公开(公告)号：US20250108479A1

公开(公告)日：2025-04-03

申请号：US18376356

申请日：2023-10-03

Applicant: Applied Materials, Inc.

Inventor： Andrew J. Nagengast ,  Jeonghoon Oh ,  Kuen-Hsiang Chen ,  Steven M. Zuniga ,  Takashi Fujikawa ,  Jay Gurusamy ,  Ekaterina A. Mikhaylichenko ,  Eric L. Lau ,  Huanbo Zhang ,  Welarumage Ravin Fernando

IPC: B24B37/32

Abstract: A carrier head for chemical mechanical polishing includes a housing for attachment to a drive shaft, a membrane assembly arranged beneath the lower carrier body, and a flexure. The membrane assembly includes a membrane support and a flexible membrane secured to the membrane support to defining a plurality of pressurizable lower chambers, with the flexible membrane having a lower surface that provides a substrate mounting surface. A flexible seal forms a pressurizable upper chamber between the housing and the membrane support. The flexure connects the membrane support to the housing, and the flexure extends through the pressurizable upper chamber.

公开(公告)号：US20250108477A1

公开(公告)日：2025-04-03

申请号：US18477159

申请日：2023-09-28

Applicant: Applied Materials, Inc.

Inventor： Huanbo Zhang ,  Ekaterina A. Mikhaylichenko ,  Jeonghoon Oh ,  Andrew Nagengast ,  Erik S. Rondum ,  Brian J. Brown ,  Zhize Zhu

IPC: B24B37/10 ,  B24B37/26 ,  B24B57/02

Abstract: A Chemical Mechanical Polishing (CMP) process may generally apply more pressure around a periphery of the polishing pad than at the center of the polishing pad. This may cause uneven material removal as the substrate moves along the surface of the polishing pad. Therefore, the polishing pad may include one or more recesses around a periphery of the polishing pad to relieve pressure on the substrate. The one or more recesses may be connected to channels that extend radially outward from the recesses to the edge of the polishing pad. The recesses may collect polishing slurry during the CMP process and direct the slurry into the channels. The channels may then expel the collected polishing slurry off of the polishing pad to clear the recesses.

公开(公告)号：US20240408650A1

公开(公告)日：2024-12-12

申请号：US18206367

申请日：2023-06-06

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Sih-Ling Yeh ,  Emily Drauss ,  Elton Zhong ,  Chad Pollard ,  Songling Shin ,  Jianshe Tang ,  Jeonghoon Oh

IPC: B08B3/02 ,  B05B7/24 ,  B08B13/00 ,  B24B57/04

Abstract: A chemical mechanical polishing system includes a first polishing station including a first platen to support a first polishing pad, a transfer station to receive a substrate from a robot, a carrier head movable on a predetermined path from the polishing station to the transfer station, a gas flow regulator having an input for a carrier gas, a liquid flow regulator having an input for a cleaning liquid, and a fluid jet cleaner at a position along the predetermined path. The fluid jet cleaner includes an atomizer nozzle including an input port coupled to the gas flow regulator, an injection port coupled to the liquid flow regulator, and an output port positioned to spray the cleaning liquid entrained in the carrier gas onto the substrate held by the carrier head when the carrier head is located above the fluid jet cleaner.

公开(公告)号：US20230390895A1

公开(公告)日：2023-12-07

申请号：US17967762

申请日：2022-10-17

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Jeonghoon Oh ,  Chad Pollard ,  Chih Chung Chou ,  Ningzhuo Cui ,  Hui Chen

IPC: B24B53/017 ,  B24B53/12 ,  B24B53/00 ,  B24B53/007 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B53/12 ,  B24B53/005 ,  B24B53/007 ,  B24B37/042

Abstract: A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

公开(公告)号：US11717936B2

公开(公告)日：2023-08-08

申请号：US16552901

申请日：2019-08-27

Applicant: Applied Materials, Inc.

Inventor： Dmitry Sklyar ,  Jeonghoon Oh ,  Gerald J. Alonzo ,  Jonathan Domin ,  Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B49/04 ,  H01L21/321 ,  H01L21/67 ,  B24B37/005 ,  B24B57/04

CPC classification number: B24B49/04 ,  B24B37/005 ,  B24B57/04 ,  H01L21/3212 ,  H01L21/67092

Abstract: Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.

公开(公告)号：US11682561B2

公开(公告)日：2023-06-20

申请号：US17242162

申请日：2021-04-27

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Steven M. Zuniga ,  Andrew J. Nagengast ,  Samuel Chu-Chiang Hsu ,  Gautam Shashank Dandavate

IPC: H01L21/321 ,  B24B41/06 ,  B24B37/04 ,  B24B37/32 ,  H01L21/306 ,  H01L21/304 ,  B24B37/10

CPC classification number: H01L21/3212 ,  B24B37/04 ,  B24B37/32 ,  B24B41/06 ,  B24B37/10 ,  H01L21/304 ,  H01L21/30625

Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.

公开(公告)号：US20220152778A1

公开(公告)日：2022-05-19

申请号：US17590764

申请日：2022-02-01

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC: B24B37/32

Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

公开(公告)号：US10766117B2

公开(公告)日：2020-09-08

申请号：US15908605

申请日：2018-02-28

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Douglas R. McAllister ,  Jian Lin ,  Stacy Meyer ,  Sidney P. Huey ,  Jeonghoon Oh ,  Trung T. Doan ,  Jeffrey P. Schmidt ,  Martin S. Wohlert ,  Kerry F. Hughes ,  James C. Wang ,  Danny Cam Toan Lu ,  Romain Beau De Lamenie ,  Venkata R. Balagani ,  Aden Martin Allen ,  Michael Jon Fong

IPC: B24B37/32

Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

公开(公告)号：US10714321B2

公开(公告)日：2020-07-14

申请号：US16048919

申请日：2018-07-30

Applicant: Applied Materials, Inc.

Inventor： Brian T. West ,  Michael S. Cox ,  Jeonghoon Oh

IPC: H01J37/34 ,  C23C14/34 ,  C23C14/35

Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.

公开(公告)号：US10702971B2

公开(公告)日：2020-07-07

申请号：US15264412

申请日：2016-09-13

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Tsz-Sin Siu ,  Hung Chih Chen ,  Andrew J. Nagengast ,  Steven M. Zuniga ,  Thomas B. Brezoczky

IPC: B24B37/30 ,  B24B41/06 ,  B29C35/02 ,  B29C33/42 ,  B29L31/00 ,  B29K23/00 ,  B29K83/00

Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.