公开(公告)号：US06332268B1

公开(公告)日：2001-12-25

申请号：US09254687

申请日：1999-03-16

申请人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

发明人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

IPC分类号： H05K330

CPC分类号： H01L21/67132 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

摘要： An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).

摘要翻译： IC芯片（2）可以在被保持在带状支撑构件（5）的同时被提供到预安装工艺，而不从带状支撑构件（5）取出。

公开(公告)号：US06207549B1

公开(公告)日：2001-03-27

申请号：US08940981

申请日：1997-09-30

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L2144

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US07071090B2

公开(公告)日：2006-07-04

申请号：US11073714

申请日：2005-03-08

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/44

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US06894387B2

公开(公告)日：2005-05-17

申请号：US09768246

申请日：2001-01-25

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US20050146029A1

公开(公告)日：2005-07-07

申请号：US11073714

申请日：2005-03-08

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44 ,  H01L23/52

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

公开(公告)号：US06481616B2

公开(公告)日：2002-11-19

申请号：US09978872

申请日：2001-10-17

申请人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

发明人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

IPC分类号： B23K3102

CPC分类号： H01L21/68 ,  H01L21/321 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00

摘要： To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

摘要翻译： 为了消除电子零件的破损或接合不良，提高电子零件的可靠性，在凸块焊接装置中调节电子部件。 一种凸块接合装置，包括用于安装和加热电子部件的台架1和包括具有用于定位电子部件的侧面的可旋转调节板2的位置调节装置，具有用于与电子部件配合的侧面的板4 调节板和用于向调节板施加调节力以便将电子部件按压到板4的调节弹簧5。

公开(公告)号：US06328196B1

公开(公告)日：2001-12-11

申请号：US09202567

申请日：1998-12-17

申请人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

发明人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

IPC分类号： B23Q900

CPC分类号： H01L21/68 ,  H01L21/321 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00

摘要： To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

摘要翻译： 为了消除电子零件的破损或接合不良，提高电子零件的可靠性，在凸块焊接装置中调节电子部件。 一种凸块接合装置，包括用于安装和加热电子部件的台架1和包括具有用于定位电子部件的侧面的可旋转调节板2的位置调节装置，具有用于与电子部件配合的侧面的板4 调节板和用于向调节板施加调节力以便将电子部件按压到板4的调节弹簧5。

公开(公告)号：US5686353A

公开(公告)日：1997-11-11

申请号：US576160

申请日：1995-12-21

申请人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

发明人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14

摘要： An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.

摘要翻译： 设置在半导体芯片（4）的表面上的电极端子（5）在平面图中具有正方形形状。 此外，设置在电极端子（5）上的突起（8）的突出顶部（8a）定向到电极端子（5）的角部（5a）。 因此，通过熔化通过毛细管（1）供给的金线（2）的下端部形成的金球（2a）与电极端子（5）接合，然后将毛细管（1）移动到 方形电极（5）的对角线方向。 因此，金线（2）的主要部分与金球（2a）分离，从而形成凸块（8）。

公开(公告)号：US6017812A

公开(公告)日：2000-01-25

申请号：US119974

申请日：1998-07-21

申请人： Takahiro Yonezawa ,  Osamu Nakao ,  Shinji Kanayama ,  Akihiro Yamamoto ,  Makoto Imanishi ,  Koichi Yoshida

发明人： Takahiro Yonezawa ,  Osamu Nakao ,  Shinji Kanayama ,  Akihiro Yamamoto ,  Makoto Imanishi ,  Koichi Yoshida

IPC分类号： H01L21/60 ,  H01L21/607 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： The present invention provides a bump bonding method that can prevent bumps from being inappropriately shaped. The bump bonding method comprises forming a gold ball (16) at the tip of a gold wire (1) that is inserted through a capillary (3), lowering the capillary (3) while using a displacement detection sensor to detect the vertical displacement of the capillary (3), detecting the position of that portion of an IC (11) in which an electrode is formed, based on the displacement of the capillary (3) detected by the displacement detection sensor when the gold ball (16) abuts the IC (11), pressing he gold ball (16) against the electrode forming portion to form a bump pedestal (17), elevating the capillary (3) a specified amount while moving it in the horizontal direction a specified amount, setting the height S of a position at which the capillary (3) is stopped based on the height H1 of the bump pedestal (17) detected by the displacement detection sensor, again lowering the capillary (3) down to the stop position height S to join the gold wire (1) to the bump pedestal (17), and then lifting the gold wire (1) to break the joint between the bump pedestal (17) and the gold wire (1).

摘要翻译： 本发明提供一种能够防止凸块不适当地形成的凸块接合方法。 凸点接合方法包括在金线（1）的尖端处形成金球（16），该金球插入通过毛细管（3），同时使用位移检测传感器来降低毛细管（3），以检测垂直位移 所述毛细管（3）基于当所述金球（16）邻接所述位置检测传感器时检测到的所述毛细管（3）的位移，检测形成有电极的所述IC（11）的所述部分的位置 IC（11），将金球（16）压在电极形成部分上以形成凸起基座（17），在毛细管（3）沿水平方向移动一定量的同时将毛细管（3）提高一定量，将高度S 基于由位移检测传感器检测到的凸起基座（17）的高度H1停止毛细管（3）的位置，再次将毛细管（3）降低到停止位置高度S，从而将金线 （1）到凸台（17），然后抬起g 旧电线（1），以破坏凸块基座（17）和金线（1）之间的接合部。

公开(公告)号：US06619535B1

公开(公告)日：2003-09-16

申请号：US09830508

申请日：2001-04-27

申请人： Makoto Imanishi ,  Takahiro Yonezawa ,  Shinji Kanayama ,  Ryoichiro Katano ,  Takaharu Mae

发明人： Makoto Imanishi ,  Takahiro Yonezawa ,  Shinji Kanayama ,  Ryoichiro Katano ,  Takaharu Mae

IPC分类号： B23K3102

CPC分类号： H01L21/6838 ,  H01L21/68 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a construction including a stage having a suction hole for sucking an electronic component and fixing the same in position and position regulating suction hole for sucking an electronic component when the electronic component is regulated in position, a position regulating pawl for positioning the electronic component on the stage and a position regulating suction force control section capable of controlling a position regulating suction force when the electronic component is regulated in position on the stage.

摘要翻译： 本发明提供一种结构，其特征在于，包括具有用于吸引电子部件的吸引孔并将其固定在适当位置的台阶的结构，以及当电子部件被调节就位时，用于吸引电子部件的位置调节用吸孔; 以及位置调整用吸引力控制部，其能够控制在电子部件被调节到台上的位置时调节吸引力的位置。