摘要:
A programmable logic device (PLD) includes a non-volatile memory, a configuration memory, and a control circuitry. The control circuitry couples to the non-volatile memory and to the configuration memory. A set of voltages are derived from the outputs of the control circuitry, and are applied to circuitry within the PLD.
摘要:
A programmable logic device (PLD) includes a non-volatile memory, a configuration memory, and a control circuitry. The control circuitry couples to the non-volatile memory and to the configuration memory. A set of voltages are derived from the outputs of the control circuitry, and are applied to circuitry within the PLD.
摘要:
A programmable logic device (PLD) includes a non-volatile memory, a configuration memory, and a control circuitry. The control circuitry couples to the non-volatile memory and to the configuration memory. A set of voltages are derived from the outputs of the control circuitry, and are applied to circuitry within the PLD.
摘要:
A programmable logic device (PLD) includes a non-volatile memory, a configuration memory, and a control circuitry. The control circuitry couples to the non-volatile memory and to the configuration memory. A set of voltages are derived from the outputs of the control circuitry, and are applied to circuitry within the PLD.
摘要:
Memory elements are provided that exhibit immunity to soft error upset events when subjected to radiation strikes such as high-energy atomic particle strikes. The memory elements may each have four inverter-like transistor pairs that form a bistable element and a pair of address transistors. There may be four nodes in the transistor each of which is associated with a respective one of the four inverter-like transistor pairs. There may be two control transistors each of which is coupled between the transistors in a respective one of the inverter-like transistor pairs. During data writing operations, the two control transistors may be turned off to temporarily decouple the transistors in two of the four inverter-like transistor pairs.
摘要:
Memory elements are provided that exhibit immunity to soft error upset events when subjected to radiation strikes such as high-energy atomic particle strikes. The memory elements may each have four inverter-like transistor pairs that form a bistable element and a pair of address transistors. There may be four nodes in the transistor each of which is associated with a respective one of the four inverter-like transistor pairs. There may be two control transistors each of which is coupled between the transistors in a respective one of the inverter-like transistor pairs. During data writing operations, the two control transistors may be turned off to temporarily decouple the transistors in two of the four inverter-like transistor pairs.
摘要:
Asymmetric transistors may be formed by creating pocket implants on one source-drain terminal of a transistor and not the other. Asymmetric transistors may also be formed using dual-gate structures having first and second gate conductors of different work functions. Stacked transistors may be formed by stacking two transistors of the same channel type in series. One of the source-drain terminals of each of the two transistors is connected to a common node. The gates of the two transistors are also connected together. The two transistors may have different threshold voltages. The threshold voltage of the transistor that is located higher in the stacked transistor may be provided with a lower threshold voltage than the other transistor in the stacked transistor. Stacked transistors may be used to reduce leakage currents in circuits such as memory cells. Asymmetric transistors may also be used in memory cells to reduce leakage.
摘要:
A programmable integrated circuit has multiple power supply voltages. Power supply voltages are distributed using power supply distribution lines. The integrated circuit has programmable power supply voltage selection switches. Each power supply voltage selection switch has its inputs connected to the power supply distribution lines and supplies a selected power supply voltage to a circuit block at its output. Test circuits are provided for testing the power supply voltage selection switches. During testing, the power supply voltage selection switches are adjusted to produce various power supply voltages at their outputs. The test circuit associated with each switch performs voltage comparisons to determine whether the switch is functioning properly. Each test circuit produces a test result based on its voltage comparison. The test results from the test circuits are provided to a scan chain, which unloads the test results from the integrated circuit to a tester for analysis.
摘要:
Integrated circuits may include memory elements that are provided with voltage overstress protection. One suitable arrangement of a memory cell may include a latch with two cross-coupled inverters. Each of the two cross-coupled inverters may be coupled between first and second power supply lines and may include a transistor with a gate that is connected to a separate power supply line. Another suitable memory cell arrangement may include three cross-coupled circuits. Two of the three circuits may be powered by a first positive power supply line, while the remaining circuit may be powered by a second positive power supply line. These memory cells may be used to provide an elevated positive static control signal and a lowered ground static control signal to a corresponding pass gate. These memory cells may include access transistors and read buffer circuits that are used during read/write operations.
摘要:
The present invention is an ESD protection circuit that discharges both positive and negative electrostatic events. A preferred embodiment of the circuit comprises a first NMOS transistor having a source and drain connected between ground and an I/O pad and second and third NMOS transistors and a resistor connected in series between ground and the I/O pad. The gate and body of the first transistor and the bodies of the second and third transistors are connected to a node between the second and third transistors; the gate of the second transistor is connected to the I/O pad through a second resistor; and the gate of the third transistor is connected to ground. The second and third transistors maintain the gate and body voltage of the first transistor at the pad voltage when the pad experiences negative voltages and at ground voltage when the pad experiences positive voltages. As a result, the first transistor can discharge both negative and positive ESC events through parasitic bipolar conduction, without any additional circuits such as diodes used either to stop leakage currents or to conduct ESD current.