公开(公告)号：US10080277B1

公开(公告)日：2018-09-18

申请号：US15920915

申请日：2018-03-14

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09

Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

公开(公告)号：US09942984B1

公开(公告)日：2018-04-10

申请号：US15664031

申请日：2017-07-31

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/09 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/09 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/028 ,  H05K1/0393 ,  H05K9/0084 ,  H05K2201/0715 ,  H05K2201/0723

Abstract: A signal attenuation reduction structure for a flexible circuit board includes a conductive paste coating zones formed on surfaces of high-frequency signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to a pair of high-frequency signal lines or covers a plurality of pairs of the high-frequency signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

公开(公告)号：US09398692B2

公开(公告)日：2016-07-19

申请号：US14446605

申请日：2014-07-30

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/118 ,  H05K1/0215 ,  H05K1/113 ,  H05K1/144 ,  H05K2201/058

Abstract: An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.

Abstract translation: 公开了用于电连接重叠的柔性电路板的导电迹线的互连导电结构。 重叠的柔性电路板包括第一柔性电路板和第二柔性电路板。 在第二柔性电路板中形成通孔，并且在第二柔性电路板的通孔中填充互连导电部件。 互连导电构件电连接到第二柔性电路板的第二焊盘和第一柔性电路板的第一焊盘，以便在第一柔性电路板和第二柔性电路板的导电迹线之间形成重叠连接 板。

公开(公告)号：US09155208B2

公开(公告)日：2015-10-06

申请号：US14138383

申请日：2013-12-23

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K3/4061 ,  H05K1/0283 ,  H05K1/115 ,  H05K1/118 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/1572

Abstract: A conductive connection structure for a conductive wiring layer of a flexible circuit board includes a first through hole and a second through hole formed in a lamination structure including a conductive wiring layer, a first covering layer, and a second covering layer. The first through hole extends through the first covering layer and the conductive wiring layer. The second through hole extends through the second covering layer. The second through hole is formed at a location corresponding to an exposed zone on a second surface of the conductive wiring layer and communicates with the first through hole. A first conductive paste layer is formed on a surface of the first covering layer and fills in the first through hole to form a pillar portion in the first through hole. The pillar portion has a bottom end forming a curved cap. The exposed zone of the second surface of the conductive wiring layer is at least partially covered by the curved cap.

Abstract translation: 用于柔性电路板的导电布线层的导电连接结构包括形成在包括导电布线层，第一覆盖层和第二覆盖层的叠层结构中的第一通孔和第二通孔。 第一通孔延伸穿过第一覆盖层和导电布线层。 第二通孔延伸穿过第二覆盖层。 第二通孔形成在与导电布线层的第二表面上的暴露区相对应的位置处，并与第一通孔连通。 第一导电浆料层形成在第一覆盖层的表面上并填充在第一通孔中，以在第一通孔中形成柱部分。 柱部具有形成弯曲帽的底端。 导电布线层的第二表面的暴露区域至少部分被弯曲的盖子覆盖。

公开(公告)号：US09077168B2

公开(公告)日：2015-07-07

申请号：US13690344

申请日：2012-11-30

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin ,  Kuo-Fu Su

IPC: H01B7/08 ,  H02G15/08 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H02G15/08 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09254

Abstract: A differential mode signal transmission module includes a first section having an external connection end on which at least a pair of differential mode signal transmission terminals are formed and includes a grounding terminal, a first differential mode signal terminal, and a second differential mode signal terminal. The extension connection end of the first section forms a counterpart signal terminals corresponding to those of the external connection end. At least one first conductive connection line is formed on the first section. The conductive connection line connects the grounding terminal of the external connection end of the first section to a collective grounding point. The extension connection end of the first section is connected to an extension section. The extension section is further connected to a second section opposite to the first section. The extension section includes at least one slit line in order to form a bundled section. The first section, the second section, and the extension section include at least one fold line.

Abstract translation: 差分模式信号传输模块包括具有外部连接端的第一部分，在该第一部分上形成有至少一对差模信号传输端子，并且包括接地端子，第一差分模式信号端子和第二差分模式信号端子。 第一部分的延伸连接端形成与外部连接端对应的对应信号端子。 在第一部分上形成至少一个第一导电连接线。 导电连接线将第一部分的外部连接端的接地端子连接到集合接地点。 第一部分的延伸连接端连接到扩展部分。 延伸部分进一步连接到与第一部分相对的第二部分。 延伸部分包括至少一条狭缝线以形成捆扎部分。 第一部分，第二部分和扩展部分包括至少一个折线。

公开(公告)号：US09462685B2

公开(公告)日：2016-10-04

申请号：US14090157

申请日：2013-11-26

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin ,  Kuo-Fu Su ,  Chih-Heng Chuo

IPC: H05K1/02 ,  B29C53/04

CPC classification number: H05K1/028 ,  B29C53/04 ,  H05K2201/051 ,  H05K2201/056 ,  H05K2201/057 ,  H05K2201/09063 ,  H05K2203/0195 ,  Y10T29/49826

Abstract: Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.

Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组合的方法和结构。 通过将预折线作为中心线来处理预成形的柔性电路板，以将柔性电路板的连接部分朝向端子分配部分折叠。 然后，将连接部朝向端子分配部的方向卷绕，以使连接部形成卷边体。 然后将卷绕的物体穿过铰链组件的孔，以使轧制体完全延伸穿过铰链组件的孔，使得柔性电路板的延伸部分定位在铰链组件的孔中，并且第一端 并且第二端分别位于铰链组件的孔的相对侧。

公开(公告)号：US09433086B2

公开(公告)日：2016-08-30

申请号：US14283372

申请日：2014-05-21

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K2201/09063 ,  H05K2201/09145

Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.

Abstract translation: 公开了一种用于柔性电路板的撕裂保护结构。 在柔性电路板的延伸部中，至少形成有切割线。 切割线至少具有应力分流切割部分从该终端延伸的终端。 应力转向切割段通过沿切割方向切割形成，该切割方向限定相对于延伸部分的延伸方向的角度，以用作柔性电路板的撕裂保护结构。 柔性电路板的延伸部分沿着切口线可折叠。 应力转向切割段还可以包括在其终止端中形成的撕裂保护孔。

公开(公告)号：US09386692B2

公开(公告)日：2016-07-05

申请号：US14704196

申请日：2015-05-05

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/0394 ,  H05K2201/041 ,  H05K2201/055 ,  H05K2201/09481

Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Abstract translation: 提供了一种用于柔性电路板的电源路径结构，并且包括第一柔性电路板，其包括至少一个第一连接焊盘和第一相对连接焊盘以及连接在第一连接焊盘和第一相对连接之间的第一电源路径 垫和第二柔性电路板，其包括连接在第二连接焊盘和第二相对连接焊盘之间的至少一个第二连接焊盘和第二相对连接焊盘和第二电源路径。 第一柔性电路板在垂直方向上堆叠在第二柔性电路板上，使得第一电源路径和第二电源路径形成用作电源路径的并联连接的电源路径，或者 第一柔性电路板的接地路径。

公开(公告)号：US09204561B2

公开(公告)日：2015-12-01

申请号：US14307652

申请日：2014-06-18

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H01K3/10 ,  H05K3/42 ,  H05K3/00

CPC classification number: H05K1/115 ,  H05K1/028 ,  H05K1/0298 ,  H05K3/002 ,  H05K3/426 ,  Y10T29/49165

Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Abstract translation: 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。

公开(公告)号：US09041482B2

公开(公告)日：2015-05-26

申请号：US14108838

申请日：2013-12-17

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin ,  Kuo-Fu Su ,  Chih-Heng Chuo

IPC: H03H7/38 ,  H01P1/22 ,  H01P3/02 ,  H05K1/00

CPC classification number: H01P1/22 ,  H01P1/227 ,  H01P3/026 ,  H03H7/38 ,  H05K1/00 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/0393 ,  H05K2201/0969 ,  H05K2201/09827

Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.

Abstract translation: 柔性电路板的高频信号传输线的衰减减小控制结构包括形成在基板的表面上的阻抗控制层。 阻抗控制层包括沿着衬底的高频信号传输线的延伸方向布置的衰减减小图案，并且对应于高频信号传输线的底角结构，以便改善高频信号传输线的衰减， 频率信号通过高频信号传输线路传输。 基板的相对表面包括形成在其上的导电屏蔽层。 导电屏蔽层形成有对应于高频信号传输线的顶角结构的衰减减小图案。