公开(公告)号：US06332268B1

公开(公告)日：2001-12-25

申请号：US09254687

申请日：1999-03-16

申请人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

发明人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

IPC分类号： H05K330

CPC分类号： H01L21/67132 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

摘要： An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).

摘要翻译： IC芯片（2）可以在被保持在带状支撑构件（5）的同时被提供到预安装工艺，而不从带状支撑构件（5）取出。

公开(公告)号：US06207549B1

公开(公告)日：2001-03-27

申请号：US08940981

申请日：1997-09-30

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L2144

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US07071090B2

公开(公告)日：2006-07-04

申请号：US11073714

申请日：2005-03-08

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/44

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US20050146029A1

公开(公告)日：2005-07-07

申请号：US11073714

申请日：2005-03-08

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44 ,  H01L23/52

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

公开(公告)号：US06894387B2

公开(公告)日：2005-05-17

申请号：US09768246

申请日：2001-01-25

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US06370750B1

公开(公告)日：2002-04-16

申请号：US09807967

申请日：2001-06-25

申请人： Nobuya Matsumura ,  Shoji Sato ,  Akihiro Yamamoto ,  Yoshifumi Kitayama ,  Yoichi Nakamura

发明人： Nobuya Matsumura ,  Shoji Sato ,  Akihiro Yamamoto ,  Yoshifumi Kitayama ,  Yoichi Nakamura

IPC分类号： H01R4300

CPC分类号： H01L21/67132 ,  Y10T29/49128 ,  Y10T29/5193 ,  Y10T156/1734

摘要： The component (2) is first brought into point or line contact with the sheet (3) so as to avoid entrapment of air therebetween. The contact area between the component and the sheet is then gradually spread until the entire bottom surface of the component is adhered to the sheet.

摘要翻译： 首先将部件（2）与片材（3）进行点或线接触，以避免在其间夹带空气。 然后逐渐扩展部件和片材之间的接触面积，直到部件的整个底部表面粘附到片材上。

公开(公告)号：US5791484A

公开(公告)日：1998-08-11

申请号：US498767

申请日：1995-07-06

申请人： Junji Ikeda ,  Osamu Yamazaki ,  Youichi Nakamura ,  Yoshifumi Kitayama

发明人： Junji Ikeda ,  Osamu Yamazaki ,  Youichi Nakamura ,  Yoshifumi Kitayama

IPC分类号： H01L21/60 ,  B65D73/02 ,  H01G13/00 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04

CPC分类号： B65D73/02 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/10424 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K3/303 ,  Y02P70/611 ,  Y02P70/613 ,  Y10S206/813 ,  Y10S206/82

摘要： By a manufacturing method including a process of supplying a connection-releasable connecting material (4) onto a surface of a plurality of chip parts (3) and a process of connecting the plurality of chip parts (3) by the connecting material (4), there is formed a chip assembly (1) comprised of the plurality of chip parts (3) connected with each other by means of the releasable connecting material (4). Further provided is a method of preparing the chip assembly (1), a process of releasing connection achieved by the connecting material (4) between a target chip part and an adjacent chip part, and a process of mounting the target chip part separated through releasing of the connection onto a board and soldering the same, thereby providing chip parts capable of easily coping with an increase of operation speed of chip parts on the process of mounting line, achieving an improved space efficiency, and suppressing waste of resources.

摘要翻译： 通过一种制造方法，包括将连接可释放连接材料（4）供应到多个芯片部分（3）的表面上的过程和通过连接材料（4）连接多个芯片部分（3）的过程， 形成有由可释放的连接材料（4）彼此连接的多个芯片部分（3）组成的芯片组件（1）。 还提供了一种制备芯片组件（1）的方法，在目标芯片部分和相邻芯片部分之间释放通过连接材料（4）实现的连接的过程，以及通过释放分离安装目标芯片部分的过程 连接到电路板上并对其进行焊接，从而提供能够容易地应对在安装线路的工艺中芯片部件的运行速度的提高的芯片部件，实现提高的空间效率和抑制资源的浪费。

公开(公告)号：US5436503A

公开(公告)日：1995-07-25

申请号：US153108

申请日：1993-11-17

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  H01L23/48 ,  H01L29/41 ,  H01L29/47

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5240170A

公开(公告)日：1993-08-31

申请号：US894650

申请日：1992-06-05

申请人： Kazuto Nishida ,  Kazuhiro Nobori ,  Yoshifumi Kitayama ,  Keiji Saeki

发明人： Kazuto Nishida ,  Kazuhiro Nobori ,  Yoshifumi Kitayama ,  Keiji Saeki

IPC分类号： H01L23/495 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L23/49555 ,  H05K3/3421 ,  H01L2924/0002 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K2203/107 ,  H05K2203/306 ,  H05K3/303 ,  H05K3/3494 ,  Y02P70/613

摘要： A method for bonding leads of an IC component with electrodes of a circuit board includes the steps of using a mounting device to hold the IC component with flat portions of the leads inclined downward, mounting the IC component on the circuit board at a predetermined position thereof with the IC component held by the mounting device, moving the mounting device toward the circuit board to compress the IC component against the circuit board at the predetermined position while allowing the leads to flex to accommodate for nonuniformity in the heights of metal pieces to be bonded with the electrodes and bending of the circuit board. In this manner, the flat portions of the leads are brought into close contact with the electrodes. The leads are then irradiated with an optical beam so as to melt the metal pieces of the electrodes for bonding of the leads to the circuit board.

摘要翻译： 用于将IC部件的引线与电路板的电极接合的方法包括以下步骤：使用安装装置将引线的平坦部分保持在IC的下方，将IC部件安装在电路板上的预定位置 通过由安装装置保持的IC部件，将安装装置朝向电路板移动，以在预定位置处将IC部件压靠在电路板上，同时允许引线弯曲以适应待粘合的金属片的高度的不均匀性 与电极和电路板的弯曲。 以这种方式，引线的平坦部分与电极紧密接触。 然后用光束照射引线，以熔化用于将引线接合到电路板的电极的金属片。

公开(公告)号：US4447014A

公开(公告)日：1984-05-08

申请号：US352453

申请日：1982-02-25

申请人： Yusaku Azuma ,  Yoshifumi Kitayama ,  Chiaki Ozawa

发明人： Yusaku Azuma ,  Yoshifumi Kitayama ,  Chiaki Ozawa

IPC分类号： B29C67/00 ,  B29D30/00 ,  B29D30/08 ,  B29D30/30 ,  B29D30/44 ,  B65H75/00 ,  B65H75/02 ,  B65H17/02

CPC分类号： B29D30/0016 ,  B65H75/00 ,  B29D2030/0038

摘要： Herein disclosed is a tire component storing assembly, comprising in combination: a frame structure comprising a pair of side plate members spaced apart from and substantially in parallel with each other, a first reel having opposite end portions rotatably supported on the side plate members, respectively, of the frame structure, a second reel having opposite end portions rotatably supported on the side plate members, respectively, of the frame structure, the second reel spaced apart from and substantially in parallel with the first reel, and a liner sheet having one end wound on the first reel and the other end wound on the second reel to form layers thereon, whereby a tire component is wound on any one of the first and second reels while intervening between the layers of the liner sheet to be wound on any one of the first and second reels.

摘要翻译： 本发明公开了一种轮胎部件保持组件，其特征在于包括：一个框架结构，包括一对彼此间隔开并基本上彼此平行的侧板构件;第一卷轴，其分别可转动地支撑在侧板构件上 ，所述框架结构的第二卷轴具有分别可旋转地支撑在所述框架结构的侧板构件上的相对的端部部分，所述第二卷轴与所述第一卷轴间隔开并基本上与第一卷轴平行;以及衬板，其具有一端 缠绕在第一卷轴上，另一端缠绕在第二卷轴上以在其上形成层，由此轮胎部件缠绕在第一和第二卷轴中的任何一个上，同时插入待卷绕的衬垫层的层之间 第一和第二卷轴。