日：2013-08-07

Applicant: Applied Materials, Inc.

Inventor： Eric A. Englhardt ,  Steve Szudarski ,  Andrew Scott Cornelius ,  Amitabh Puri ,  Michael Robert Rice ,  Jeffrey C. Hudgens ,  Steven V. Sansoni ,  Robert Irwin Decottignies ,  Dean C. Hruzek ,  Peter Irwin ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67739 ,  H01L21/67161 ,  H01L21/67184

Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.

Abstract translation: 在一些实施例中，提供了一种链接的加工工具系统，其包括（1）具有至少第一传送室的第一处理工具，所述第一传送室被配置为耦合到多个处理室; （2）具有至少第二传送室的第二处理工具，所述第二传送室被配置为耦合到多个处理室; （3）耦合在所述第一和第二处理工具之间并被配置为在所述第一和第二处理工具之间传送衬底的第三传送室; 以及（4）单个定序器，其控制所述连接的处理工具系统的第一处理工具，第二处理工具和第三传送室之间的衬底传送操作。 提供了许多其他方面。

公开(公告)号：US20150090341A1

公开(公告)日：2015-04-02

申请号：US14498449

申请日：2014-09-26

Applicant: Applied Materials, Inc.

Inventor： Edward Ng ,  Eric A. Englhardt ,  Travis Morey ,  Ayan Majumdar ,  Steve S. Hongkham

IPC: F17D1/04

CPC classification number: F17D1/04 ,  C23C14/564 ,  C23C14/568 ,  C23C16/00 ,  C23C16/4401 ,  C23C16/54 ,  H01L21/00 ,  H01L21/67017 ,  H01L21/67196 ,  Y10T137/0318 ,  Y10T137/86292

Abstract: Transfer chamber gas purge apparatus are disclosed. The transfer chamber gas purge apparatus has a transfer chamber adapted to contain at least a portion of a transfer robot, the transfer chamber including side walls, a chamber lid, and a chamber floor, wherein the chamber lid has a plurality of distributed chamber inlets. The plurality of distributed chamber inlets may include diffusing elements. Laminar purge gas flow may be provided above the substrate. Systems and methods including a plurality of distributed chamber inlets are disclosed, as are numerous other aspects.

Abstract translation: 转印室气体净化装置被公开。 传送室气体净化装置具有适于容纳传送机器人的至少一部分的传送室，传送室包括侧壁，室盖和室底板，其中室盖具有多个分布的室入口。 多个分布室入口可以包括扩散元件。 层叠吹扫气流可以设置在衬底上。 公开了包括多个分布式室入口的系统和方法，以及许多其它方面。

公开(公告)号：US20210143034A1

公开(公告)日：2021-05-13

申请号：US17248395

申请日：2021-01-22

Applicant: Applied Materials, Inc.

Inventor： Michael Robert Rice ,  Michael Meyers ,  John J. Mazzocco ,  Dean C. Hruzek ,  Michael Kuchar ,  Sushant S. Koshti ,  Penchala N. Kankanala ,  Eric A. Englhardt

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate processing system includes a factory interface, a transfer chamber, and a robot. The transfer chamber includes four first facets adapted for attachment to one or more first processing chambers and three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets. The system includes a second processing chamber having a first interface attached to a first of the three second facets and a load lock attached to a second of the three second facets and to the factory interface. The system also includes a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.

公开(公告)号：US20170145582A1

公开(公告)日：2017-05-25

申请号：US15423298

申请日：2017-02-02

Applicant: APPLIED Materials, Inc.

Inventor： Nolan L. Zimmerman ,  George Mattinger ,  Gregory J. Wilson ,  Eric A. Englhardt ,  Balamurugan Ramasamy

IPC: C25D17/00

CPC classification number: C25D17/004 ,  C25D17/001 ,  C25D17/002 ,  F16J15/00 ,  F16J15/025 ,  F16J15/16 ,  F16J15/3204 ,  F16J15/3236

Abstract: A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings that slip or deflect laterally on the wafer surface may also be used. In these designs, the slipping is substantially uniform and consistent, resulting in improved performance.

公开(公告)号：US09441792B2

公开(公告)日：2016-09-13

申请号：US14498449

申请日：2014-09-26

Applicant: Applied Materials, Inc.

Inventor： Edward Ng ,  Eric A. Englhardt ,  Travis Morey ,  Ayan Majumdar ,  Steve S. Hongkham

IPC: H01L21/67 ,  F17D1/04

CPC classification number: F17D1/04 ,  C23C14/564 ,  C23C14/568 ,  C23C16/00 ,  C23C16/4401 ,  C23C16/54 ,  H01L21/00 ,  H01L21/67017 ,  H01L21/67196 ,  Y10T137/0318 ,  Y10T137/86292

Abstract: Transfer chamber gas purge apparatus are disclosed. The transfer chamber gas purge apparatus has a transfer chamber adapted to contain at least a portion of a transfer robot, the transfer chamber including side walls, a chamber lid, and a chamber floor, wherein the chamber lid has a plurality of distributed chamber inlets. The plurality of distributed chamber inlets may include diffusing elements. Laminar purge gas flow may be provided above the substrate. Systems and methods including a plurality of distributed chamber inlets are disclosed, as are numerous other aspects.

Abstract translation: 转印室气体净化装置被公开。 传送室气体净化装置具有适于容纳传送机器人的至少一部分的传送室，传送室包括侧壁，室盖和室底板，其中室盖具有多个分布的室入口。 多个分布室入口可以包括扩散元件。 层叠吹扫气流可以设置在衬底上。 公开了包括多个分布式室入口的系统和方法，以及许多其它方面。