Side-gate defined tunable nanoconstriction in double-gated graphene multilayers
    1.
    发明授权
    Side-gate defined tunable nanoconstriction in double-gated graphene multilayers 有权
    侧栅极限定在双门控石墨烯多层中的可调谐纳米收缩

    公开(公告)号:US08623717B2

    公开(公告)日:2014-01-07

    申请号:US13494635

    申请日:2012-06-12

    Abstract: A method to fabricate a novel graphene based, electrically tunable, nanoconstriction device is described. The device includes a back-gate dielectric layer formed over a conductive substrate. The back-gate dielectric layer is, in one example, hexagonal boron nitride, mica, SiOx, SiNx, BNx, HfOx or AlOx. A graphene layer is an AB-stacked bi-layer graphene layer, an ABC-stacked tri-layer graphene layer or a stacked few-layer graphene layer. Contacts are formed over a portion of the graphene layer including at least one source contact, at least one drain contact and at least one set of side-gate contacts. A graphene channel with graphene side gates is formed in the graphene layer between the at least one source contact, the at least one the drain contact and the at least one set of side-gate contacts. A top-gate dielectric layer is formed over the graphene layer. A top-gate electrode is formed on the top-gate dielectric layer.

    Abstract translation: 描述了制造新的基于石墨烯的电可调谐纳米收缩装置的方法。 该器件包括形成在导电衬底上的背栅电介质层。 在一个示例中,背栅电介质层是六方氮化硼,云母,SiOx,SiNx,BNx,HfOx或AlOx。 石墨烯层是AB层叠的双层石墨烯层,ABC层叠的三层石墨烯层或层叠的几层石墨烯层。 触点形成在石墨烯层的一部分上,包括至少一个源极接触,至少一个漏极接触和至少一组侧栅接触。 具有石墨烯侧栅极的石墨烯通道在所述至少一个源极接触件,所述至少一个漏极接触件和所述至少一组侧栅极接触件之间的石墨烯层中形成。 在石墨烯层上形成顶栅电介质层。 顶栅电极形成在顶栅电介质层上。

    Transistor employing vertically stacked self-aligned carbon nanotubes
    4.
    发明授权
    Transistor employing vertically stacked self-aligned carbon nanotubes 有权
    晶体管采用垂直堆叠的自对准碳纳米管

    公开(公告)号:US08895371B2

    公开(公告)日:2014-11-25

    申请号:US13605238

    申请日:2012-09-06

    Abstract: A fin structure including a vertical alternating stack of a first isoelectric point material layer having a first isoelectric point and a second isoelectric material layer having a second isoelectric point less than the first isoelectric point is formed. The first and second isoelectric point material layers become oppositely charged in a solution with a pH between the first and second isoelectric points. Negative electrical charges are imparted onto carbon nanotubes by an anionic surfactant to the solution. The electrostatic attraction causes the carbon nanotubes to be selectively attached to the surfaces of the first isoelectric point material layer. Carbon nanotubes are attached to the first isoelectric point material layer in self-alignment along horizontal lengthwise directions of the fin structure. A transistor can be formed, which employs a plurality of vertically aligned horizontal carbon nanotubes as the channel.

    Abstract translation: 形成包括具有第一等电点的第一等电点材料层和具有小于第一等电点的第二等电点的第二等电子材料层的垂直交替堆叠的鳍结构。 第一和第二等电点材料层在具有第一和第二等电点之间的pH的溶液中相反地充电。 通过阴离子表面活性剂将负电荷赋予碳纳米管。 静电引力使得碳纳米管选择性地附着在第一等电点材料层的表面上。 碳纳米管沿翅片结构的水平长度方向自对准地附接到第一等电点材料层。 可以形成晶体管,其采用多个垂直排列的水平碳纳米管作为沟道。

    Vertical stacking of carbon nanotube arrays for current enhancement and control
    5.
    发明授权
    Vertical stacking of carbon nanotube arrays for current enhancement and control 有权
    用于当前增强和控制的碳纳米管阵列的垂直堆叠

    公开(公告)号:US08890116B2

    公开(公告)日:2014-11-18

    申请号:US13610089

    申请日:2012-09-11

    Abstract: Transistor devices having vertically stacked carbon nanotube channels and techniques for the fabrication thereof are provided. In one aspect, a transistor device is provided. The transistor device includes a substrate; a bottom gate embedded in the substrate with a top surface of the bottom gate being substantially coplanar with a surface of the substrate; a stack of device layers on the substrate over the bottom gate, wherein each of the device layers in the stack includes a first dielectric, a carbon nanotube channel on the first dielectric, a second dielectric on the carbon nanotube channel and a top gate on the second dielectric; and source and drain contacts that interconnect the carbon nanotube channels in parallel. A method of fabricating a transistor device is also provided.

    Abstract translation: 提供具有垂直堆叠的碳纳米管通道的晶体管器件及其制造技术。 一方面,提供一种晶体管器件。 晶体管器件包括衬底; 嵌入基板中的底栅与底栅的顶表面基本上与基板的表面共面; 在底栅上的衬底上的一叠器件层,其中堆叠中的每个器件层包括第一电介质,第一电介质上的碳纳米管通道,碳纳米管通道上的第二电介质和 第二电介质; 以及并联连接碳纳米管通道的源极和漏极触点。 还提供了一种制造晶体管器件的方法。

    Transistor device with reduced gate resistance
    7.
    发明授权
    Transistor device with reduced gate resistance 有权
    具有降低栅极电阻的晶体管器件

    公开(公告)号:US08642997B2

    公开(公告)日:2014-02-04

    申请号:US13610381

    申请日:2012-09-11

    Abstract: A device with reduced gate resistance includes a gate structure having a first conductive portion and a second conductive portion formed in electrical contact with the first conductive portion and extending laterally beyond the first conductive portion. The gate structure is embedded in a dielectric material and has a gate dielectric on the first conductive portion. A channel layer is provided over the first conductive portion. Source and drain electrodes are formed on opposite end portions of a channel region of the channel layer. Methods for forming a device with reduced gate resistance are also provided.

    Abstract translation: 具有降低的栅极电阻的器件包括具有第一导电部分和形成为与第一导电部分电接触并且横向延伸超过第一导电部分延伸的第二导电部分的栅极结构。 栅极结构嵌入电介质材料中,并且在第一导电部分上具有栅极电介质。 沟道层设置在第一导电部分上。 源极和漏极形成在沟道层的沟道区的相对端部上。 还提供了形成栅极电阻降低的器件的方法。

    Method of providing threshold voltage adjustment through gate dielectric stack modification
    10.
    发明授权
    Method of providing threshold voltage adjustment through gate dielectric stack modification 有权
    通过栅介质叠层修改提供阈值电压调整的方法

    公开(公告)号:US08354309B2

    公开(公告)日:2013-01-15

    申请号:US13347014

    申请日:2012-01-10

    CPC classification number: H01L21/823462 H01L21/28229 H01L21/84 H01L27/1203

    Abstract: Multiple types of gate stacks are formed on a doped semiconductor well. A high dielectric constant (high-k) gate dielectric is formed on the doped semiconductor well. A metal gate layer is formed in one device area, while the high-k gate dielectric is exposed in other device areas. Threshold voltage adjustment oxide layers having different thicknesses are formed in the other device areas. A conductive gate material layer is then formed over the threshold voltage adjustment oxide layers. One type of field effect transistors includes a gate dielectric including a high-k gate dielectric portion. Other types of field effect transistors include a gate dielectric including a high-k gate dielectric portion and a first threshold voltage adjustment oxide portions having different thicknesses. Field effect transistors having different threshold voltages are provided by employing different gate dielectric stacks and doped semiconductor wells having the same dopant concentration.

    Abstract translation: 在掺杂半导体阱上形成多种类型的栅叠层。 在掺杂半导体阱上形成高介电常数(高k)栅极电介质。 在一个器件区域中形成金属栅极层,而在其他器件区域中暴露高k栅极电介质。 在其他器件区域中形成具有不同厚度的阈值电压调节氧化物层。 然后在阈值电压调整氧化物层上形成导电栅极材料层。 一种类型的场效应晶体管包括包括高k栅极电介质部分的栅极电介质。 其他类型的场效应晶体管包括包括高k栅极电介质部分的栅极电介质和具有不同厚度的第一阈值电压调整氧化物部分。 具有不同阈值电压的场效应晶体管通过采用具有相同掺杂剂浓度的不同栅极电介质叠层和掺杂半导体阱来提供。

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