Packaging For Micro Electro-Mechanical Systems And Methods Of Fabricating Thereof
    3.
    发明申请
    Packaging For Micro Electro-Mechanical Systems And Methods Of Fabricating Thereof 有权
    微机电系统的包装及其制造方法

    公开(公告)号:US20100307786A1

    公开(公告)日:2010-12-09

    申请号:US12797649

    申请日:2010-06-10

    IPC分类号: H05K5/06

    摘要: Embodiments of the present disclosure provide systems and methods for producing micro electro-mechanical device packages. Briefly described, in architecture, one embodiment of the system, among others, includes a micro electro-mechanical device formed on a substrate layer; and a thermally decomposable sacrificial structure protecting at least a portion of the micro electro-mechanical device, where the sacrificial structure is formed on the substrate layer and surrounds a gas cavity enclosing an active surface of the micro electro-mechanical device. Other systems and methods are also provided.

    摘要翻译: 本公开的实施例提供了用于生产微机电装置包装的系统和方法。 简要描述,在架构中,系统的一个实施例包括形成在基底层上的微电子机械装置; 以及可热分解的牺牲结构,其保护所述微机电装置的至少一部分,其中所述牺牲结构形成在所述基底层上并且围绕包围所述微机电装置的有效表面的气体腔。 还提供了其他系统和方法。

    Micro-electromechanical switched tunable inductor
    4.
    发明授权
    Micro-electromechanical switched tunable inductor 有权
    微机电开关可调谐电感

    公开(公告)号:US07847669B2

    公开(公告)日:2010-12-07

    申请号:US11999527

    申请日:2007-12-06

    摘要: Disclosed is an integrated tunable inductor having mutual micromachined inductances fabricated in close proximity to a tunable inductor that is switched in and out by micromechanical ohmic switches to change the inductance of the integrated tunable inductor. To achieve a large tuning range and high quality factor, silver is preferably used as the structural material to co-fabricate the inductors and micromachined switches, and silicon is selectively removed from the backside of the substrate. Using this method, exemplary tuning of 47% at 6 GHz is achievable for a 1.1 nH silver inductor fabricated on a low-loss polymer membrane. The effect of the quality factor on the tuning characteristic of the integrated inductor is evaluated by comparing the measured result of substantially identical inductors fabricated on various substrates. To maintain the quality factor of the silver inductor, the device may be encapsulated using a low-cost wafer-level polymer packaging technique.

    摘要翻译: 公开了一种集成的可调电感器,其具有相互微机电感应,其紧密接近可调电感器,该可调谐电感器由微机械欧姆开关导入和切出以改变集成可调电感器的电感。 为了实现大的调谐范围和高品质因素,优选使用银作为用于共同制造电感器和微加工开关的结构材料,并且硅从衬底的背面选择性地去除。 使用这种方法,在低损耗聚合物膜上制造的1.1nH银电感器可以实现在6GHz下47%的示例性调谐。 通过比较在各种衬底上制造的基本相同的电感器的测量结果来评估质量因子对集成电感器的调谐特性的影响。 为了保持银电感器的品质因素,可以使用低成本晶圆级聚合物封装技术封装器件。

    Etching optical surfaces on GaAs
    9.
    发明授权
    Etching optical surfaces on GaAs 失效
    蚀刻GaAs上的光学表面

    公开(公告)号:US4576691A

    公开(公告)日:1986-03-18

    申请号:US636177

    申请日:1984-07-31

    IPC分类号: C25F3/12 C25F3/14 H01L21/3063

    摘要: Photoelectrochemical etching of gallium arsenide in highly alkaline aqueous solution yields optically smooth etched surfaces suitable for many optical devices. Higher optical quality is obtained for lower irradiation energy provided sufficient energy is available to produce holes in the valence band.

    摘要翻译: 在高碱性水溶液中对砷化镓的光电化学蚀刻产生适合于许多光学器件的光学平滑蚀刻表面。 获得较低的照射能量的较高的光学质量,只要有足够的能量可用于产生价带中的空穴。

    Electrolytic silver plating
    10.
    发明授权
    Electrolytic silver plating 失效
    电解镀银

    公开(公告)号:US4377449A

    公开(公告)日:1983-03-22

    申请号:US312891

    申请日:1981-10-19

    申请人: Paul A. Kohl

    发明人: Paul A. Kohl

    IPC分类号: C25D3/46 C25D

    CPC分类号: C25D3/46

    摘要: A silver electroplating bath comprising heterocyclic organic additives such as lactones, lactams, cyclic sulfate esters, cyclic imides and cyclic oxazolinones, preferably phenolphthalein.

    摘要翻译: 包含杂环有机添加剂如内酯,内酰胺,环硫酸酯,环状酰亚胺和环恶唑啉酮,优选酚酞的银电镀浴。