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公开(公告)号：US07821104B2
公开(公告)日：2010-10-26
申请号：US12201623
申请日：2008-08-29
申请人： Chu-Chung Lee , Min Ding , Kevin J. Hess , Peng Su
发明人： Chu-Chung Lee , Min Ding , Kevin J. Hess , Peng Su
IPC分类号： H01L23/544 , H01L23/58 , H01L21/768 , H01L21/78
CPC分类号： H01L23/562 , H01L23/16 , H01L23/3192 , H01L23/585 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/01079 , H01L2924/12044 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A package device has a package substrate, a semiconductor die on the package substrate, and a molding compound on the package substrate and over the semiconductor die. The semiconductor die has a last passivation layer, an active circuit region in an internal portion of the die, an edge seal region along a periphery of the die, and a structure over the edge seal region extending above the last passivation layer, covered by the molding compound, and comprising a polymer material. The structure may extend at least five microns above the last passivation layer. The structure stops cracks in the molding compound from reaching the active circuit region. The cracks, if not stopped, can reach wire bonds in the active region and cause them to fail.
摘要翻译： 封装器件具有封装衬底，封装衬底上的半导体管芯，以及封装衬底上的半导体管芯上的模制化合物。 半导体管芯具有最后的钝化层，在管芯的内部部分中的有源电路区域，沿着管芯周边的边缘密封区域以及在最后钝化层上方延伸的边缘密封区域上的结构，被覆盖在 模塑料，并且包含聚合物材料。 该结构可以延伸至最后钝化层上方至少五微米。 该结构阻止模塑料中的裂纹到达有源电路区域。 裂纹如果不停止，可以在活动区域中达到引线键，并导致它们失效。
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公开(公告)号：US20220410735A1
公开(公告)日：2022-12-29
申请号：US17385947
申请日：2021-07-27
申请人： Peng Su
发明人： Peng Su
摘要： The invention relates to the electricity field, in particular to a novel charging pile connection box, comprising connection box, a connection hole arranged on outer wall of the connection box, a first mounting piece provided inside the connection box, a gasket provided outside the connection box, and a second mounting piece, a screw, the hole wall of the connection hole is provided with a notch, before preparing for connection, the user looses the screw with a screwdriver, disassembles the second mounting piece, the gasket and the first mounting piece in turn, and then disassembles the connection box and takes out the first mounting piece that falls inside the connection box.
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公开(公告)号：US20120063096A1
公开(公告)日：2012-03-15
申请号：US12879795
申请日：2010-09-10
申请人： Andrew V. Kearney , Peng Su
发明人： Andrew V. Kearney , Peng Su
CPC分类号： H01L24/64 , H01L23/3107 , H01L23/3677 , H01L23/42 , H01L23/4334 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： To reduce the thermal stresses that may be caused by a difference in thermal expansion coefficients between a molded casing and an active side of a semiconductor device embedded in the molded casing, and thus reduce the number of corresponding failures caused by the thermal stresses, the active side of the semiconductor device is arranged face-down, towards a substrate supporting the semiconductor device. The semiconductor device includes a through via that electrically connects the active side of the semiconductor device to a passive side of the semiconductor device. A wire bond electrically connects the passive side of the semiconductor device to the substrate. To increase the dissipation of heat generated in the semiconductor device, a thermally conductive slug may be disposed in the substrate, and the active side of the semiconductor device may be attached to the thermally conductive slug.
摘要翻译： 为了减少可能由模制壳体和嵌入在模制套管中的半导体器件的有源侧之间的热膨胀系数的差异引起的热应力，从而减少由热应力引起的相应故障的数量， 半导体器件的侧面朝向朝向支撑半导体器件的衬底的面朝下布置。 半导体器件包括将半导体器件的有源侧电连接到半导体器件的无源侧的贯通孔。 引线接合将半导体器件的无源侧电连接到衬底。 为了增加在半导体器件中产生的热耗散，可以在衬底中设置导热块，并且半导体器件的有源侧可以附着到导热块上。
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公开(公告)号：US20060292711A1
公开(公告)日：2006-12-28
申请号：US11168837
申请日：2005-06-28
申请人： Peng Su , Scott Pozder , David Wontor , Jie-Hua Zhao
发明人： Peng Su , Scott Pozder , David Wontor , Jie-Hua Zhao
CPC分类号： G01R31/046 , H01L22/12 , H01L22/20 , H01L23/3192 , H01L24/05 , H01L24/13 , H01L2224/0346 , H01L2224/0347 , H01L2224/0401 , H01L2224/05018 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05084 , H01L2224/05147 , H01L2224/05166 , H01L2224/05541 , H01L2224/05556 , H01L2224/05559 , H01L2224/05572 , H01L2224/0558 , H01L2224/05624 , H01L2224/05647 , H01L2224/05671 , H01L2224/05681 , H01L2224/05684 , H01L2224/13006 , H01L2224/13076 , H01L2224/13111 , H01L2224/13147 , H01L2224/136 , H01L2224/1403 , H01L2224/14051 , H01L2224/14505 , H01L2224/14515 , H01L2924/00013 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/3512 , H01L2924/00014 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00012
摘要： A bump shear test is disclosed for evaluating the mechanical integrity of low-k interconnect stacks in an integrated circuit which includes a die test structure (11) having a stiff structural component (501, 502) positioned above and affixed to a conductive metal pad (103) formed in a last metal layer (104). The die test structure (11) may also include a dedicated support structure (41) below the conductive metal pad which includes a predetermined pattern of metal lines formed in the interconnect layers (18, 22, 26). After mounting the integrated circuit in a test device, a shear knife (601) is positioned for lateral movement to cause the shear knife to contact the stiff structural component (501). Any damage to the die test structure caused by the lateral movement of the shear knife may be assessed to evaluate the mechanical integrity of the interconnect stack.
摘要翻译： 公开了一种用于评估集成电路中的低k互连叠层的机械完整性的凸块剪切试验，该集成电路包括具有刚性结构部件（501,502）的模具测试结构（11），该结构部件位于导电金属焊盘 103）形成在最后的金属层（104）中。 模具测试结构（11）还可以包括在导电金属焊盘下方的专用支撑结构（41），其包括形成在互连层（18,22,26）中的预定图案的金属线。 在将集成电路安装在测试装置中之后，剪刀（601）被定位用于横向运动，以使剪切刀与刚性结构部件（501）接触。 可以评估由剪切刀的横向运动引起的模具测试结构的任何损坏，以评估互连叠层的机械完整性。
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公开(公告)号：US11208057B2
公开(公告)日：2021-12-28
申请号：US16851103
申请日：2020-04-17
申请人： Peng Su
发明人： Peng Su
摘要： The invention discloses a RV sewer hose support with adjustable supporting height, comprising supporting components; adjacent supporting components are rotatably connected; the component comprises a supporting plate and a supporting horizontal rod; supporting vertical rods are symmetrically arranged above the plate, and the vertical rod has connecting holes; one side of the horizontal rod is symmetrically provided with a supporting post; supporting legs are symmetrically provided below the plate; a clamping groove is provided on the opposite outer side of the vertical rod away from the plate. The invention use only two sets of molds to realize the production of the main parts, which not only saves costs, but also facilitates adjusting the supporting height according to the actual situation; it avoids wasting molds and raw materials due to the need of different heights in actual use, and has a stable support, beautiful appearance and long service life.
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公开(公告)号：US07622309B2
公开(公告)日：2009-11-24
申请号：US11168837
申请日：2005-06-28
申请人： Peng Su , Scott K. Pozder , David G. Wontor , Jie-Hua Zhao
发明人： Peng Su , Scott K. Pozder , David G. Wontor , Jie-Hua Zhao
IPC分类号： H01L21/66
CPC分类号： G01R31/046 , H01L22/12 , H01L22/20 , H01L23/3192 , H01L24/05 , H01L24/13 , H01L2224/0346 , H01L2224/0347 , H01L2224/0401 , H01L2224/05018 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05084 , H01L2224/05147 , H01L2224/05166 , H01L2224/05541 , H01L2224/05556 , H01L2224/05559 , H01L2224/05572 , H01L2224/0558 , H01L2224/05624 , H01L2224/05647 , H01L2224/05671 , H01L2224/05681 , H01L2224/05684 , H01L2224/13006 , H01L2224/13076 , H01L2224/13111 , H01L2224/13147 , H01L2224/136 , H01L2224/1403 , H01L2224/14051 , H01L2224/14505 , H01L2224/14515 , H01L2924/00013 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/3512 , H01L2924/00014 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00012
摘要： A bump shear test is disclosed for evaluating the mechanical integrity of low-k interconnect stacks in an integrated circuit which includes a die test structure (11) having a stiff structural component (501, 502) positioned above and affixed to a conductive metal pad (103) formed in a last metal layer (104). The die test structure (11) may also include a dedicated support structure (41) below the conductive metal pad which includes a predetermined pattern of metal lines formed in the interconnect layers (18, 22, 26). After mounting the integrated circuit in a test device, a shear knife (601) is positioned for lateral movement to cause the shear knife to contact the stiff structural component (501). Any damage to the die test structure caused by the lateral movement of the shear knife may be assessed to evaluate the mechanical integrity of the interconnect stack.
摘要翻译： 公开了一种用于评估集成电路中的低k互连叠层的机械完整性的凸块剪切试验，该集成电路包括具有刚性结构部件（501,502）的模具测试结构（11），该结构部件位于导电金属焊盘 103）形成在最后的金属层（104）中。 模具测试结构（11）还可以包括在导电金属焊盘下方的专用支撑结构（41），其包括形成在互连层（18,22,26）中的预定图案的金属线。 在将集成电路安装在测试装置中之后，剪刀（601）被定位用于横向运动，以使剪切刀与刚性结构部件（501）接触。 可以评估由剪切刀的横向运动引起的模具测试结构的任何损坏，以评估互连叠层的机械完整性。
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公开(公告)号：US08405203B2
公开(公告)日：2013-03-26
申请号：US12879795
申请日：2010-09-10
申请人： Andrew V. Kearney , Peng Su
发明人： Andrew V. Kearney , Peng Su
CPC分类号： H01L24/64 , H01L23/3107 , H01L23/3677 , H01L23/42 , H01L23/4334 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： To reduce the thermal stresses that may be caused by a difference in thermal expansion coefficients between a molded casing and an active side of a semiconductor device embedded in the molded casing, and thus reduce the number of corresponding failures caused by the thermal stresses, the active side of the semiconductor device is arranged face-down, towards a substrate supporting the semiconductor device. The semiconductor device includes a through via that electrically connects the active side of the semiconductor device to a passive side of the semiconductor device. A wire bond electrically connects the passive side of the semiconductor device to the substrate. To increase the dissipation of heat generated in the semiconductor device, a thermally conductive slug may be disposed in the substrate, and the active side of the semiconductor device may be attached to the thermally conductive slug.
摘要翻译： 为了减少可能由模制壳体和嵌入在模制套管中的半导体器件的有源侧之间的热膨胀系数的差异引起的热应力，从而减少由热应力引起的相应故障的数量， 半导体器件的侧面朝向朝向支撑半导体器件的衬底的面朝下布置。 半导体器件包括将半导体器件的有源侧电连接到半导体器件的无源侧的贯通孔。 引线接合将半导体器件的无源侧电连接到衬底。 为了增加在半导体器件中产生的热耗散，可以在衬底中设置导热块，并且半导体器件的有源侧可以附着到导热块上。
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