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公开(公告)号：US20110158895A1
公开(公告)日：2011-06-30
申请号：US12790820
申请日：2010-05-29
申请人： Chih-Yung Wang , I-Wen Liu , Jong-Pyng Chen , Shu-Hui Cheng , Syh-Yuh Cheng
发明人： Chih-Yung Wang , I-Wen Liu , Jong-Pyng Chen , Shu-Hui Cheng , Syh-Yuh Cheng
IPC分类号： D01F9/12
摘要： The invention provides a high module carbon fiber and a fabrication method thereof. The high module carbon fiber includes the product fabricated by the following steps: subjecting a pre-oxidized carbon fiber to a microwave assisted graphitization process, wherein the pre-oxidized carbon fiber is heated to a graphitization temperature of 1000-3000° C. for 1-30 min. Further, the high module carbon fiber has a tensile strength of between 2.0-6.5 GPa and a module of between 200-650 GPa.
摘要翻译： 本发明提供了一种高模块碳纤维及其制造方法。 高模块碳纤维包括通过以下步骤制造的产品：将预氧化碳纤维经受微波辅助石墨化工艺，其中预氧化碳纤维被加热到石墨化温度为1000-3000℃，1 -30分钟 此外，高模块碳纤维的拉伸强度在2.0-6.5GPa和200-650GPa之间的模块。
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2.发明授权公开(公告)号：US08906339B2
公开(公告)日：2014-12-09
申请号：US12790820
申请日：2010-05-29
申请人： Chih-Yung Wang , I-Wen Liu , Jong-Pyng Chen , Shu-Hui Cheng , Syh-Yuh Cheng
发明人： Chih-Yung Wang , I-Wen Liu , Jong-Pyng Chen , Shu-Hui Cheng , Syh-Yuh Cheng
摘要： The invention provides a high module carbon fiber and a fabrication method thereof. The high module carbon fiber includes the product fabricated by the following steps: subjecting a pre-oxidized carbon fiber to a microwave assisted graphitization process, wherein the pre-oxidized carbon fiber is heated to a graphitization temperature of 1000-3000° C. for 1-30 min. Further, the high module carbon fiber has a tensile strength of between 2.0-6.5 GPa and a module of between 200-650 GPa.
摘要翻译： 本发明提供了一种高模块碳纤维及其制造方法。 高模块碳纤维包括通过以下步骤制造的产品：将预氧化碳纤维经受微波辅助石墨化工艺，其中预氧化碳纤维被加热到石墨化温度为1000-3000℃，1 -30分钟 此外，高模块碳纤维的拉伸强度在2.0-6.5GPa和200-650GPa之间的模块。
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3.发明申请公开(公告)号：US20070148469A1
公开(公告)日：2007-06-28
申请号：US11374697
申请日：2006-03-13
申请人： Feng-Po Tseng , Kuo-Chan Chiou , Tzong-Ming Lee , Syh-Yuh Cheng , Chih-Wei Hsu
发明人： Feng-Po Tseng , Kuo-Chan Chiou , Tzong-Ming Lee , Syh-Yuh Cheng , Chih-Wei Hsu
CPC分类号： C08G59/38 , C08L63/00 , G01L19/147 , Y10T428/31511
摘要： An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing.
摘要翻译： 提供一种用于压力信号传输的包封组合物，其包括柔性和低模量环氧树脂作为与具有作为填料的压力信号传输性能的塑料球组合的物质。 因此，通过利用柔性环氧树脂在压力下容易变形的性质来传递压力信号。 并且通过塑料球之间的接触增强了信号传输的效果。 封装组合物用于传输压力信号的传感器中。 封装组合物是疏水性的，因此可以防止传感器的电子设备防止水分或水分延长其使用寿命。 与使用液体传输压力信号的传统传感器相比，采用固体封装组合的传感器具有生产加工容易等优点。
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4.发明授权公开(公告)号：US08163404B2
公开(公告)日：2012-04-24
申请号：US12260466
申请日：2008-10-29
申请人： Syh-Yuh Cheng , Chia-Hsin Lin , Chin-Ching Lin , Mei-Ching Chiang
发明人： Syh-Yuh Cheng , Chia-Hsin Lin , Chin-Ching Lin , Mei-Ching Chiang
IPC分类号： C23C16/40 , C23C16/448 , B32B9/04
CPC分类号： C23C16/407 , Y10T428/12687 , Y10T428/12708
摘要： A chlorine, fluorine and lithium co-doped transparent conductive film is provided, including chlorine, fluorine and lithium co-doped tin oxides, wherein the chlorine, fluorine and lithium co-doped tin oxides have a chlorine ion doping concentration not greater than 5 atom %, a fluorine ion doping concentration not greater than 5 atom %, and a lithium ion doping concentration not greater than 5 atom %.
摘要翻译： 提供氯，氟和锂共掺杂的透明导电膜，其包括氯，氟和锂共掺杂的氧化锡，其中氯，氟和锂的共掺杂氧化锡具有不大于5原子的氯离子掺杂浓度 ％，氟离子掺杂浓度不大于5原子％，锂离子掺杂浓度不大于5原子％。
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5.发明申请公开(公告)号：US20090235754A1
公开(公告)日：2009-09-24
申请号：US12477336
申请日：2009-06-03
申请人： Feng-Po Tseng , Kuo-Chan Chiou , Tzong-Ming Lee , Syh-Yuh Cheng , Chih-Wei Hsu
发明人： Feng-Po Tseng , Kuo-Chan Chiou , Tzong-Ming Lee , Syh-Yuh Cheng , Chih-Wei Hsu
CPC分类号： C08G59/3227 , C08G59/245 , C08L33/00 , C08L63/00 , G01L19/147 , H01L23/293 , H01L2924/0002 , C08L2666/04 , H01L2924/00
摘要： An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing.
摘要翻译： 提供一种用于压力信号传输的包封组合物，其包括柔性和低模量环氧树脂作为与具有作为填料的压力信号传输性能的塑料球组合的物质。 因此，通过利用柔性环氧树脂在压力下容易变形的性质来传递压力信号。 并且通过塑料球之间的接触增强了信号传输的效果。 封装组合物用于传输压力信号的传感器中。 封装组合物是疏水性的，因此可以防止传感器的电子设备防止水分或水分延长其使用寿命。 与使用液体传输压力信号的传统传感器相比，采用固体封装组合的传感器具有生产加工容易等优点。
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公开(公告)号：US20060243972A1
公开(公告)日：2006-11-02
申请号：US11477412
申请日：2006-06-30
申请人： Ruoh-Huey Uang , Yu-Chih Chen , Ren-Jan Lin , Syh-Yuh Cheng
发明人： Ruoh-Huey Uang , Yu-Chih Chen , Ren-Jan Lin , Syh-Yuh Cheng
IPC分类号： H01L29/08
CPC分类号： H01L23/49827 , B82Y10/00 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/29298 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12044 , H01L2924/14 , H01R4/04 , H01R13/2414 , H05K3/323 , H05K2201/026 , H05K2201/083 , H05K2201/10378 , H05K2203/0726 , H05K2203/104 , Y10S977/761 , Y10S977/762 , Y10S977/766 , Y10S977/77 , Y10S977/778 , Y10T29/49126 , Y10T29/49155 , Y10T29/49204 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.
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7.发明授权Composite mode transducer and cooling device having the composite mode transducer 失效复合模式换能器和具有复合模式换能器的冷却装置公开(公告)号：US07683522B2
公开(公告)日：2010-03-23
申请号：US12068722
申请日：2008-02-11
申请人： Syh-Yuh Cheng , Yun-Tien Chen , Ra-Min Tain , Shu-Jung Yang
发明人： Syh-Yuh Cheng , Yun-Tien Chen , Ra-Min Tain , Shu-Jung Yang
CPC分类号： H01L41/0906
摘要： A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.
摘要翻译： 公开了一种用于散热由发热元件产生的热的复合模式换能器。 复合模式换能器包括换能模块和连接元件。 换能模块包括并联连接的第一和第二换能元件。 连接元件连接到第一和第二换能元件的共振节点。 第一和第二转换元件由多频共振电路驱动，以在系统的共振频率处产生复合模式的共振。 通过使用复合模式换能器所产生的优点是：消除局部应力集中，提高系统的效率，耐久性和稳定性。 因此，克服了现有技术的缺点。 本发明还提供一种具有复合模式换能器的冷却装置。
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8.发明授权Composite mode transducer and cooling device having the composite mode transducer 失效复合模式换能器和具有复合模式换能器的冷却装置公开(公告)号：US07567015B2
公开(公告)日：2009-07-28
申请号：US11594832
申请日：2006-11-09
申请人： Syh-Yuh Cheng , Yun-Tien Chen , Ra-Min Tain , Shu-Jung Yang
发明人： Syh-Yuh Cheng , Yun-Tien Chen , Ra-Min Tain , Shu-Jung Yang
IPC分类号： H01L41/08
CPC分类号： H01L41/0906
摘要： A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.
摘要翻译： 公开了一种用于散热由发热元件产生的热的复合模式换能器。 复合模式换能器包括换能模块和连接元件。 换能模块包括并联连接的第一和第二换能元件。 连接元件连接到第一和第二换能元件的共振节点。 第一和第二转换元件由多频共振电路驱动，以在系统的共振频率处产生复合模式的共振。 通过使用复合模式换能器所产生的优点是：消除局部应力集中，提高系统的效率，耐久性和稳定性。 因此，克服了现有技术的缺点。 本发明还提供一种具有复合模式换能器的冷却装置。
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公开(公告)号：US20060249834A1
公开(公告)日：2006-11-09
申请号：US11477413
申请日：2006-06-30
申请人： Ruoh-Huey Uang , Yu-Chih Chen , Ren-Jan Lin , Syh-Yuh Cheng
发明人： Ruoh-Huey Uang , Yu-Chih Chen , Ren-Jan Lin , Syh-Yuh Cheng
IPC分类号： H01L23/12
CPC分类号： H01L23/49827 , B82Y10/00 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/29298 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12044 , H01L2924/14 , H01R4/04 , H01R13/2414 , H05K3/323 , H05K2201/026 , H05K2201/083 , H05K2201/10378 , H05K2203/0726 , H05K2203/104 , Y10S977/761 , Y10S977/762 , Y10S977/766 , Y10S977/77 , Y10S977/778 , Y10T29/49126 , Y10T29/49155 , Y10T29/49204 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.
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公开(公告)号：US20060081989A1
公开(公告)日：2006-04-20
申请号：US10998741
申请日：2004-11-30
申请人： Ruoh-Huey Uang , Yu-Chih Chen , Ren-Jay Lin , Syh-Yuh Cheng
发明人： Ruoh-Huey Uang , Yu-Chih Chen , Ren-Jay Lin , Syh-Yuh Cheng
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , B82Y10/00 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/29298 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12044 , H01L2924/14 , H01R4/04 , H01R13/2414 , H05K3/323 , H05K2201/026 , H05K2201/083 , H05K2201/10378 , H05K2203/0726 , H05K2203/104 , Y10S977/761 , Y10S977/762 , Y10S977/766 , Y10S977/77 , Y10S977/778 , Y10T29/49126 , Y10T29/49155 , Y10T29/49204 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.
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