-
1.发明授权公开(公告)号：US07060224B2
公开(公告)日：2006-06-13
申请号：US10337450
申请日：2003-01-06
CPC分类号： H01L24/95 , B01J19/0046 , B01J19/0093 , B01J2219/00315 , B01J2219/00317 , B01J2219/00432 , B01J2219/00497 , B01J2219/00527 , B01J2219/00529 , B01J2219/00536 , B01J2219/00545 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/00612 , B01J2219/00614 , B01J2219/00626 , B01J2219/00637 , B01J2219/00653 , B01J2219/00659 , B01J2219/00677 , B01J2219/00686 , B01J2219/00689 , B01J2219/00707 , B01J2219/00711 , B01J2219/00713 , B01J2219/0072 , B01J2219/00722 , B01J2219/00725 , B01J2219/00731 , B01L3/502707 , B01L3/502715 , B01L3/502761 , B01L9/52 , B01L2200/025 , B01L2200/028 , B01L2200/12 , B01L2300/0819 , B01L2400/0418 , B82B3/00 , B82Y5/00 , B82Y10/00 , B82Y20/00 , B82Y30/00 , B82Y40/00 , C07B2200/11 , C07H21/00 , C07K1/04 , C07K1/045 , C07K1/047 , C40B40/06 , C40B40/10 , C40B40/12 , C40B60/14 , C40B70/00 , G01N33/54366 , G02B6/1225 , G06N3/002 , G06N3/061 , G06N3/123 , G11B7/00455 , G11B7/0052 , G11B7/244 , G11C13/0014 , G11C13/0019 , G11C13/04 , G11C19/00 , H01L25/50 , H01L29/6656 , H01L29/6659 , H01L29/66628 , H01L29/7834 , H01L51/0093 , H01L51/0595 , H01L2224/95085 , H01L2224/95145 , H01L2224/95147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/01052 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： Methods and apparatus are provided for the fabrication of microscale, including micron and sub-micron scale, including nanoscale, devices. Electronic transport of movable component devices is utilized through a fluidic medium to effect transport to a desired target location on a substrate or motherboard. Forces include electrophoretic force, electroosmotic force, electrostatic force and/or dielectrophoretic force. In the preferred embodiment, free field electroosmotic forces are utilized either alone, or in conjunction with, other forces. These forces may be used singly or in combination, as well as in conjunction with yet other forces, such as fluidic forces, mechanical forces or thermal convective forces. Transport may be effected through the use of driving electrodes so as to transport the component device to yet other connection electrodes. In certain embodiments, the component devices may be attached to the target device using a solder reflow step.
摘要翻译： 提供了用于制造微尺寸的方法和装置，包括微米级和亚微米级，包括纳米尺度的器件。 通过流体介质利用可移动部件装置的电子传输，以实现传输到基板或主板上的期望的目标位置。 力包括电泳力，电渗力，静电力和/或介电泳力。 在优选实施例中，自由场电渗力单独使用或与其它力结合使用。 这些力可以单独使用或组合使用，以及结合另外的力，例如流体力，机械力或热对流力。 传输可以通过使用驱动电极来实现，以便将组件设备传送到另外的连接电极。 在某些实施例中，组件装置可以使用焊料回流步骤连接到目标装置。
-
2.发明授权Methods apparatus for the electronic, homogeneous assembly and fabrication of devices 失效用于电子，均匀组装和制造装置的方法装置公开(公告)号：US06569382B1
公开(公告)日：2003-05-27
申请号：US09436311
申请日：1999-11-08
IPC分类号： G01N1500
CPC分类号： H01L24/95 , B01J19/0046 , B01J19/0093 , B01J2219/00315 , B01J2219/00317 , B01J2219/00432 , B01J2219/00497 , B01J2219/00527 , B01J2219/00529 , B01J2219/00536 , B01J2219/00545 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/00612 , B01J2219/00614 , B01J2219/00626 , B01J2219/00637 , B01J2219/00653 , B01J2219/00659 , B01J2219/00677 , B01J2219/00686 , B01J2219/00689 , B01J2219/00707 , B01J2219/00711 , B01J2219/00713 , B01J2219/0072 , B01J2219/00722 , B01J2219/00725 , B01J2219/00731 , B01L3/502707 , B01L3/502715 , B01L3/502761 , B01L9/52 , B01L2200/025 , B01L2200/028 , B01L2200/12 , B01L2300/0819 , B01L2400/0418 , B82B3/00 , B82Y5/00 , B82Y10/00 , B82Y20/00 , B82Y30/00 , B82Y40/00 , C07B2200/11 , C07H21/00 , C07K1/04 , C07K1/045 , C07K1/047 , C40B40/06 , C40B40/10 , C40B40/12 , C40B60/14 , C40B70/00 , G01N33/54366 , G02B6/1225 , G06N3/002 , G06N3/061 , G06N3/123 , G11B7/00455 , G11B7/0052 , G11B7/244 , G11C13/0014 , G11C13/0019 , G11C13/04 , G11C19/00 , H01L25/50 , H01L29/6656 , H01L29/6659 , H01L29/66628 , H01L29/7834 , H01L51/0093 , H01L51/0595 , H01L2224/95085 , H01L2224/95145 , H01L2224/95147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/01052 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： Methods and apparatus are provided for the fabrication of microscale, including micron, sub-micron, and nanoscale, devices. Electronic transport of movable component devices is utilized through a fluidic medium to effect transport to a desired target location on a substrate or motherboard. Forces include electrophoretic force, electroosmotic force, electrostatic force and/or dielectrophoretic force. In the preferred embodiment, free field electroosmotic forces are utilized either alone, or in conjunction with, other forces. These forces may be used singly or in combination, as well as in conjunction with yet other forces, such as fluidic forces, mechanical forces or thermal convective forces. Transport may be effected through the use of driving electrodes so as to transport the component device to yet other connection electrodes. In certain embodiments, the connection electrodes may also be utilized, either alone or in combination with driving electrodes, to electronically transport the component device to the connection electrodes.
摘要翻译： 提供了用于制造微米级的方法和装置，包括微米，亚微米和纳米级器件。 通过流体介质利用可移动部件装置的电子传输，以实现传输到基板或主板上的期望的目标位置。 力包括电泳力，电渗力，静电力和/或介电泳力。 在优选实施例中，自由场电渗力单独使用或与其它力结合使用。 这些力可以单独使用或组合使用，以及结合其他力，例如流体力，机械力或热对流力。 传输可以通过使用驱动电极来实现，以便将组件设备传送到另外的连接电极。 在某些实施例中，连接电极也可单独使用或与驱动电极组合使用，以将组件装置电子传输到连接电极。
-
3.发明授权公开(公告)号：US08630807B2
公开(公告)日：2014-01-14
申请号：US11401713
申请日：2006-04-11
CPC分类号： H01L24/95 , B01J19/0046 , B01J19/0093 , B01J2219/00315 , B01J2219/00317 , B01J2219/00432 , B01J2219/00497 , B01J2219/00527 , B01J2219/00529 , B01J2219/00536 , B01J2219/00545 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/00612 , B01J2219/00614 , B01J2219/00626 , B01J2219/00637 , B01J2219/00653 , B01J2219/00659 , B01J2219/00677 , B01J2219/00686 , B01J2219/00689 , B01J2219/00707 , B01J2219/00711 , B01J2219/00713 , B01J2219/0072 , B01J2219/00722 , B01J2219/00725 , B01J2219/00731 , B01L3/502707 , B01L3/502715 , B01L3/502761 , B01L9/52 , B01L2200/025 , B01L2200/028 , B01L2200/12 , B01L2300/0819 , B01L2400/0418 , B82B3/00 , B82Y5/00 , B82Y10/00 , B82Y20/00 , B82Y30/00 , B82Y40/00 , C07B2200/11 , C07H21/00 , C07K1/04 , C07K1/045 , C07K1/047 , C40B40/06 , C40B40/10 , C40B40/12 , C40B60/14 , C40B70/00 , G01N33/54366 , G02B6/1225 , G06N3/002 , G06N3/061 , G06N3/123 , G11B7/00455 , G11B7/0052 , G11B7/244 , G11C13/0014 , G11C13/0019 , G11C13/04 , G11C19/00 , H01L25/50 , H01L29/6656 , H01L29/6659 , H01L29/66628 , H01L29/7834 , H01L51/0093 , H01L51/0595 , H01L2224/95085 , H01L2224/95145 , H01L2224/95147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/01052 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： Methods are provided for the fabrication of microscale, including micron and sub-micron scale, including nanoscale, devices. Electronic transport of movable component devices is utilized through a fluidic medium to effect transport to a desired target location on a substrate or motherboard. Forces include electrophoretic force, electroosmotic force, electrostatic force and/or dielectrophoretic force. In the preferred embodiment, free field electroosmotic forces are utilized either alone, or in conjunction with, other forces. These forces may be used singly or in combination, as well as in conjunction with yet other forces, such as fluidic forces, mechanical forces or thermal convective forces. Transport may be effected through the use of driving electrodes so as to transport the component device to yet other connection electrodes. In certain embodiments, the component devices may be attached to the target device using a solder reflow step.
摘要翻译： 提供了用于制造微尺寸的方法，包括微米级和亚微米级，包括纳米尺度的器件。 通过流体介质利用可移动部件装置的电子传输，以实现传输到基板或主板上的期望的目标位置。 力包括电泳力，电渗力，静电力和/或介电泳力。 在优选实施例中，自由场电渗力单独使用或与其它力结合使用。 这些力可以单独使用或组合使用，以及结合其他力，例如流体力，机械力或热对流力。 传输可以通过使用驱动电极来实现，以便将组件设备传送到另外的连接电极。 在某些实施例中，组件装置可以使用焊料回流步骤连接到目标装置。
-
4.发明授权Systems and devices for photoelectrophoretic transport and hybridization of oligonucleotides 有权用于光电泳转运和寡核苷酸杂交的系统和装置公开(公告)号：US06706473B1
公开(公告)日：2004-03-16
申请号：US09489855
申请日：2000-01-24
IPC分类号： C12Q168
CPC分类号： G06N3/061 , B01J19/0046 , B01J2219/00274 , B01J2219/00497 , B01J2219/00527 , B01J2219/00529 , B01J2219/00536 , B01J2219/00545 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/00612 , B01J2219/00617 , B01J2219/00621 , B01J2219/00626 , B01J2219/0063 , B01J2219/00637 , B01J2219/00641 , B01J2219/00653 , B01J2219/00659 , B01J2219/00707 , B01J2219/00711 , B01J2219/00713 , B01J2219/00722 , B82B3/00 , B82Y5/00 , B82Y10/00 , B82Y20/00 , B82Y30/00 , B82Y40/00 , C12M35/02 , C12Q1/6825 , C40B40/06 , C40B70/00 , G01N33/54366 , G01N35/00069 , G02B6/1225 , G06N3/002 , G06N3/123 , G11C13/0014 , G11C13/0019 , G11C13/04 , G21K1/003 , H01L24/95 , H01L25/50 , H01L29/6656 , H01L51/0093 , H01L51/0595 , H01L2224/95145 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/10329 , H01L2924/12033 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , C12Q2563/107 , H01L2924/00
摘要： A platform for photoelectrophoretic transport and electronic hybridization of fluorescence labeled DNA oligonucleotides in a low conductivity electrolyte is described. A chemically stabilized semiconductor photodiode or photoconductor surface is coated with a streptavidin-agarose permeation layer. Micro-illumination of the surface generates photo-electrochemical currents that are used to electrophoretically transport and attach capture strands, preferably biotinylated DNA, to arbitrarily selected locations. The same process is then used to transport and electronically hybridize fluorescence labeled DNA target strands to the previously attached capture strands. Signal detection is accomplished either by a fluorescence scanner or a CCD camera. This represents a flexible electronic DNA assay platform that need not rely on pre-patterned microelectronic arrays.
摘要翻译： 描述了在低电导率电解质中荧光标记的DNA寡核苷酸的光电转运和电子杂交的平台。 用链霉抗生物素蛋白 - 琼脂糖渗透层涂覆化学稳定的半导体光电二极管或光电导体表面。 表面的微照射产生光电化学电流，其用于将捕获链，优选生物素化的DNA电泳转运并附着到任意选择的位置。 然后使用相同的方法将荧光标记的DNA靶链与先前连接的捕获链电子杂交。 信号检测可以通过荧光扫描仪或CCD相机进行。 这代表一个灵活的电子DNA测定平台，不需要依赖于预先构图的微电子阵列。
-
5.发明申请公开(公告)号：US20060216740A1
公开(公告)日：2006-09-28
申请号：US11401713
申请日：2006-04-11
申请人： Carl Edman , Michael Heller , Rachel Formosa , Christian Gurtner
发明人： Carl Edman , Michael Heller , Rachel Formosa , Christian Gurtner
IPC分类号： C12Q1/68
CPC分类号： H01L24/95 , B01J19/0046 , B01J19/0093 , B01J2219/00315 , B01J2219/00317 , B01J2219/00432 , B01J2219/00497 , B01J2219/00527 , B01J2219/00529 , B01J2219/00536 , B01J2219/00545 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/00612 , B01J2219/00614 , B01J2219/00626 , B01J2219/00637 , B01J2219/00653 , B01J2219/00659 , B01J2219/00677 , B01J2219/00686 , B01J2219/00689 , B01J2219/00707 , B01J2219/00711 , B01J2219/00713 , B01J2219/0072 , B01J2219/00722 , B01J2219/00725 , B01J2219/00731 , B01L3/502707 , B01L3/502715 , B01L3/502761 , B01L9/52 , B01L2200/025 , B01L2200/028 , B01L2200/12 , B01L2300/0819 , B01L2400/0418 , B82B3/00 , B82Y5/00 , B82Y10/00 , B82Y20/00 , B82Y30/00 , B82Y40/00 , C07B2200/11 , C07H21/00 , C07K1/04 , C07K1/045 , C07K1/047 , C40B40/06 , C40B40/10 , C40B40/12 , C40B60/14 , C40B70/00 , G01N33/54366 , G02B6/1225 , G06N3/002 , G06N3/061 , G06N3/123 , G11B7/00455 , G11B7/0052 , G11B7/244 , G11C13/0014 , G11C13/0019 , G11C13/04 , G11C19/00 , H01L25/50 , H01L29/6656 , H01L29/6659 , H01L29/66628 , H01L29/7834 , H01L51/0093 , H01L51/0595 , H01L2224/95085 , H01L2224/95145 , H01L2224/95147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/01052 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： Methods are provided for the fabrication of microscale, including micron and sub-micron scale, including nanoscale, devices. Electronic transport of movable component devices is utilized through a fluidic medium to effect transport to a desired target location on a substrate or motherboard. Forces include electrophoretic force, electroosmotic force, electrostatic force and/or dielectrophoretic force. In the preferred embodiment, free field electroosmotic forces are utilized either alone, or in conjunction with, other forces. These forces may be used singly or in combination, as well as in conjunction with yet other forces, such as fluidic forces, mechanical forces or thermal convective forces. Transport may be effected through the use of driving electrodes so as to transport the component device to yet other connection electrodes. In certain embodiments, the component devices may be attached to the target device using a solder reflow step.
摘要翻译： 提供了用于制造微尺寸的方法，包括微米级和亚微米级，包括纳米尺度的器件。 通过流体介质利用可移动部件装置的电子传输，以实现传输到基板或主板上的期望的目标位置。 力包括电泳力，电渗力，静电力和/或介电泳力。 在优选实施例中，自由场电渗力单独使用或与其它力结合使用。 这些力可以单独使用或组合使用，以及结合其他力，例如流体力，机械力或热对流力。 传输可以通过使用驱动电极来实现，以便将组件设备传送到另外的连接电极。 在某些实施例中，组件装置可以使用焊料回流步骤连接到目标装置。
-
-
-
-
搜索结果
5 条记录 (耗时 0.025 秒)
