公开(公告)号：US20110209911A1

公开(公告)日：2011-09-01

申请号：US12956826

申请日：2010-11-30

申请人： Atsushi ISHIDA ,  Ryojiro Tominaga ,  Kenji Sakai

发明人： Atsushi ISHIDA ,  Ryojiro Tominaga ,  Kenji Sakai

IPC分类号： H05K1/11

CPC分类号： H05K1/0222 ,  H05K1/0271 ,  H05K1/115 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827

摘要： A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.

摘要翻译： 布线基板包括具有第一表面和第二表面的基底，穿过基底的第一穿透孔，形成在第一孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二穿透孔 以及形成在所述第二孔中的第二通孔导体，在所述基板的第一表面上的第一导电电路，所述基板的第二表面上的第二导电电路，所述第二孔的一端上的第一导电部， 以及在所述第二穿透孔的相对端上的第二导电部分。 第一导体连接第一电路和第二电路。 第二导体由填充在第二孔中的导电材料制成，并且连接第一导电部分和第二导电部分。

公开(公告)号：US20110048775A1

公开(公告)日：2011-03-03

申请号：US12857838

申请日：2010-08-17

申请人： Atsushi ISHIDA ,  Ryojiro Tominaga ,  Kenji Sakai

发明人： Atsushi ISHIDA ,  Ryojiro Tominaga ,  Kenji Sakai

IPC分类号： H05K1/00 ,  H05K1/11 ,  H05K3/00

CPC分类号： H05K1/115 ,  H05K1/0263 ,  H05K3/0038 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K2201/09827 ,  H05K2203/1572 ,  Y10T29/49124

摘要： A printed wiring board includes a substrate having a first surface and a second surface on the opposite side of the first surface and multiple first penetrating holes, a first conductive portion formed on the first surface of the substrate and made of a first plated cover layer, a second conductive portion formed on the second surface of the substrate and made of a second plated cover layer, the second conductive portion being positioned opposite the first conductive portion, and multiple first through-hole conductors made of conductors formed in the multiple first penetrating holes, respectively, the multiple first through-hole conductors connecting the first conductive portion and the second conductive portion. The first conductive portion, the second conductive portion and the first through-hole conductors form a first through-hole connection section which sets up either a power-source through-hole conductor or a ground through-hole conductor.

摘要翻译： 印刷电路板包括：具有在第一表面的相对侧上的第一表面和第二表面的基板和多个第一穿透孔;形成在基板的第一表面上并由第一镀覆覆盖层制成的第一导电部分， 第二导电部分，形成在基板的第二表面上，由第二镀覆覆盖层制成，第二导电部分与第一导电部分相对定位，多个第一通孔导体由形成在多个第一穿透孔中的导体 分别连接第一导电部和第二导电部的多个第一通孔导体。 第一导电部分，第二导电部分和第一通孔导体形成设置电源通孔导体或接地通孔导体的第一通孔连接部分。

公开(公告)号：US20110209904A1

公开(公告)日：2011-09-01

申请号：US12952864

申请日：2010-11-23

申请人： Atsushi ISHIDA ,  Ryojiro Tominaga ,  Kenji Sakai

发明人： Atsushi ISHIDA ,  Ryojiro Tominaga ,  Kenji Sakai

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K1/00 ,  H05K3/42

CPC分类号： H05K3/4038 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49165

摘要： A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

摘要翻译： 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

公开(公告)号：US20130192879A1

公开(公告)日：2013-08-01

申请号：US13560239

申请日：2012-07-27

申请人： Haruhiko MORITA ,  Ryojiro TOMINAGA ,  Atsushi ISHIDA ,  Satoshi WATANABE

发明人： Haruhiko MORITA ,  Ryojiro TOMINAGA ,  Atsushi ISHIDA ,  Satoshi WATANABE

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K1/115 ,  H05K3/10 ,  H05K3/4602 ,  H05K3/4655 ,  Y10T29/49155

摘要： A multilayer printed wiring board has a core substrate including first insulation layers, first conductive patterns formed on the first insulation layers, and first via conductors formed through the first insulation layers and connecting the first conductive patterns, and a buildup layer formed on the core substrate and including second insulation layers, second conductive patterns formed on the second insulation layers, and second via conductors formed through the second insulation layers and connecting the second conductive patterns. Each of the first insulation layers includes an inorganic reinforcing fiber material, each of the second insulation layers does not include an inorganic reinforcing fiber material, and the core substrate includes an inductor having the first conductive patterns and the first via conductors.

摘要翻译： 多层印刷电路板具有芯基板，其包括第一绝缘层，形成在第一绝缘层上的第一导电图案和通过第一绝缘层形成并连接第一导电图案的第一通孔导体以及形成在芯基板上的积层 并且包括第二绝缘层，形成在第二绝缘层上的第二导电图案，以及通过第二绝缘层形成并连接第二导电图案的第二通孔导体。 每个第一绝缘层包括无机增强纤维材料，每个第二绝缘层不包括无机增强纤维材料，并且芯基板包括具有第一导电图案和第一通孔导体的电感器。

公开(公告)号：US20110255209A1

公开(公告)日：2011-10-20

申请号：US13079049

申请日：2011-04-04

申请人： Atsushi ISHIDA ,  Takumi TANIGUCHI ,  Takehisa SASABAYASHI ,  Tomoyuki KUWANO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA

发明人： Atsushi ISHIDA ,  Takumi TANIGUCHI ,  Takehisa SASABAYASHI ,  Tomoyuki KUWANO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA

IPC分类号： H01G4/228

CPC分类号： H01G4/2325 ,  H01G4/232 ,  H01G4/30

摘要： A ceramic electronic component includes a ceramic element including opposed side surfaces, an inner electrode, and an external terminal electrode. The external terminal electrode includes a first conductive layer and a second conductive layer. The first conductive layer is formed by plating so as to be electrically coupled to an exposed section of the internal electrode exposed to the side surfaces. The second conductive layer is arranged so as to cover the first conductive layer and includes conductive resin. The value of T2/T1 is in the range of about 3.4 to about 11.3, where T1 indicates the thickness of the first conductive layer and T2 indicates the thickness of the second conductive layer.

摘要翻译： 陶瓷电子部件包括：陶瓷元件，其包括相对的侧面，内部电极和外部端子电极。 外部端子电极包括第一导电层和第二导电层。 第一导电层通过电镀形成，以便电连接到暴露于侧表面的内部电极的暴露部分。 第二导电层被布置成覆盖第一导电层并且包括导电树脂。 T2 / T1的值在约3.4至约11.3的范围内，其中T1表示第一导电层的厚度，T2表示第二导电层的厚度。

公开(公告)号：US20100271754A1

公开(公告)日：2010-10-28

申请号：US12761429

申请日：2010-04-16

申请人： Atsushi ISHIDA ,  Takumi TANIGUCHI ,  Masaki TANI

发明人： Atsushi ISHIDA ,  Takumi TANIGUCHI ,  Masaki TANI

IPC分类号： H01G4/12

CPC分类号： H01G4/012 ,  H01G2/24 ,  H01G4/232 ,  H01G4/30

摘要： An electronic component includes a substantially rectangular parallelepiped electronic component body and first to fourth external electrodes. The first to fourth external electrodes are arranged such that a shaped defined by joining the centers of portions of the first to fourth external electrodes on a first main surface with a substantially straight line is substantially square. The first main surface is provided with a substantially linear orientation identifying mark disposed thereon. The orientation identifying mark passes through an intersection of two diagonals of the substantially square shape and extends along the longitudinal direction or the width direction.

摘要翻译： 电子部件包括大致长方体的电子部件主体和第一至第四外部电极。 第一至第四外部电极被布置成使得通过在第一主表面上具有基本上直线的第一至第四外部电极的部分的中心接合而限定的形状基本上为正方形。 第一主表面设置有设置在其上的基本线性的取向识别标记。 取向识别标记通过大致正方形的两个对角线的交点，并且沿长度方向或宽度方向延伸。

公开(公告)号：US20130020914A1

公开(公告)日：2013-01-24

申请号：US13550630

申请日：2012-07-17

申请人： Masaki TSUKIDA ,  Atsushi ISHIDA

发明人： Masaki TSUKIDA ,  Atsushi ISHIDA

IPC分类号： H01G4/30 ,  H01F5/00 ,  H01C7/13 ,  H01L41/047

CPC分类号： H01C7/13 ,  H01C1/148 ,  H01C7/18 ,  H01F17/0013 ,  H01F27/292 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H01L41/0471

摘要： In a laminated ceramic electronic component, a first functional portion and a second functional portion are disposed within a ceramic element body so as to be adjacent to each other along a height direction, first and second internal electrodes face each other through a ceramic layer in the first functional portion, and third and fourth internal electrodes whose number of laminated layers is different from the number of laminated layers of the first and second internal electrodes face each other through the ceramic layer in the second functional portion. A marking internal conductor is disposed on the same plane as the first internal electrode and/or the second internal electrode, a marking external conductor is disposed on the side surface of the ceramic element body so as to link a plurality of exposed marking internal conductors such that it is possible to recognize vertical directionality.

摘要翻译： 在层叠陶瓷电子部件中，第一功能部分和第二功能部分沿着高度方向设置在陶瓷元件主体内以彼此相邻，第一和第二内部电极通过陶瓷层中的陶瓷层彼此面对 第一功能部分，以及第三和第四内部电极，其数量与第一和第二内部电极的叠层数不同，通过第二功能部分中的陶瓷层彼此面对。 标记内部导体设置在与第一内部电极和/或第二内部电极相同的平面上，标记外部导体设置在陶瓷元件主体的侧表面上，以将多个暴露的标记内部导体 可以识别垂直方向性。

公开(公告)号：US20100271752A1

公开(公告)日：2010-10-28

申请号：US12759807

申请日：2010-04-14

申请人： Atsushi ISHIDA ,  Takumi TANIGUCHI ,  Masaki TANI

发明人： Atsushi ISHIDA ,  Takumi TANIGUCHI ,  Masaki TANI

IPC分类号： H01G4/38 ,  H01G4/005 ,  H01G4/236

CPC分类号： H01G4/232 ,  H01G4/012 ,  H01G4/30

摘要： In a laminated ceramic electronic component including a ceramic element body including a plurality of effective sections, each of which constitutes a circuit element such as a laminated capacitor unit, bumps generated between the effective portions and a gap interposed between the effective portions can be made minimized. Specifically, the ceramic element body includes a first effective section including a first circuit element and a second effective section including a second circuit element. A gap is provided between the first and second effective section. Floating internal conductors are arranged in the gap at least in one of first and second external layer sections, the first external section being interposed between a first main surface and the first and second effective sections, and the second external layer section being interposed between a second main surface and the first and second effective sections.

摘要翻译： 在包括具有多个有效部分的陶瓷元件体的层叠陶瓷电子部件中，每个有效部分构成诸如层叠电容器单元之类的电路元件，可以使有效部分之间产生的凸起和插入在有效部分之间的间隙最小化 。 具体地，陶瓷元件体包括第一有效部分，其包括第一电路元件和包括第二电路元件的第二有效部分。 在第一和第二有效部分之间提供间隙。 浮动的内部导体至少在第一和第二外部层中的一个中间排列在间隙中，第一外部部分介于第一主表面和第一和第二有效部分之间，第二外部部分介于第二外部部分之间 主表面和第一和第二有效部分。