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公开(公告)号：US5307561A
公开(公告)日：1994-05-03
申请号：US991735
申请日：1992-11-27
IPC分类号： G01R1/073 , G01R31/02 , H01H1/14 , H01L21/66 , H01R12/00 , H05K1/11 , H05K3/20 , H05K3/32 , H05K3/36 , H05K3/40 , H05K3/02
CPC分类号： G01R1/073 , H05K3/205 , H05K3/4007 , H05K2201/0367 , H05K2201/10666 , H05K2203/0113 , H05K2203/0152 , H05K2203/0726 , H05K2203/167 , H05K3/365 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158
摘要： Shaped contacts (40, 42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16, 18, 26, 28) makes indentations (24a, 24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34, 36, 38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed. This enables the contacts to penetrate foreign materials, such as oxides, that may form on the surface of the pads (56, 58), to which the contacts are to be connected to ensure a good contact without any need for wiping action. The projecting contacts can also be pressed into plated holes (82, 84) in a substrate, such as a printed wiring board, to which mateable/demateable electrical connection is to be made.
摘要翻译： 用于互连电路或用于集成电路测试探针的成形触点（40,42）作为电路迹线（34）作为不锈钢芯棒（10）的整体部件进行电镀。 成形的硬化钢压痕工具（16,18,26,28）在心轴（10）的表面中形成具有预定形状的凹部（24a，24b），其设置有电介质图案，例如特氟隆（12） ）或光致抗蚀剂。 包括凹陷（24a，24b）的钢心轴的区域用导电材料（34,36,38）的图案电镀，并且电介质基底（32）层压到导电材料上。 由凹口形成的电路特征限定了锥形（18）或金字塔形（28）形状的凸起接触，其具有小的面积的自由端，允许更高的压力施加到触点抵靠的表面。 这使得触点能够渗透可能形成在焊盘（56,58）的表面上的诸如氧化物的异物，触点将被连接到该表面，以确保良好的接触而不需要擦拭动作。 突出的触点也可以被压入诸如印刷电路板的基板中的电镀孔（82,84）中，以便进行可配对/可分离的电连接。
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公开(公告)号：US5233157A
公开(公告)日：1993-08-03
申请号：US580749
申请日：1990-09-11
CPC分类号： H05K3/205 , B23K26/0853 , B23K26/362 , B23K26/40 , B23K26/402 , B23K2203/05 , B23K2203/16 , B23K2203/42 , B23K2203/50 , H05K2203/0117 , H05K2203/0726 , H05K2203/107 , H05K3/0017
摘要： A fine line electrical circuit having precise rectangular conductor cross-sections (70) is electroformed on a patterned laser ablated mandrel (32,34). The mandrel comprises a stainless steel substrate (32) coated with a layer of Teflon (34). An eximer laser (44,56) is caused to project a fine spot (54) upon the Teflon (34) with a power sufficient to ablate the Teflon (34) entirely through to the stainless steel substrate (32). A software program drives the coated mandrel beneath the laser beam in an X-Y pattern that defines the pattern of a circuit to be produced, thereby exposing the conductive surface of the mandrel in the selected pattern. A pattern of conductors (70) is then plated upon the mandrel, a dielectric substrate (76) is laminated upon the mandrel and upon the pattern of conductors and then the dielectric substrate (76), together with the conductors (70) adhering thereto, is separated from the mandrel.
摘要翻译： 具有精确矩形导体横截面（70）的精细线路电路在图案化激光烧蚀心轴（32,34）上电铸。 心轴包括涂有一层特氟隆（34）的不锈钢衬底（32）。 使得准分子激光器（44,56）以足以将特氟隆（34）完全烧蚀到不锈钢衬底（32）的功率将精细点（54）投射到特氟龙（34）上。 软件程序以X-Y图案驱动激光束下面的涂覆的心轴，其限定要产生的电路的图案，从而以所选择的图案露出心轴的导电表面。 然后将导体（70）的图案电镀在心轴上，电介质基板（76）层叠在心轴上并且在导体图案之后，然后电介质基板（76）与导体（70）粘附在其上， 与心轴分离。
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公开(公告)号：US5354205A
公开(公告)日：1994-10-11
申请号：US51598
申请日：1993-04-23
IPC分类号： G01R1/073 , G01R31/02 , H01H1/14 , H01L21/66 , H01R12/00 , H05K1/11 , H05K3/20 , H05K3/32 , H05K3/36 , H05K3/40 , H01R9/09
CPC分类号： G01R1/073 , H05K3/205 , H05K3/4007 , H05K2201/0367 , H05K2201/10666 , H05K2203/0113 , H05K2203/0152 , H05K2203/0726 , H05K2203/167 , H05K3/365 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158
摘要： Shaped contacts (40,42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16,18,26,28) makes indentations (24a,24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34,36,38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed. This enables the contacts to penetrate foreign materials, such as oxides, that may form on the surface of the pads (56,58), to which the contacts are to be connected to ensure a good contact without any need for wiping action. The projecting contacts can also be pressed into plated holes (82,84) in a substrate, such as a printed wiring board, to which mateable/demateable electrical connection is to be made.
摘要翻译： 用于互连电路或用于集成电路测试探针的成形触头（40,42）作为电路迹线（34）作为不锈钢芯棒（10）的一部分进行电镀。 成型的硬化钢压痕工具（16,18,26,28）在心轴（10）的表面中形成具有预定形状的凹部（24a，24b），其设置有电介质图案，例如特氟隆（12） ）或光致抗蚀剂。 包括凹陷（24a，24b）的钢心轴的区域用导电材料（34,36,38）的图案电镀，并且电介质基底（32）层压到导电材料上。 由凹口形成的电路特征限定了锥形（18）或金字塔形（28）形状的凸起接触，其具有小的面积的自由端，允许更高的压力施加到触点抵靠的表面。 这使得触点能够渗透可能形成在焊盘（56,58）的表面上的诸如氧化物的异物，触点将被连接到其上，以确保良好的接触而不需要擦拭动作。 突出的触点也可以被压入到将要制造可配对/可分离的电连接的基板（例如印刷电路板）中的电镀孔（82,84）中。
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公开(公告)号：US5207887A
公开(公告)日：1993-05-04
申请号：US753400
申请日：1991-08-30
CPC分类号： G01R1/073 , H05K3/205 , H05K3/4007 , H05K2201/0367 , H05K2201/10666 , H05K2203/0113 , H05K2203/0152 , H05K2203/0726 , H05K2203/167 , H05K3/365
摘要： A circuit is produced by using a formed mandrel (10,12) and semi-additive techniques for creating circuit traces. A stainless steel mandrel (10) flash plated with copper (14) includes a depression (12) which will form a raised interconnection feature (24). Using a photolithographically formed pattern of photoresistive material (16) on the mandrel the selected pattern of circuit traces (18,20) and raised features (24) are electroplated onto the flash plated mandrel. After stripping the photoresist (16), a dielectric substrate (26) is laminated to the circuit traces, effectively encapsulating the traces on three sides. After removing the laminated circuit traces and dielectric from the mandrel the flash plated copper (14) is removed and the circuit covered with an insulation coverlay.
摘要翻译： 通过使用形成的心轴（10,12）和用于产生电路迹线的半添加技术来生产电路。 用铜（14）闪镀的不锈钢心轴（10）包括将形成升高的互连特征（24）的凹陷（12）。 使用在心轴上的光致抗蚀剂材料（16）的光刻形成图案，将电路迹线（18,20）和凸起特征（24）的选定图案电镀到闪光电镀心轴上。 在剥离光致抗蚀剂（16）之后，电介质衬底（26）被层压到电路迹线上，有效地将迹线封装在三面上。 在从心轴上去除叠层电路迹线和电介质后，去除闪镀铜（14），并且电路覆盖有绝缘覆盖层。
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公开(公告)号：US5180311A
公开(公告)日：1993-01-19
申请号：US643310
申请日：1991-01-22
IPC分类号： B29C33/56 , H01L23/50 , H01R12/61 , H01R13/24 , H01R43/16 , H05K1/00 , H05K3/20 , H05K3/36 , H05K3/40
CPC分类号： H01R12/613 , H05K3/4007 , H01L2924/0002 , H01R13/24 , H01R43/16 , H05K1/0393 , H05K2201/0314 , H05K2201/0367 , H05K2203/0113 , H05K2203/0726 , H05K3/205 , H05K3/365 , Y10T29/49155
摘要： An elastomeric member is incorporated between a conductor and a conductive interconnection bridge. This elastomeric member serves as a spring providing compliance to an interconnection so that the flatness requirements of an opposing mating structure may be relaxed. A flat metal mandrel is provided with an enlongated curved depression extending across a predetermined region where a resilient interconnection bridge is to be located. A nonconductive layer of Teflon is bonded to the surface of the mandrel. Grooves are ablated in a predetermined configuration down to the conductive surface of the mandrel using an excimer laser and a computer-controlled x-y table. Fineline electrical circuits are electrodeposited into the ablated grooves. The elongated curved depression is filled with a silicone material. The silicone material is permitted to cure to form a compliant elastomeric member having the shape of the elongated curved depression. An insulating backing is laminated onto the electrical circuits and the elastomeric member, and the completed resilient interconnection bridge is removed from the mandrel. Another method is used when the interconnection site is terminated on a circuit pad or on a high density linear connector configuration. In this method, elastomeric material is dispensed onto the circuit pad or along a line transverse to the high density linear connectors. After the elastomeric material has cured, electrical conductors are bonded thereacross to form raised compliant interconnection features.
摘要翻译： 导体和导电互连桥之间并入弹性部件。 该弹性体构件用作提供对互连的顺应性的弹簧，使得可以放松相对配合结构的平坦度要求。 扁平金属心轴设置有延伸穿过弹性互连桥要被定位的预定区域的伸长的弯曲凹陷。 特氟隆的非导电层结合到心轴的表面。 使用准分子激光器和计算机控制的x-y台，将凹槽以预定的形式烧蚀到心轴的导电表面。 电线电路电沉积到烧蚀槽中。 细长的弯曲凹陷填充有硅树脂材料。 允许硅氧烷材料固化以形成具有细长弯曲凹陷形状的柔顺弹性体构件。 将绝缘背衬层压到电路和弹性体构件上，并且完成的弹性互连桥从心轴移除。 当互连站点终止于电路板或高密度线性连接器配置时，使用另一种方法。 在该方法中，将弹性体材料分配到电路板上或沿着与高密度线性连接器横向的线分配。 在弹性体材料固化之后，电导体在其上结合以形成凸起的顺应互连特征。
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公开(公告)号：US5364277A
公开(公告)日：1994-11-15
申请号：US106975
申请日：1993-08-16
CPC分类号： C07J61/00
摘要： A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a Teflon pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.
摘要翻译： 用于柔性或常规电缆电缆终端的压力接触由电铸薄金属晶片（100）制成，其中一个晶片被电镀有升高的导电互连特征（122）。 电路（118,120）在其表面上具有特氟隆图案（16,16a）的不锈钢心轴（10,10a）上制成，其允许所需的电路（30,32,34,30a，32a，34a） ，78）电解镀在导电芯棒表面上。 心轴表面形成有凹陷（24,24aa）形式的突出特征，其将在端接晶片上形成一系列点或凸起的互连特征。 心轴还具有用于提供通过基底的电连接的突出柱（76）。
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公开(公告)号：US5261158A
公开(公告)日：1993-11-16
申请号：US919472
申请日：1992-07-24
IPC分类号： B29C33/56 , H01L23/50 , H01R12/61 , H01R13/24 , H01R43/16 , H05K1/00 , H05K3/20 , H05K3/36 , H05K3/40 , H01K3/22
CPC分类号： H01R12/613 , H05K3/4007 , H01L2924/0002 , H01R13/24 , H01R43/16 , H05K1/0393 , H05K2201/0314 , H05K2201/0367 , H05K2203/0113 , H05K2203/0726 , H05K3/205 , H05K3/365 , Y10T29/49155 , Y10T29/49158
摘要： An elastomeric member is incorporated between a conductor and a conductive interconnection bridge. This elastomeric member serves as a spring providing compliance to an interconnection so that the flatness requirements of an opposing mating structure may be relaxed. A flat metal mandrel is provided with an elongated curved depression extending across a predetermined region where a resilient interconnection bridge is to be located. A nonconductive layer of "TEFLON" is bonded to the surface of the mandrel. Grooves are ablated in a predetermined configuration down to the conductive surface of the mandrel using an excimer laser and a computer-controlled x-y table. Fineline electrical circuits are electrodeposited into the ablated grooves. The elongated curved depression is filled with a silicone material. The silicone material is permitted to cure to form a compliant elastomeric member having the shape of the elongated curved depression. An insulating backing is laminated onto the electrical circuits and the elastomeric member, and the completed resilient interconnection bridge is removed from the mandrel. Another method is used when the interconnection site is terminated on a circuit pad or on a high density linear connector configuration. In this method, elastomeric material is dispensed onto the circuit pad or along a line transverse to the high density linear connectors. After the elastomeric material has cured, electrical conductors are bonded thereacross to form raised compliant interconnection features.
摘要翻译： 导体和导电互连桥之间并入弹性部件。 该弹性体构件用作提供对互连的顺应性的弹簧，使得可以放松相对配合结构的平坦度要求。 扁平金属心轴设置有延伸穿过弹性互连桥被定位的预定区域的细长弯曲凹陷。 “TEFLON”的非导电层结合到心轴的表面。 使用准分子激光器和计算机控制的x-y台，将凹槽以预定的形式烧蚀到心轴的导电表面。 电线电路电沉积到烧蚀槽中。 细长的弯曲凹陷填充有硅树脂材料。 允许硅氧烷材料固化以形成具有细长弯曲凹陷形状的柔顺弹性体构件。 将绝缘背衬层压到电路和弹性体构件上，并且完成的弹性互连桥从心轴移除。 当互连站点终止于电路板或高密度线性连接器配置时，使用另一种方法。 在该方法中，将弹性体材料分配到电路板上或沿着与高密度线性连接器横向的线分配。 在弹性体材料固化之后，电导体在其上结合以形成凸起的顺应互连特征。
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公开(公告)号：US5197184A
公开(公告)日：1993-03-30
申请号：US580758
申请日：1990-09-11
CPC分类号： H05K3/205 , H05K3/4007 , H05K3/4647 , H05K3/4682 , H05K2201/0367 , H05K2201/0394 , H05K2201/09509 , H05K2203/0108 , H05K2203/0113 , H05K2203/0117 , H05K2203/0726 , Y10T29/49155 , Y10T29/49158
摘要： A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a TEFLON pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.
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公开(公告)号：US5340296A
公开(公告)日：1994-08-23
申请号：US108870
申请日：1993-08-18
IPC分类号： B29C33/56 , H01L23/50 , H01R12/61 , H01R13/24 , H01R43/16 , H05K1/00 , H05K3/20 , H05K3/36 , H05K3/40 , B29C39/10 , B29C39/26 , B29C41/42
CPC分类号： H01R12/613 , H05K3/4007 , H01L2924/0002 , H01R13/24 , H01R43/16 , H05K1/0393 , H05K2201/0314 , H05K2201/0367 , H05K2203/0113 , H05K2203/0726 , H05K3/205 , H05K3/365 , Y10T29/49155
摘要： An elastomeric member is incorporated between a conductor and a conductive interconnection bridge. This elastomeric member serves as a spring providing compliance to an interconnection so that the flatness requirements of an opposing mating structure may be relaxed. A flat metal mandrel is provided with an elongated curved depression extending across a predetermined region where a resilient interconnection bridge is to be located. A nonconductive layer of Teflon is bonded to the surface of the mandrel. Grooves are ablated in a predetermined configuration down to the conductive surface of the mandrel using an excimer laser and a computer-controlled x-y table. Fineline electrical circuits are electrodeposited into the ablated grooves. The elongated curved depression is filled with a silicone material. The silicone material is permitted to cure to form a compliant elastomeric member having the shape of the elongated curved depression. An insulating backing is laminated onto the electrical circuits and the elastomeric member, and the completed resilient interconnection bridge is removed from the mandrel. Another method is used when the interconnection site is terminated on a circuit pad or on a high density linear connector configuration. In this method, elastomeric material is dispensed onto the circuit pad or along a line transverse to the high density linear connectors. After the elastomeric material has cured, electrical conductors are bonded thereacross to form raised compliant interconnection features.
摘要翻译： 导体和导电互连桥之间并入弹性部件。 该弹性体构件用作提供对互连的顺应性的弹簧，使得可以放松相对配合结构的平坦度要求。 扁平金属心轴设置有延伸穿过弹性互连桥被定位的预定区域的细长弯曲凹陷。 特氟隆的非导电层结合到心轴的表面。 使用准分子激光器和计算机控制的x-y台，将凹槽以预定的形式烧蚀到心轴的导电表面。 电线电路电沉积到烧蚀槽中。 细长的弯曲凹陷填充有硅树脂材料。 允许硅氧烷材料固化以形成具有细长弯曲凹陷形状的柔顺弹性体构件。 将绝缘背衬层压到电路和弹性体构件上，并且完成的弹性互连桥从心轴移除。 当互连站点终止于电路板或高密度线性连接器配置时，使用另一种方法。 在该方法中，将弹性体材料分配到电路板上或沿着与高密度线性连接器横向的线分配。 在弹性体材料固化之后，电导体在其上结合以形成凸起的顺应互连特征。
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公开(公告)号：US5245135A
公开(公告)日：1993-09-14
申请号：US870972
申请日：1992-04-20
CPC分类号： H05K3/4007 , H05K2201/0367 , H05K2201/09909 , H05K2203/063 , H05K3/4611 , Y10T29/49128
摘要： A high density of interconnection sites on a dielectric substrate is provided by producing a laminated assembly with multiple layers of conductors (11, 21) positioned one above the other within the substrate (8). Each conductor (11, 21) terminates at a raised feature (12, 22) projecting beyond the surface of the substrate (8) for connection in an electrical circuit. This permits the conductors (11, 21) to be positioned in the same plane perpendicular to the substrate (8) so that two rows of termination pads (12, 22) may be provided without leaving space between the pads of one for the conductors of the other. Efficient, high speed impedance matching may be accomplished by the addition of a grounding conductor (26) between two signal layers of circuitry within the substrate, also provided with raised features (27) extending to the exterior of the substrate (8).
摘要翻译： 通过在基板（8）内制造具有多层导体（11,21）的多层导体（11,21）来形成介质基片上的高密度互连部位。 每个导体（11,21）终止于突出超过衬底（8）的表面的凸起特征（12,22），用于在电路中连接。 这允许导体（11,21）定位在与衬底（8）垂直的同一平面中，使得可以提供两排终端焊盘（12,22），而不会在一个的导体之间留下空间 另一个。 有效的高速阻抗匹配可以通过在衬底内的电路的两个信号层之间添加接地导体（26）来实现，还具有延伸到衬底（8）的外部的凸起特征（27）。
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