Micro benchtop optics by bulk silicon micromachining
    1.
    发明授权
    Micro benchtop optics by bulk silicon micromachining 失效
    微型台式光学器件通过体硅微加工

    公开(公告)号:US6071426A

    公开(公告)日:2000-06-06

    申请号:US986477

    申请日:1997-12-08

    摘要: Micromachining of bulk silicon utilizing the parallel etching characteristics of bulk silicon and integrating the parallel etch planes of silicon with silicon wafer bonding and impurity doping, enables the fabrication of on-chip optics with in situ aligned etched grooves for optical fibers, micro-lenses, photodiodes, and laser diodes. Other optical components that can be microfabricated and integrated include semi-transparent beam splitters, micro-optical scanners, pinholes, optical gratings, micro-optical filters, etc. Micromachining of bulk silicon utilizing the parallel etching characteristics thereof can be utilized to develop miniaturization of bio-instrumentation such as wavelength monitoring by fluorescence spectrometers, and other miniaturized optical systems such as Fabry-Perot interferometry for filtering of wavelengths, tunable cavity lasers, micro-holography modules, and wavelength splitters for optical communication systems.

    摘要翻译: 利用体硅的平行蚀刻特性并集成硅的平行蚀刻平面与硅晶片结合和杂质掺杂的体硅的微加工使得能够利用原位对准的用于光纤,微透镜的蚀刻凹槽来制造片上光学器件, 光电二极管和激光二极管。 可以进行微加工和集成的其他光学部件包括半透明分束器,微光学扫描仪,针孔,光栅,微光学滤光器等。可利用利用其平行蚀刻特性的体硅的微加工来开发小型化 诸如通过荧光光谱仪进行波长监测的生物仪器,以及诸如用于滤波波长的法布里 - 珀罗干涉法,可调谐腔激光器,微全息模块和光通信系统的波长分离器等小型化光学系统。

    Microminiature optical waveguide structure and method for fabrication
    2.
    发明授权
    Microminiature optical waveguide structure and method for fabrication 失效
    微型光波导结构及其制造方法

    公开(公告)号:US5846694A

    公开(公告)日:1998-12-08

    申请号:US600571

    申请日:1996-02-13

    摘要: A method for manufacturing low-cost, nearly circular cross section waveguides comprises starting with a substrate material that a molten waveguide material can not wet or coat. A thin layer is deposited of an opposite material that the molten waveguide material will wet and is patterned to describe the desired surface-contact path pedestals for a waveguide. A waveguide material, e.g., polymer or doped silica, is deposited. A resist material is deposited and unwanted excess is removed to form pattern masks. The waveguide material is etched away to form waveguide precursors and the masks are removed. Heat is applied to reflow the waveguide precursors into near-circular cross-section waveguides that sit atop the pedestals. The waveguide material naturally forms nearly circular cross sections due to the surface tension effects. After cooling, the waveguides will maintain the round shape. If the width and length are the same, then spherical ball lenses are formed. Alternatively, the pedestals can be patterned to taper along their lengths on the surface of the substrate. This will cause the waveguides to assume a conical taper after reflowing by heat.

    摘要翻译: 用于制造低成本,近圆形横截面波导的方法包括从熔融波导材料不能润湿或涂覆的基底材料开始。 沉积相对材料的薄层,熔融波导材料将被润湿并被图案化以描述用于波导的期望的表面 - 接触路径基座。 沉积波导材料,例如聚合物或掺杂二氧化硅。 沉积抗蚀剂材料并除去不想要的多余物以形成图案掩模。 将波导材料蚀刻掉以形成波导前体,并除去掩模。 施加热量以将波导前体重新流入位于基座顶部的近圆形横截面波导。 由于表面张力效应,波导材料自然形成近似圆形的横截面。 在冷却之后,波导将保持圆形。 如果宽度和长度相同,则形成球形球透镜。 或者,可以将基座图案化为沿其基板的表面上的长度逐渐变细。 这将导致波导在通过热回流之后呈现锥形锥形。

    Compact multiwavelength transmitter module for multimode fiber optic ribbon cable
    3.
    发明授权
    Compact multiwavelength transmitter module for multimode fiber optic ribbon cable 失效
    用于多模光纤带状电缆的紧凑型多波长发射器模块

    公开(公告)号:US06419404B1

    公开(公告)日:2002-07-16

    申请号:US09607992

    申请日:2000-06-30

    IPC分类号: G02B636

    摘要: A compact multiwavelength transmitter module for multimode fiber optic ribbon cable, which couples light from an M×N array of emitters onto N fibers, where the M wavelength may be distributed across two or more vertical-cavity surface-emitting laser (VCSEL) chips, and combining emitters and multiplexer into a compact package that is compatible with placement on a printed circuit board. A key feature is bringing together two emitter arrays fabricated on different substrates—each array designed for a different wavelength—into close physical proximity. Another key feature is to compactly and efficiently combine the light from two or more clusters of optical emitters, each in a different wavelength band, into a fiber ribbon.

    摘要翻译: 用于多模光纤带状电缆的紧凑型多波长发射器模块,其将来自MxN阵列的发射器的光耦合到N个光纤上,其中M波长可以分布在两个或更多个垂直腔表面发射激光器(VCSEL)芯片上,并且组合 发射器和多路复用器转换成与印刷电路板上的放置兼容的紧凑型封装。 一个关键特征是将在不同衬底上制造的两个发射极阵列组合在一起,每个阵列设计为不同的波长 - 成为紧密的物理接近。 另一个关键特征是将来自两个或更多个不同波长带的光发射器簇的光紧凑且有效地组合成光纤带。

    Enhanced vbasis laser diode package
    5.
    发明授权
    Enhanced vbasis laser diode package 有权
    增强型vbasis激光二极管封装

    公开(公告)号:US08811445B2

    公开(公告)日:2014-08-19

    申请号:US12748724

    申请日:2010-03-29

    IPC分类号: H01S5/00

    摘要: A substrate having an upper surface and a lower surface is provided. The substrate includes a plurality of v-grooves formed in the upper surface. Each v-groove includes a first side and a second side perpendicular to the first side. A laser diode bar assembly is disposed within each of the v-grooves and attached to the first side. The laser diode bar assembly includes a first adhesion layer disposed on the first side of the v-groove, a metal plate attached to the first adhesion layer, a second adhesion layer disposed over the metal plate, and a laser diode bar attached to the second adhesion layer. The laser diode bar has a coefficient of thermal expansion (CTE) substantially similar to that of the metal plate.

    摘要翻译: 提供具有上表面和下表面的基板。 基板包括形成在上表面中的多个V形槽。 每个V形槽包括垂直于第一侧的第一侧和第二侧。 激光二极管棒组件设置在每个V形槽内并且附接到第一侧。 所述激光二极管棒组件包括设置在所述V形槽的第一侧上的第一粘附层,附着到所述第一粘合层的金属板,设置在所述金属板上的第二粘附层,以及附接到所述第二粘合层的所述第二粘合层 粘附层。 激光二极管棒的热膨胀系数(CTE)基本上类似于金属板的热膨胀系数。

    ENHANCED VBASIS LASER DIODE PACKAGE
    6.
    发明申请
    ENHANCED VBASIS LASER DIODE PACKAGE 有权
    增强型VBASIS激光二极管封装

    公开(公告)号:US20110235669A1

    公开(公告)日:2011-09-29

    申请号:US12748724

    申请日:2010-03-29

    IPC分类号: H01S5/40 H01L21/50

    摘要: A substrate having an upper surface and a lower surface is provided. The substrate includes a plurality of v-grooves formed in the upper surface. Each v-groove includes a first side and a second side perpendicular to the first side. A laser diode bar assembly is disposed within each of the v-grooves and attached to the first side. The laser diode bar assembly includes a first adhesion layer disposed on the first side of the v-groove, a metal plate attached to the first adhesion layer, a second adhesion layer disposed over the metal plate, and a laser diode bar attached to the second adhesion layer. The laser diode bar has a coefficient of thermal expansion (CTE) substantially similar to that of the metal plate.

    摘要翻译: 提供具有上表面和下表面的基板。 基板包括形成在上表面中的多个V形槽。 每个V形槽包括垂直于第一侧的第一侧和第二侧。 激光二极管棒组件设置在每个V形槽内并且附接到第一侧。 所述激光二极管棒组件包括设置在所述V形槽的第一侧上的第一粘附层,附着到所述第一粘合层的金属板,设置在所述金属板上的第二粘附层,以及附接到所述第二粘合层的所述第二粘合层 粘附层。 激光二极管棒的热膨胀系数(CTE)基本上类似于金属板的热膨胀系数。

    Optical add/drop filter for wavelength division multiplexed systems
    8.
    发明授权
    Optical add/drop filter for wavelength division multiplexed systems 失效
    用于波分复用系统的光分插滤波器

    公开(公告)号:US06493484B1

    公开(公告)日:2002-12-10

    申请号:US09281742

    申请日:1999-03-30

    IPC分类号: G02B626

    摘要: An optical add/drop filter for wavelength division multiplexed systems and construction methods are disclosed. The add/drop filter includes a first ferrule having a first pre-formed opening for receiving a first optical fiber; an interference filter oriented to pass a first set of wavelengths along the first optical fiber and reflect a second set of wavelengths; and, a second ferrule having a second pre-formed opening for receiving the second optical fiber, and the reflected second set of wavelengths. A method for constructing the optical add/drop filter consists of the steps of forming a first set of openings in a first ferrule; inserting a first set of optical fibers into the first set of openings; forming a first set of guide pin openings in the first ferrule; dividing the first ferrule into a first ferrule portion and a second ferrule portion; forming an interference filter on the first ferrule portion; inserting guide pins through the first set of guide pin openings in the first ferrule portion and second ferrule portion to passively align the first set of optical fibers; removing material such that light reflected from the interference filter from the first set of optical fibers is accessible; forming a second set of openings in a second ferrule; inserting a second set of optical fibers into the second set of openings; and positioning the second ferrule with respect to the first ferrule such that the second set of optical fibers receive the light reflected from the interference filter.

    摘要翻译: 公开了一种用于波分复用系统和施工方法的光分插滤波器。 所述分/滴过滤器包括具有用于接收第一光纤的第一预成形开口的第一套圈; 干涉滤光器,其被定向成沿着所述第一光纤传递第一组波长并反射第二组波长; 以及具有用于接收第二光纤的第二预成形开口和反射的第二组波长的第二套圈。 一种用于构造光学分/滴滤光器的方法包括在第一套圈中形成第一组开口的步骤; 将第一组光纤插入到所述第一组开口中; 在所述第一套圈中形成第一组引导销开口; 将第一套圈分成第一套圈部分和第二套圈部分; 在所述第一套圈部分上形成干涉滤光器; 将引导销穿过第一套圈部分中的第一组引导销开口和第二套圈部分,以被动对准第一组光纤; 去除材料使得能够接近来自第一组光纤的从干涉滤光器反射的光; 在第二套圈中形成第二组开口; 将第二组光纤插入所述第二组开口中; 以及将所述第二套圈相对于所述第一套圈定位,使得所述第二组光纤接收从所述干涉滤光器反射的光。

    Integrated semiconductor waveguide/photodetector
    9.
    发明授权
    Integrated semiconductor waveguide/photodetector 失效
    集成半导体波导/光电探测器

    公开(公告)号:US5006906A

    公开(公告)日:1991-04-09

    申请号:US237087

    申请日:1988-08-29

    申请人: Robert J. Deri

    发明人: Robert J. Deri

    摘要: An integrated waveguide/detector optical device is fabricated on a semiconductor substrate whose surface includes a step region. Guiding and absorbing layers are grown on the surface in sequence overlying the step region. This is done in a single epitaxial growth cycle. The absorbing layer is patterned to form a non-planar detector that overlies the guiding layer in the step region. Due to bending of the guiding layer in the step region, a strong coupling exists between the overlying detector and light propagating in the guiding layer. Easily fabricated integrated devices having short-length (high-speed) photodetectors are thereby made feasible.

    摘要翻译: 集成的波导/检测器光学器件制造在其表面包括台阶区域的半导体衬底上。 引导层和吸收层在表面上顺序生长,覆盖在台阶区域上。 这是在单个外延生长周期中完成的。 将吸收层图案化以形成覆盖步进区域中的引导层的非平面检测器。 由于步进区域中的引导层的弯曲,上覆检测器和在引导层中传播的光之间存在强耦合。 因此,具有短长度(高速)光电检测器的易于制造的集成器件变得可行。