MATCHING PUPIL DETERMINATION
    5.
    发明申请

    公开(公告)号:US20220404718A1

    公开(公告)日:2022-12-22

    申请号:US17896892

    申请日:2022-08-26

    IPC分类号: G03F7/20

    摘要: A method for reducing apparatus performance variation. The method includes obtaining (i) a reference performance (e.g., CD) of a reference apparatus (e.g, a reference scanner), (ii) a set of initial leading degrees of freedom selected from a plurality of degrees of freedom of a plurality of pupil facet mirrors of an apparatus (e.g., to be matched scanner) that is selected to reproduce the reference performance, and (iii) exposure data related to one or more parameters (e.g., CD, overlay, focus, etc.) of the patterning process indicating a performance of the apparatus based on the set of initial leading degrees of freedom; and determining a matching pupil of the apparatus based on the set of initial leading degrees of freedom and the exposure data such that the matching pupil reduces a difference between the performance of the apparatus and the reference performance.

    PATTERNING STACK OPTIMIZATION
    6.
    发明申请

    公开(公告)号:US20190204749A1

    公开(公告)日:2019-07-04

    申请号:US16325228

    申请日:2017-08-02

    IPC分类号: G03F7/20

    摘要: A method of tuning a patterning stack, the method including: defining a function that measures how a parameter representing a physical characteristic pertaining to a pattern transferred into a patterning stack on a substrate is affected by change in a patterning stack variable, the patterning stack variable representing a physical characteristic of a material layer of the patterning stack; varying, by a hardware computer system, the patterning stack variable and evaluating, by the hardware computer system, the function with respect to the varied patterning stack variable, until a termination condition is satisfied; and outputting a value of the patterning stack variable when the termination condition is satisfied.

    Inspection Apparatus, Inspection Method, Lithographic Apparatus and Manufacturing Method
    7.
    发明申请
    Inspection Apparatus, Inspection Method, Lithographic Apparatus and Manufacturing Method 有权
    检验仪器,检验方法,平版印刷设备及制造方法

    公开(公告)号:US20170023867A1

    公开(公告)日:2017-01-26

    申请号:US15214067

    申请日:2016-07-19

    IPC分类号: G03F7/20 G01B11/27 G01B11/02

    摘要: Disclosed is a method of monitoring a lithographic process parameter, such as focus and/or dose, of a lithographic process. The method comprises acquiring a first and a second target measurement using respectively a first measurement configuration and a second measurement configuration, and determining the lithographic process parameter from a first metric derived from said first target measurement and said second target measurement. The first metric may be difference. Also disclosed are corresponding measurement and lithographic apparatuses, a computer program and a method of manufacturing devices.

    摘要翻译: 公开了一种监测光刻工艺参数的方法,例如光刻工艺的焦点和/或剂量。 该方法包括分别采用第一测量配置和第二测量配置获取第一和第二目标测量,以及根据从所述第一目标测量和所述第二目标测量导出的第一度量来确定光刻处理参数。 第一个度量可能是不同的。 还公开了相应的测量和光刻设备,计算机程序和制造设备的方法。

    PROCESS WINDOW BASED ON DEFECT PROBABILITY
    8.
    发明公开

    公开(公告)号:US20240126181A1

    公开(公告)日:2024-04-18

    申请号:US18511454

    申请日:2023-11-16

    IPC分类号: G03F7/00

    摘要: A method including obtaining (i) measurements of a parameter of the feature, (ii) data related to a process variable of a patterning process, (iii) a functional behavior of the parameter defined as a function of the process variable based on the measurements of the parameter and the data related to the process variable, (iv) measurements of a failure rate of the feature, and (v) a probability density function of the process variable for a setting of the process variable, converting the probability density function of the process variable to a probability density function of the parameter based on a conversion function, where the conversion function is determined based on the function of the process variable, and determining a parameter limit of the parameter based on the probability density function of the parameter and the measurements of the failure rate.