公开(公告)号：US09144153B2

公开(公告)日：2015-09-22

申请号：US13551911

申请日：2012-07-18

申请人： Ji Eun Kim ,  Bae Sun Kim ,  Yong Ki Son ,  Sung Yong Shin ,  Il Yeon Cho

发明人： Ji Eun Kim ,  Bae Sun Kim ,  Yong Ki Son ,  Sung Yong Shin ,  Il Yeon Cho

IPC分类号： H05K3/02 ,  H05K3/10 ,  H05K1/03 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40

CPC分类号： H05K1/038 ,  H05K1/141 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/055 ,  Y10T29/49155

摘要： A fabric type circuit board in which a conductive pattern is provided both faces of fabrics and a method of manufacturing the same. A fabric type circuit board includes fabrics and a conductive pattern in which extension units folded from one side of the fabrics to another side of the fabrics are formed, wherein the conductive pattern is formed using at least one of a copper film transfer printing scheme, printing, etching, embroidery, and sewing. A method of manufacturing a fabric type circuit board includes forming a conductive pattern, having extension units formed therein, on fabrics, cutting a part of the fabrics on which the conductive pattern is formed, and forming contact surfaces by folding the extension units from one side of the fabrics to another side of the fabrics.

摘要翻译： 织物的两面设有导电图案的织物类型电路板及其制造方法。 织物型电路板包括织物和导电图案，其中形成从织物的一侧向织物的另一侧折叠的延伸部分，其中导电图案使用铜膜转印印刷方案，印刷中的至少一种形成 ，蚀刻，刺绣和缝制。 一种制造织物类电路板的方法包括在织物上形成具有形成在其中的延伸单元的导电图案，切割其上形成有导电图案的织物的一部分，并且通过从一侧折叠延伸单元来形成接触表面 的织物的另一面。

公开(公告)号：US20130087369A1

公开(公告)日：2013-04-11

申请号：US13551911

申请日：2012-07-18

申请人： Ji Eun Kim ,  Bae Sun Kim ,  Yong Ki Son ,  Sung Yong Shin ,  II Yeon Cho

发明人： Ji Eun Kim ,  Bae Sun Kim ,  Yong Ki Son ,  Sung Yong Shin ,  II Yeon Cho

IPC分类号： H05K1/03 ,  H05K3/10

CPC分类号： H05K1/038 ,  H05K1/141 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/055 ,  Y10T29/49155

摘要： Disclosed are a fabric type circuit board in which a conductive pattern is provided both faces of fabrics and a method of manufacturing the same. A fabric type circuit board according to the present invention includes fabrics and a conductive pattern in which extension units folded from one side of the fabrics to an other side of the fabrics are formed, wherein the conductive pattern is formed using at least one of a copper film transfer printing scheme, printing, etching, embroidery, and sewing. A method of manufacturing a fabric type circuit board according to the present invention includes forming a conductive pattern, having extension units formed therein, on fabrics, cutting a part of the fabrics on which the conductive pattern is formed, and forming contact surfaces by folding the extension units from one side of the fabrics to an other side of the fabrics.

摘要翻译： 公开了一种织物类型电路板，其中在织物的两个面上设置导电图案及其制造方法。 根据本发明的织物类型电路板包括织物和导电图案，其中形成从织物的一侧向织物的另一侧折叠的延伸单元，其中导电图案使用铜 电影转印，印刷，蚀刻，刺绣和缝制。 根据本发明的织物类型电路板的制造方法包括在织物上形成具有形成在其中的延伸单元的导电图案，切割其上形成有导电图案的织物的一部分，并通过折叠形成接触表面来形成接触表面 延伸单元从织物的一侧到织物的另一侧。

公开(公告)号：US08984747B2

公开(公告)日：2015-03-24

申请号：US13440580

申请日：2012-04-05

申请人： Bae sun Kim ,  Yong Ki Son ,  Ji Eun Kim ,  Sung yong Shin

发明人： Bae sun Kim ,  Yong Ki Son ,  Ji Eun Kim ,  Sung yong Shin

IPC分类号： H05K3/02 ,  H05K1/00 ,  H05K1/03 ,  H05K3/20

CPC分类号： H05K1/038 ,  H05K3/20 ,  H05K3/205 ,  H05K2203/0156 ,  H05K2203/068 ,  Y10T29/49155

摘要： Methods for manufacturing a fabric-type circuit board, including: forming a metal plating layer on a base substrate, forming a circuit pattern by etching the metal plating layer, bonding a carrier film on the circuit pattern, and bonding an adhesive film directly below the circuit pattern after removing the base substrate; or bonding an adhesive film to a metal thin film, forming a circuit pattern by etching the metal thin film, and bonding a carrier film on the circuit pattern. In either case, the circuit pattern is transferred to a fabric by bonding the adhesive film to the fabric.

摘要翻译： 制造布线型电路板的方法包括：在基底基板上形成金属镀层，通过蚀刻金属镀层形成电路图案，将载体膜粘合在电路图案上， 去除基底之后的电路图案; 或将粘合膜粘合到金属薄膜上，通过蚀刻金属薄膜形成电路图案，并将载体膜粘接在电路图案上。 在任一情况下，通过将粘合剂膜粘合到织物上将电路图案转印到织物上。

公开(公告)号：US08752285B2

公开(公告)日：2014-06-17

申请号：US13049431

申请日：2011-03-16

申请人： Yong Ki Son ,  Baesun Kim ,  Ji Eun Kim

发明人： Yong Ki Son ,  Baesun Kim ,  Ji Eun Kim

IPC分类号： H01K3/10

CPC分类号： H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/038 ,  H05K1/141 ,  H05K3/323 ,  H05K3/4053 ,  H05K2201/0129 ,  H05K2201/029 ,  H05K2201/0329 ,  H05K2201/0979 ,  H01L2924/00

摘要： A textile-type electronic component package includes a textile base; a textile-type electronic component and a plurality of conductive patterns having end contact points formed on the top surface of the textile base; a thermoplastic adhesive formed on the bottom surface of the textile base; a plurality of mounting pads formed on the thermoplastic adhesive and facing the conductive patterns, respectively; and a plurality of via-hole-type coupling parts penetrating end contact points of the conductive patterns, the textile base, and the thermoplastic adhesive, and electrically coupling the mounting pads and the conductive patterns, wherein the via-hole-type coupling parts includes a bunch of via-holes filled with a conductive polymer.

摘要翻译： 纺织型电子部件包装包括纺织品基部; 织物型电子部件和多个导电图案，其具有形成在纺织品基部的顶表面上的端部接触点; 形成在纺织品基底的底表面上的热塑性粘合剂; 分别形成在所述热塑性粘合剂上并面对所述导电图案的多个安装焊盘; 以及穿过导电图案，织物基底和热塑性粘合剂的端接触点的多个通孔型耦合部件，并且电连接安装焊盘和导电图案，其中通孔型耦合部件包括 一堆填充有导电聚合物的通孔。

公开(公告)号：US20120255166A1

公开(公告)日：2012-10-11

申请号：US13440580

申请日：2012-04-05

申请人： Bae Sun KIM ,  Yong Ki ,  Ji Eun Kim ,  Sung Yong

发明人： Bae Sun KIM ,  Yong Ki ,  Ji Eun Kim ,  Sung Yong

IPC分类号： H05K3/06 ,  H05K3/22

CPC分类号： H05K1/038 ,  H05K3/20 ,  H05K3/205 ,  H05K2203/0156 ,  H05K2203/068 ,  Y10T29/49155

摘要： An embodiment of the present invention relates to a method for manufacturing a fabric type circuit board and can form a fine pattern by performing the etching process on the metal layer when a circuit pattern is formed, transfer the circuit pattern to the fabric by a thermosetting adhesive film to secure strong durability against flexibility of the fabric and sufficient electric conductivity and maintain ventilation, and apply various mounting methods such as soldering, wire bonding, or the like, when electronic parts are mounted.

摘要翻译： 本发明的一个实施例涉及一种用于制造织物型电路板的方法，并且当形成电路图案时，通过对金属层进行蚀刻处理可以形成精细图案，通过热固性粘合剂将电路图案转移到织物 薄膜，以确保对织物的柔韧性的足够的耐久性和足够的导电性并保持通风，并且当安装电子部件时应用诸如焊接，引线接合等的各种安装方法。

公开(公告)号：US08773772B2

公开(公告)日：2014-07-08

申请号：US13588583

申请日：2012-08-17

申请人： Chi Ho An ,  Pil Sun Jung ,  Jae Hoon Cho ,  Ji Eun Kim ,  Chan Goo Kang

发明人： Chi Ho An ,  Pil Sun Jung ,  Jae Hoon Cho ,  Ji Eun Kim ,  Chan Goo Kang

IPC分类号： G02B13/18 ,  G02B9/34 ,  G02B13/00

CPC分类号： G02B13/004 ,  G02B5/208 ,  G02B13/18

摘要： A lens optical system includes first, second, third, and fourth lenses that are arranged between an object and an image sensor, in order from an object side, wherein the first lens has positive refractive power and an incident surface that is convex toward the object, the second lens has negative refractive power and both surfaces of which are concave, the third lens has positive refractive power and a meniscus shape that is convex toward the image sensor, and the fourth lens has negative refractive power and at least one of an incident surface and an exit surface of which is an aspherical surface, wherein the system satisfies the inequality, 3.0

摘要翻译： 透镜光学系统包括从物体侧开始依次布置在物体和图像传感器之间的第一透镜，第二透镜，第三透镜​​和第四透镜，其中第一透镜具有正折光力，并且朝向物体凸出的入射表面 第二透镜具有负屈光力并且其两个表面都是凹形的，第三透镜​​具有正的折光力和朝向图像传感器凸起的弯月形状，并且第四透镜具有负折光力，并且至少一个入射 表面，其出射表面是非球面，其中系统满足不等式3.0

公开(公告)号：USRE44334E1

公开(公告)日：2013-07-02

申请号：US13050669

申请日：2011-03-17

申请人： Yong Ae Jeon ,  Ji Eun Kim ,  Sangsung Choi ,  Kwang Roh Park

发明人： Yong Ae Jeon ,  Ji Eun Kim ,  Sangsung Choi ,  Kwang Roh Park

IPC分类号： H04J3/22

CPC分类号： H04W72/1263 ,  H04L47/14 ,  H04L47/50 ,  H04W84/18

摘要： An apparatus for transmitting WPAN (Wireless Personal Area Network) MAC (Medium Access Control) frames includes a transport frame management unit for creating MAC transport frames if data is generated from an upper protocol and application layer unit, classifying the created MAC transport frames by kinds, and managing the classified MAC transport frames by queues, a transport memory control unit for transmitting the transport frames at a high speed, and a transport frame transmission unit for responsible for the transmission of the transport frames by judging the transmission time of the frames.

公开(公告)号：US08476751B2

公开(公告)日：2013-07-02

申请号：US13096143

申请日：2011-04-28

申请人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun-Hye Do ,  Ji Eun Kim ,  Hee Min Shin

发明人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun-Hye Do ,  Ji Eun Kim ,  Hee Min Shin

IPC分类号： H01L23/02

CPC分类号： H01L23/481 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/1076 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.

摘要翻译： 堆叠半导体封装包括半导体封装模块，其包括多个半导体封装，每个半导体封装具有第一表面，背离第一表面的第二表面，连接第一表面和第二表面的侧表面和形成在第一表面上的通孔 侧表面通过第一表面和第二表面并且堆叠成使得它们的通孔彼此垂直连接;以及粘合构件，其形成在半导体封装之间并将半导体封装彼此附接，主基板 支撑半导体封装模块，并在其面向半导体封装模块的第三表面上形成与通孔对准的主连接焊盘，以及形成在通孔中的导电连接构件，并将半导体封装与 主连接垫

公开(公告)号：US07838129B2

公开(公告)日：2010-11-23

申请号：US11660761

申请日：2005-09-23

申请人： Wook Dong Cho ,  Ji Eun Kim ,  Byung Sun Jeon ,  Seok Hee Yoon ,  Jae Min Moon

发明人： Wook Dong Cho ,  Ji Eun Kim ,  Byung Sun Jeon ,  Seok Hee Yoon ,  Jae Min Moon

IPC分类号： H01L51/54 ,  C09K11/00

CPC分类号： H01L51/006 ,  C07D221/20 ,  C09K11/06 ,  C09K2211/1022 ,  C09K2211/1029 ,  C09K2211/1458 ,  C09K2211/1466 ,  H01L51/0058 ,  H01L51/0061 ,  H01L51/0072 ,  H01L51/5012 ,  H01L51/5048 ,  H01L51/5088 ,  H05B33/14 ,  Y10S428/917

摘要： Disclosed is a novel compound which is capable of significantly improving a lifespan, efficiency, and electrochemical and thermal stabilities of an organic light emitting device, the production of the compound, and an organic light emitting device in which the compound is contained in an organic compound layer.

摘要翻译： 公开了一种新型化合物，其能够显着地提高有机发光器件的寿命，效率，电化学和热稳定性，化合物的制备以及其中化合物包含在有机化合物中的有机发光器件 层。

公开(公告)号：USD605272S1

公开(公告)日：2009-12-01

申请号：US29331267

申请日：2009-01-22

申请人： Jae Hung Chun ,  Kyu Nam Lee ,  Jae Won Jeong ,  Ji Eun Kim ,  Seon Kyu Kim

设计人： Jae Hung Chun ,  Kyu Nam Lee ,  Jae Won Jeong ,  Ji Eun Kim ,  Seon Kyu Kim