摘要:
Disclosed is a nonaqueous electrolyte secondary battery, comprising a case having a wall thickness not larger than 0.3 mm, a positive electrode provided in the case, a negative electrode provided in the case and the negative electrode containing a carbonaceous material capable of absorbing-desorbing lithium ions, and a nonaqueous electrolyte provided in the case and the nonaqueous electrolyte containing a nonaqueous solvent including γ-butyrolactone and a solute dissolved in the nonaqueous solvent, wherein after being discharged to 3V with a current of 0.2 C at room temperature, the voltage reduction caused by the self-discharge at 60° C. is not larger than 1.5V in 3 weeks.
摘要:
The display unit comprises a display device such as liquid crystal cell or the like; and a secondary battery disposed to a rear side of the display device. A heat shielding layer having a thermal conductivity of at most 5 W/mK, preferably at most 1 W/mK is formed as a heat shielding plate between the display device and the secondary battery, and the display device and the secondary battery are integrally assembled to form a module structure. According to the above structure of the present invention, since the display device such as liquid crystal cell or the like and the secondary battery are integrally assembled to form a module structure, the display unit can be made compact and thin to attain a light weight.
摘要:
A display device comprises a first substrate which has a line-forming surface, a second substrate which is arranged opposite to the line-forming surface by a gap interposed and has peripheral edge bonded to the first substrate, a plurality of display elements which are provided between the first substrate and the second substrate, a plurality of lines which are formed on the line-forming surface, extend to the peripheral edge of the line-forming surface and supply a drive voltage to the display elements, and a drive circuit substrate which is arranged at the peripheral edge of the line-forming surface and on which drive circuit is mounted.
摘要:
Disclosed is a bump formed on a pad which is provided on either a semiconductor chip or a package or a wiring substrate for input or output thereof, for making electric connection on the pad. The bump has: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material. With another conductive bonding material provided on the other pad of a wiring substrate or a package, the ball of the bump of the semiconductor chip or the package is placed close to another pad of the wiring substrate or package. The conductive bonding material of the other pad is heated and melted to connect the ball and the other pad of the wiring substrate or package by the conductive bonding material.
摘要:
There is provided an image display apparatus including: a first substrate having an electron-emitting device; a second substrate having an anode electrode that is opposed to the electron-emitting device; and a conductive layer that is provided on the side of a second face of the second substrate, the second face being an opposite face to a first face of the second substrate, the first face being located on the first substrate side, wherein a potential of the conductive layer is set to be lower than a potential of the anode electrode when displaying an image; and a surface resistance of the conductive layer is higher than a surface resistance of the anode electrode.
摘要:
An image display apparatus comprises: a display unit 1000 including a substrate 1003 having an outer surface provided with an image display area 1001; a conductive layer 1022 that is disposed on the substrate 1003 via an adhesive layer 1021; and an electrode 1002 that is disposed on at least a part of the area except for the image display area 1001 on the outer surface of the substrate 1003. The electrode 1002 and at least a part of the conductive layer 1022 are layered via a part of the adhesive layer 1021, and the electrode 1002 and the conductive layer 1022 are electrically connected.
摘要:
A thin type semiconductor package having a low thermal resistance and a low electric resistance is disclosed, that comprises a nitride ceramic supporting substrate having a first main surface and a second main surface, the nitride ceramic supporting substrate having via-holes that pass through from the first main surface to the second main surface, a resin film having a wiring layer, the resin film being bonded to the first main surface of the supporting substrate, the wiring layer being electrically connected to an edge portion of the via-holes on the first main surface, the resin film having an opening region, a semiconductor chip directly mounted on the first main surface of the nitride ceramic supporting substrate, disposed at the opening region of the resin film, and electrically connected to the wiring layer of the resin film, and external connection terminals disposed on the edge portion of the via-holes of the second main surface.
摘要:
According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and having a surface roughness of 1 .mu.m or less, and which has excellent humidity resistance and chemical resistance.
摘要:
A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at least one wiring metal film formed on the dielectric film.
摘要:
An image display apparatus includes a display unit including a substrate having an outer surface and an image display area, a conductive layer disposed on the substrate via an adhesive layer, and a conductive tape disposed on the outer surface of the substrate. In addition, a member holds the conductive layer against the substrate. Part of the adhesive layer is layered between the conductive tape and at least a part of the conductive layer, with the conductive tape including a projection portion contacting the conductive layer such that the conductive layer and the conductive tape are electrically connected. The member sandwiches the conductive layer, the conductive tape having the projection portion, and the display unit, and the conductive tape is a ground potential.