摘要:
According to an embodiment, a semiconductor light emitting device includes a semiconductor layer having a light emitting layer. The device also includes a p-side electrode provided on a first region including the light emitting layer; an n-side electrode provided on a second region layer not including the light emitting layer; and a first insulating film having a first opening communicating with the p-side electrode and a second opening communicating with the n-side electrode. A p-side interconnection is provided on the first insulating film and electrically connected to the p-side electrode through the first opening. An n-side interconnection is provided on the first insulating film and electrically connected to the n-side electrode through the second opening. The p-side interconnection has a plurality of protrusive parts protruding toward the n-side interconnection, and the n-side interconnection has a plurality of portions extending between the protrusive parts of the p-side interconnection.
摘要:
According to an embodiment, a semiconductor light emitting device includes a semiconductor layer including a light emitting layer and a fluorescent substance excited by light emitted from the light emitting layer, a peak wavelength of a radiation spectrum of the light emitting layer at a room temperature being shorter than a peak wavelength of an excitation spectrum of the fluorescent substance.
摘要:
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode, a phosphor layer, and a transparent film. The semiconductor layer has a first face, a second face opposite to the first face, and a light emitting layer. The p-side electrode is provided on the second face in an area including the light emitting layer. The n-side electrode is provided on the second face in an area not including the light emitting layer. The phosphor layer is provided on the first face. The phosphor layer includes a transparent resin and phosphor dispersed in the transparent resin. The transparent film is provided on the phosphor layer and has an adhesiveness lower than an adhesiveness of the transparent resin.
摘要:
According to one embodiment, a light emitting module includes a mounting substrate, a plurality of light emitting chips, a transparent layer, and a phosphor layer. The transparent layer is provided between the plurality of light emitting chips on the mounting face and on the light emitting chip. The transparent layer has a first transparent body and a scattering agent dispersed at least in the first transparent body between the plurality of light emitting chips. The scattering agent has a different refraction index from a refraction index of the first transparent body. The phosphor layer is provided on the transparent layer. The light emitting chip includes a semiconductor layer, a p-side electrode, an n-side electrode, a p-side external terminal, and an n-side external terminal.
摘要:
According to one embodiment, a semiconductor light emitting device includes a light emitting element, a phosphor layer, and a fluorescent reflection film. The phosphor layer has a transparent medium, a phosphor dispersed in the transparent medium, and a particle dispersed in the transparent medium. The phosphor is excited by the excitation light so as to emit a fluorescence. The particle is a magnitude of not more than 1/10 a wavelength of the excitation light. The particle has a different refractive index from a refractive index of the transparent medium. The fluorescent reflection film is provided between the light emitting element and the phosphor layer. The fluorescent reflection film has a higher reflectance with respect to a fluorescent wavelength of the phosphor, than a reflectance with respect to the wavelength of the excitation light.
摘要:
A semiconductor light emitting device includes a semiconductor layer including a light emitting layer, a p-side electrode provided on a second surface of the semiconductor layer, and an n-side electrode provided on the semiconductor layer to be separated from the p-side electrode. The p-side electrode includes a plurality of contact metal selectively provided on the semiconductor layer in contact with the second surface, a transparent film provided on the semiconductor layer in contact with the second surface between the plurality of contact metal, and a reflective metal provided on the contact metal and on the transparent film in contact with the contact metal, the reflective metal including silver. A surface area of a surface of the reflective metal on the light emitting layer side is greater than the sum total of a surface area of the plurality of contact metal contacting the semiconductor layer.
摘要:
According to one embodiment, an optical transmitter/receiver circuit device includes a transmitter circuit including a transition time adjusting circuit to obtain a second voltage signal from a first voltage signal and a voltage-current converter circuit that converts the second voltage signal to a first current signal, a light-emitting element to convert the first current signal to an optical signal, a light-receiving element to convert the optical signal to a second current signal, and a receiver circuit including a current-voltage converter circuit that converts the second current signal to a third voltage signal, a pulse generation circuit to generate rise and fall pulse from the third voltage signal and a decoder circuit that generates a fourth voltage signal in synchronism with the pulse.
摘要:
An optical/electrical composite cable in which a first connector having an optical transmission unit is connected to a second connector having an optical reception unit via an electrical wire and optical wiring line is provided. The optical transmission unit and optical reception unit are driven by electrical power supplied from an external electronic device. A detection unit that detects a removal/attachment operation of at least one of the first and second connectors and an interruption unit that interrupts supply of electrical power to the optical transmission unit and optical reception unit when the removal/attachment operation is detected by the detection unit are provided.
摘要:
An optical/electrical composite cable in which a first connector having an optical transmission unit is connected to a second connector having an optical reception unit via an electrical wire and an optical wiring line includes a state detection unit that detects a connection state of the first connector, a connection state of the second connector, a power supply state of a transmission-side electronic device connected to the first connector and a power supply state of a reception-side electronic device connected to the second connector, and an electrical power supply control unit that controls supply of electrical power to the optical transmission unit and optical reception unit according to the detected states.
摘要:
An optical connector for connecting a pair of coated optical fibers, each of which comprises an exposed leading end of optical fiber, including: a connector body having a fine hole portion for housing and mutually butting the exposed leading ends of the pair of coated optical fibers, a first receiving portion and a second receiving portion, which are disposed at both outer sides in the axial direction of the fine hole portion, for housing the individual coated optical fibers without pressing the coating, and a holding portion, which is disposed at an outer side in the axial direction of the fine hole portion and at a side of the first receiving portion against the fine hole portion, for housing one of the coated optical fibers and holding the coated optical fiber by pressing the coating; and a process for connecting a pair of coated optical fibers using the connector.