Semiconductor light emitting device and light emitting module
    1.
    发明授权
    Semiconductor light emitting device and light emitting module 失效
    半导体发光器件和发光模块

    公开(公告)号:US08648375B2

    公开(公告)日:2014-02-11

    申请号:US13601336

    申请日:2012-08-31

    IPC分类号: H01L33/00

    CPC分类号: H01L33/505

    摘要: According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer including a first and second surfaces, and a light emitting layer; a p-side electrode provided on the second surface; an n-side electrode provided on the second surface; a first insulating film covering the p-side and the n-side electrodes; a p-side wiring section electrically connected to the p-side electrode through the first insulating film; an n-side wiring section electrically connected to the n-side electrode through the first insulating film; and a phosphor layer provided on the first surface. The phosphor layer has an upper surface and an oblique surface, the oblique surface forming an obtuse angle with the upper surface and inclined with respect to the first surface. Thickness of the phosphor layer immediately below the oblique surface is smaller than thickness of the phosphor layer immediately below the upper surface.

    摘要翻译: 根据一个实施例,半导体发光器件包括:包括第一和第二表面的半导体层和发光层; 设置在第二表面上的p侧电极; 设置在所述第二表面上的n侧电极; 覆盖p侧和n侧电极的第一绝缘膜; 通过第一绝缘膜电连接到p侧电极的p侧布线部分; 通过第一绝缘膜与n侧电极电连接的n侧配线部; 以及设置在第一表面上的荧光体层。 荧光体层具有上表面和倾斜表面,倾斜表面与上表面形成钝角并相对于第一表面倾斜。 斜面正下方的荧光体层的厚度小于上表面正下方的荧光体层的厚度。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
    2.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 有权
    半导体发光器件及其制造方法

    公开(公告)号:US20130313588A1

    公开(公告)日:2013-11-28

    申请号:US13601568

    申请日:2012-08-31

    IPC分类号: H01L33/52

    摘要: According to an embodiment, a semiconductor light emitting device includes a semiconductor layer having a light emitting layer. The device also includes a p-side electrode provided on a first region including the light emitting layer; an n-side electrode provided on a second region layer not including the light emitting layer; and a first insulating film having a first opening communicating with the p-side electrode and a second opening communicating with the n-side electrode. A p-side interconnection is provided on the first insulating film and electrically connected to the p-side electrode through the first opening. An n-side interconnection is provided on the first insulating film and electrically connected to the n-side electrode through the second opening. The p-side interconnection has a plurality of protrusive parts protruding toward the n-side interconnection, and the n-side interconnection has a plurality of portions extending between the protrusive parts of the p-side interconnection.

    摘要翻译: 根据实施例,半导体发光器件包括具有发光层的半导体层。 该装置还包括设置在包括发光层的第一区域上的p侧电极; 设置在不包括发光层的第二区域层上的n侧电极; 以及具有与p侧电极连通的第一开口的第一绝缘膜和与n侧电极连通的第二开口。 p侧互连设置在第一绝缘膜上,并通过第一开口与p侧电极电连接。 n侧互连设置在第一绝缘膜上,并通过第二开口与n侧电极电连接。 p侧互连具有向n侧互连突出的多个突出部,并且n侧互连具有在p侧互连的突出部之间延伸的多个部分。

    SEMICONDUCTOR LIGHT EMITTING DEVICE
    3.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    半导体发光器件

    公开(公告)号:US20130285090A1

    公开(公告)日:2013-10-31

    申请号:US13598393

    申请日:2012-08-29

    IPC分类号: H01L33/40

    摘要: According to one embodiment, a semiconductor light emitting device includes a light emitting element, a phosphor layer, and a fluorescent reflection film. The phosphor layer has a transparent medium, a phosphor dispersed in the transparent medium, and a particle dispersed in the transparent medium. The phosphor is excited by the excitation light so as to emit a fluorescence. The particle is a magnitude of not more than 1/10 a wavelength of the excitation light. The particle has a different refractive index from a refractive index of the transparent medium. The fluorescent reflection film is provided between the light emitting element and the phosphor layer. The fluorescent reflection film has a higher reflectance with respect to a fluorescent wavelength of the phosphor, than a reflectance with respect to the wavelength of the excitation light.

    摘要翻译: 根据一个实施例,半导体发光器件包括发光元件,荧光体层和荧光反射膜。 荧光体层具有透明介质,分散在透明介质中的荧光体和分散在透明介质中的粒子。 荧光体被激发光激发,从而发出荧光。 粒子的大小不大于激发光的波长的1/10。 该颗粒具有与透明介质的折射率不同的折射率。 荧光反射膜设置在发光元件和荧光体层之间。 荧光反射膜相对于荧光体的荧光波长具有比相对于激发光的波长的反射率更高的反射率。

    SEMICONDUCTOR LIGHT EMITTING DEVICE
    5.
    发明申请

    公开(公告)号:US20130146909A1

    公开(公告)日:2013-06-13

    申请号:US13547561

    申请日:2012-07-12

    IPC分类号: H01L33/60

    摘要: A semiconductor light emitting device includes a semiconductor layer including a light emitting layer, a p-side electrode provided on a second surface of the semiconductor layer, and an n-side electrode provided on the semiconductor layer to be separated from the p-side electrode. The p-side electrode includes a plurality of contact metal selectively provided on the semiconductor layer in contact with the second surface, a transparent film provided on the semiconductor layer in contact with the second surface between the plurality of contact metal, and a reflective metal provided on the contact metal and on the transparent film in contact with the contact metal, the reflective metal including silver. A surface area of a surface of the reflective metal on the light emitting layer side is greater than the sum total of a surface area of the plurality of contact metal contacting the semiconductor layer.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20130020706A1

    公开(公告)日:2013-01-24

    申请号:US13423081

    申请日:2012-03-16

    IPC分类号: H01L23/52 H01L21/31

    摘要: In accordance with an embodiment, a semiconductor device includes a substrate, a line-and-space structure, a first film and a second film. The line-and-space structure includes line patterns arranged on the substrate parallel to one another at a predetermined distance. The first film is formed on side surfaces and bottom surfaces of the line patterns by an insulating film material. The second film is formed on the line-and-space structure across a space between the line patterns by a material showing low wettability to the first film. Space between the line patterns includes an air gap in which at least a bottom surface of the first film is totally exposed.

    摘要翻译: 根据实施例,半导体器件包括衬底,线间距结构,第一膜和第二膜。 线间空间结构包括以预定距离彼此平行布置在基板上的线图案。 第一膜通过绝缘膜材料形成在线图案的侧表面和底表面上。 通过对第一膜显示低润湿性的材料,在线图形之间的空间结构上形成第二膜。 线图案之间的空间包括其中至少第一膜的底表面完全暴露的气隙。

    Semiconductor light emitting device and method for manufacturing same
    8.
    发明授权
    Semiconductor light emitting device and method for manufacturing same 有权
    半导体发光器件及其制造方法

    公开(公告)号:US09153746B2

    公开(公告)日:2015-10-06

    申请号:US13601568

    申请日:2012-08-31

    摘要: According to an embodiment, a semiconductor light emitting device includes a semiconductor layer having a light emitting layer. The device also includes a p-side electrode provided on a first region including the light emitting layer; an n-side electrode provided on a second region layer not including the light emitting layer; and a first insulating film having a first opening communicating with the p-side electrode and a second opening communicating with the n-side electrode. A p-side interconnection is provided on the first insulating film and electrically connected to the p-side electrode through the first opening. An n-side interconnection is provided on the first insulating film and electrically connected to the n-side electrode through the second opening. The p-side interconnection has a plurality of protrusive parts protruding toward the n-side interconnection, and the n-side interconnection has a plurality of portions extending between the protrusive parts of the p-side interconnection.

    摘要翻译: 根据实施例,半导体发光器件包括具有发光层的半导体层。 该装置还包括设置在包括发光层的第一区域上的p侧电极; 设置在不包括发光层的第二区域层上的n侧电极; 以及具有与p侧电极连通的第一开口的第一绝缘膜和与n侧电极连通的第二开口。 p侧互连设置在第一绝缘膜上,并通过第一开口与p侧电极电连接。 n侧互连设置在第一绝缘膜上,并通过第二开口与n侧电极电连接。 p侧互连具有向n侧互连突出的多个突出部,并且n侧互连具有在p侧互连的突出部之间延伸的多个部分。

    Semiconductor light emitting device and manufacturing method of the same
    9.
    发明授权
    Semiconductor light emitting device and manufacturing method of the same 有权
    半导体发光器件及其制造方法

    公开(公告)号:US08957402B2

    公开(公告)日:2015-02-17

    申请号:US13597096

    申请日:2012-08-28

    IPC分类号: H01L29/06

    摘要: According to one embodiment, a semiconductor light emitting device includes a first nitride semiconductor layer, a nitride semiconductor light emitting layer, a second nitride semiconductor layer, a p-side electrode, and an n-side electrode. The nitride semiconductor light emitting layer is provided on the p-side region of the second face of the first nitride semiconductor layer. The second nitride semiconductor layer is provided on the nitride semiconductor light emitting layer. The p-side electrode is provided on the second nitride semiconductor layer. The n-side electrode is provided on the n-side region of the second face of the first nitride semiconductor layer. The nitride semiconductor light emitting layer has a first concave-convex face in a side of the first nitride semiconductor layer, and a second concave-convex face in a side of the second nitride semiconductor layer.

    摘要翻译: 根据一个实施例,半导体发光器件包括第一氮化物半导体层,氮化物半导体发光层,第二氮化物半导体层,p侧电极和n侧电极。 氮化物半导体发光层设置在第一氮化物半导体层的第二面的p侧区域上。 第二氮化物半导体层设置在氮化物半导体发光层上。 p侧电极设置在第二氮化物半导体层上。 n侧电极设置在第一氮化物半导体层的第二面的n侧区域上。 氮化物半导体发光层在第一氮化物半导体层的一侧具有第一凹凸面,在第二氮化物半导体层的侧面具有第二凹凸面。

    Light emitting module
    10.
    发明授权
    Light emitting module 有权
    发光模块

    公开(公告)号:US08907357B2

    公开(公告)日:2014-12-09

    申请号:US13597055

    申请日:2012-08-28

    IPC分类号: H01L29/18

    摘要: According to one embodiment, a light emitting module includes a mounting substrate, a plurality of light emitting chips, a transparent layer, and a phosphor layer. The transparent layer is provided between the plurality of light emitting chips on the mounting face and on the light emitting chip. The transparent layer has a first transparent body and a scattering agent dispersed at least in the first transparent body between the plurality of light emitting chips. The scattering agent has a different refraction index from a refraction index of the first transparent body. The phosphor layer is provided on the transparent layer. The light emitting chip includes a semiconductor layer, a p-side electrode, an n-side electrode, a p-side external terminal, and an n-side external terminal.

    摘要翻译: 根据一个实施例,发光模块包括安装基板,多个发光芯片,透明层和荧光体层。 透明层设置在安装面上的多个发光芯片和发光芯片之间。 透明层具有至少分散在多个发光芯片之间的第一透明体中的第一透明体和散射剂。 散射剂具有与第一透明体的折射率不同的折射率。 荧光体层设置在透明层上。 发光芯片包括半导体层,p侧电极,n侧电极,p侧外部端子和n侧外部端子。