摘要:
A method of producing a pulp molded article. The method feeds a pulp slurry to a cavity of a papermaking mold having a prescribed cavity shape to form a pulp preform including a main part having an opening and a separable part having a flange and connected to an edge of the opening. A pressing member is inserted into the preform, the pressing member is expanded to press the preform toward the papermaking surface, the preform is removed from the papermaking mold, and then the preform is cut at a joint between the separable part and the main part.
摘要:
A process for producing a pulp molded article comprising inserting a hollow inflatable pressing member 81 which has been made small so as to have smaller cross-sectional contour into a cavity 4 of a mold 1 in which a pulp layer 7 has been formed, and feeding a pressurizing fluid into the inserted pressing member 81 to inflate the pressing member 81 thereby to press the pulp layer 7 onto the inner wall of the cavity 4.
摘要:
A method of producing a pulp molded article comprising a papermaking step in which a pulp slurry is fed to the surface of a papermaking mold having suction paths, and water contained in the pulp slurry is sucked through the suction paths whereby the pulp is deposited on the surface to form a wet preform, and a dewatering step in which the wet preform is dewatered, wherein the temperature of the fed pulp slurry is raised while the pulp is being deposited on the surface.
摘要:
A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 μm or more but 20 μm or less is provided between the joining surfaces and the three-dimensional web structure.
摘要:
A method for producing a polyphenol composition including a step of subjecting (A) a hardly water-soluble polyphenol and (B) one or more selected from cathechins, chlorogenic acids and methylated compounds of hardly water-soluble polyphenols to a heat treatment at from 100 to 180° C. in the presence of an aqueous medium.
摘要:
The object of the present invention is to provide a polyurethane foam for flame lamination which has an excellent balance between adhesiveness to a fabric comprising synthetic fibers or natural fibers, a leather or the like and residual compression strain and has an excellent wet-heat resistance, and a laminated body including a foamed material layer consisting of the polyurethane foam. The polyurethane foam for flame lamination is characterized by being produced using a foam raw material containing a polyol such as a polyether polyol, a polyisocyanate, a foaming agent, a foam control agent, an amine-based catalyst and a urea compound such as urea and azodicarbonamide.
摘要:
Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.
摘要:
A system including a secure LSI 1 establishes a communication path to/from a server 3 (UD1), and receives a common key-encrypted program generated by encryption with a common key and transmitted from the server 3 (UD6 and UD7). The received common key-encrypted program is decrypted to generate a raw program, and the raw program is re-encrypted with an inherent key to newly generate an inherent key-encrypted program, which is stored in an external memory.
摘要:
An optical module has a lever for bending a spring plate possessed by a cage for accommodating a case of the optical module in a direction in which a retaining hole formed through the spring plate comes off a latch formed on the case. The lever has a shaft pivotably supported on the case, a tongue disposed on one side of the shaft, and an actuator disposed on the opposite side of the shaft with respect to the tongue. The lever pivotally moves about the shaft in response to a movement of the tongue toward the case, causing the actuator to press the spring plate to bend in the foregoing direction. A user can readily release the latch by moving the tongue toward the case, and withdraw the optical module from the cage through a simple manipulation of pulling the case out while holding the case and tongue together.
摘要:
A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.