公开(公告)号：US07994625B2

公开(公告)日：2011-08-09

申请号：US12273540

申请日：2008-11-18

申请人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

发明人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

IPC分类号： H01L23/48

CPC分类号： H01L24/73 ,  H01L23/3128 ,  H01L24/28 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有内部结构基板空腔的内部结构基板; 在内部结构基板上安装内部结构模具; 用内部结构封装封装内部结构管芯以形成内部结构封装; 在所述内部结构衬底腔内形成内部结构的内部结构包封; 将内部结构封装安装在基板上方; 并用封装将衬底上的内部结构封装封装。

公开(公告)号：US08633058B2

公开(公告)日：2014-01-21

申请号：US13052590

申请日：2011-03-21

申请人： DaeSik Choi ,  Jong-Woo Ha ,  Seung Won Kim

发明人： DaeSik Choi ,  Jong-Woo Ha ,  Seung Won Kim

IPC分类号： H01L21/00

CPC分类号： H01L23/3135 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; connecting an integrated circuit die to the substrate, with the integrated circuit die having peripheral sides; molding a step mold covering one of the peripheral sides; attaching an intermediate die directly over the integrated circuit die, offset to one of the peripheral sides adjacent to the step mold; and directly connecting the intermediate die to the substrate.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 将集成电路管芯连接到衬底，集成电路管芯具有周边; 模制覆盖一个周边的阶梯模; 将中间模直接连接在集成电路模具上，偏移到与步进模具相邻的周边之一; 并将中间管芯直接连接到基板。

公开(公告)号：US20120241979A1

公开(公告)日：2012-09-27

申请号：US13052590

申请日：2011-03-21

申请人： DaeSik Choi ,  Jong-Woo Ha ,  Seung Won Kim

发明人： DaeSik Choi ,  Jong-Woo Ha ,  Seung Won Kim

IPC分类号： H01L23/49 ,  H01L21/50

CPC分类号： H01L23/3135 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; connecting an integrated circuit die to the substrate, with the integrated circuit die having peripheral sides; molding a step mold covering one of the peripheral sides; attaching an intermediate die directly over the integrated circuit die, offset to one of the peripheral sides adjacent to the step mold; and directly connecting the intermediate die to the substrate.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 将集成电路管芯连接到衬底，集成电路管芯具有周边; 模制覆盖一个周边的阶梯模; 将中间模直接连接在集成电路模具上，偏移到与步进模具相邻的周边之一; 并将中间管芯直接连接到基板。

公开(公告)号：US20100123232A1

公开(公告)日：2010-05-20

申请号：US12273540

申请日：2008-11-18

申请人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

发明人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L24/73 ,  H01L23/3128 ,  H01L24/28 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有内部结构基板空腔的内部结构基板; 在内部结构基板上安装内部结构模具; 用内部结构封装封装内部结构管芯以形成内部结构封装; 在所述内部结构衬底腔内形成内部结构的内部结构包封; 将内部结构封装安装在基板上方; 并用封装将衬底上的内部结构封装封装。

公开(公告)号：US08823160B2

公开(公告)日：2014-09-02

申请号：US12197209

申请日：2008-08-22

申请人： Jong-Woo Ha ,  DaeSik Choi ,  DeokKyung Yang

发明人： Jong-Woo Ha ,  DaeSik Choi ,  DeokKyung Yang

IPC分类号： H01L23/48 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes providing a carrier having a first side and a second side; mounting an integrated circuit over the carrier with the first side facing the integrated circuit; attaching an external interconnect to the second side; and forming an encapsulation over the integrated circuit and around the external interconnect with the external interconnect exposed from the encapsulation and with the encapsulation and the second side forming a cavity.

摘要翻译： 集成电路封装系统包括提供具有第一侧和第二侧的载体; 将集成电路安装在载体上，第一面朝向集成电路; 将外部互连件连接到第二侧; 以及在所述集成电路上并围绕所述外部互连形成封装，所述外部互连与所述封装暴露的所述外部互连以及所述封装并且所述第二侧形成空腔。

公开(公告)号：US08383458B2

公开(公告)日：2013-02-26

申请号：US12974265

申请日：2010-12-21

申请人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L24/81 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/8592 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

公开(公告)号：US20100244217A1

公开(公告)日：2010-09-30

申请号：US12410983

申请日：2009-03-25

申请人： Jong-Woo Ha ,  DaeSik Choi ,  Byoung Wook Jang

发明人： Jong-Woo Ha ,  DaeSik Choi ,  Byoung Wook Jang

IPC分类号： H01L23/52 ,  H01L21/50 ,  H01L23/28

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/4951 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first stack layer including a first device over a first substrate, the first device including a through silicon via; configuring a second stack layer over the first stack layer, the second stack layer including an analog device; configuring a third stack layer over the second stack layer; and encapsulating the integrated circuit packaging system.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供包括第一衬底上的第一器件的第一堆叠层，所述第一器件包括硅通孔; 在所述第一堆叠层上配置第二堆叠层，所述第二堆叠层包括模拟设备; 在所述第二堆叠层上配置第三堆叠层; 并封装集成电路封装系统。

公开(公告)号：US20090057864A1

公开(公告)日：2009-03-05

申请号：US12201896

申请日：2008-08-29

申请人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/488 ,  H01L21/58

CPC分类号： H01L24/81 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/8592 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

摘要： A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

公开(公告)号：US08405197B2

公开(公告)日：2013-03-26

申请号：US12410983

申请日：2009-03-25

申请人： Jong-Woo Ha ,  DaeSik Choi ,  Byoung Wook Jang

发明人： Jong-Woo Ha ,  DaeSik Choi ,  Byoung Wook Jang

IPC分类号： H01L21/58 ,  H01L23/492

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/4951 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first stack layer including a first device over a first substrate, the first device including a through silicon via; configuring a second stack layer over the first stack layer, the second stack layer including an analog device; configuring a third stack layer over the second stack layer; and encapsulating the integrated circuit packaging system.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供包括第一衬底上的第一器件的第一堆叠层，所述第一器件包括硅通孔; 在所述第一堆叠层上配置第二堆叠层，所述第二堆叠层包括模拟设备; 在所述第二堆叠层上配置第三堆叠层; 并封装集成电路封装系统。

公开(公告)号：US20120235307A1

公开(公告)日：2012-09-20

申请号：US13048859

申请日：2011-03-15

申请人： Jong-Woo Ha ,  DaeSik Choi ,  Byoung Wook Jang

发明人： Jong-Woo Ha ,  DaeSik Choi ,  Byoung Wook Jang

IPC分类号： H01L23/52 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit die having an active side and a passive side; providing a contact pad having a top side oriented in a same direction as the passive side; connecting an inner bond wire to the contact pad and the integrated circuit die; and molding a stacking structure around the contact pad, the inner bond wire, and the integrated circuit die with the passive side and the top side exposed, and the stacking structure having a top structure surface on top and adjacent to or below the integrated circuit die, and a horizontal member under the integrated circuit die and forming a cavity.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有有源侧和被动侧的集成电路管芯; 提供具有朝向与被动侧相同方向的顶面的接触垫; 将内部接合线连接到接触焊盘和集成电路管芯; 以及在所述接触焊盘，所述内部接合线和所述集成电路管芯周围形成堆叠结构，其中所述被动侧和所述顶侧暴露，并且所述堆叠结构具有位于所述集成电路模具的顶部并且靠近所述集成电路模具的顶部结构表面 ，以及集成电路模具下方的水平构件，并形成空腔。