公开(公告)号：US20080029879A1

公开(公告)日：2008-02-07

申请号：US11711595

申请日：2007-02-27

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

IPC分类号： H01L23/10 ,  H01L21/58

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Lidded chip packages are provided in which an optoelectronic device chip has microelectronic circuits exposed at a surface of the chip with a lid mounted to overlie the optoelectronic device and the microelectronic circuits. An opaque film may be attached to the lid to overlie the microelectronic circuits while exposing the optoelectronic device. Lidded chip packages are also provided in which the lid overlies an active or passive device mounted to the chip. Wiring traces may be embedded within an adhesive between the lid and the chip.

摘要翻译： 提供了带芯芯片封装，其中光电子器件芯片具有在芯片的表面处暴露在其上的微电子电路，其上安装有覆盖在光电子器件和微电子电路上的盖。 不透明的膜可以附着到盖子上以覆盖微电子电路，同时暴露光电子器件。 还提供了带盖的芯片封装，其中盖子覆盖安装在芯片上的有源或无源器件。 接线迹线可以嵌入在盖子和芯片之间的粘合剂中。

公开(公告)号：US20060220234A1

公开(公告)日：2006-10-05

申请号：US11322617

申请日：2005-12-30

申请人： Kenneth Honer ,  Giles Humpston ,  David Tuckerman ,  Michael Nystrom

发明人： Kenneth Honer ,  Giles Humpston ,  David Tuckerman ,  Michael Nystrom

IPC分类号： H01L23/34

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

公开(公告)号：US20080002460A1

公开(公告)日：2008-01-03

申请号：US11711882

申请日：2007-02-27

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom

IPC分类号： H01L31/0232 ,  G11C11/00 ,  H01L21/02 ,  H01L21/82 ,  H01L23/02 ,  H01L23/04

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for fabricating packaged chips, each packaged chip having a protective layer, e.g., a transparent lid, metallic enclosure layer, shield layer, etc., and methods are provided for manufacturing such protective layer to be incorporated into a packaged chip. Lidded chip structures, and assemblies are also provided which include lidded chips.

摘要翻译： 提供了用于制造封装芯片的方法，每个封装芯片具有保护层，例如透明盖，金属外壳层，屏蔽层等，并且提供了用于制造要并入封装芯片的保护层的方法。 还提供了包括芯片的芯片结构和组件。

公开(公告)号：US20080001241A1

公开(公告)日：2008-01-03

申请号：US11713804

申请日：2007-03-01

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Charles Goudge ,  Anita Woll

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Charles Goudge ,  Anita Woll

IPC分类号： H01L31/0203 ,  H01L21/50 ,  H01L23/02

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for fabricating packaged chips having protective layers, e.g., lids or other overlying layers having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures and assemblies including lidded chips are also provided.

摘要翻译： 提供了用于制造具有保护层的封装芯片的方法，例如具有透明，部分透明或不透明特性的盖或其它上覆层或这些特性的组合。 提供了制造封装芯片的方法。 还提供了带芯芯片的芯片结构和组件。

公开(公告)号：US20070145536A1

公开(公告)日：2007-06-28

申请号：US11318815

申请日：2005-12-27

申请人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.

摘要翻译： 在半导体晶片上提供柔性结构。 顺应结构包括腔。 顺应结构和晶片在用于在柔性结构上形成导电元件的工艺步骤期间密封空腔。 处理后，通风口打开，将空腔连接到组件的外部。 通孔可以通过切断晶片和柔顺结构以形成单独的单元而形成，使得分离平面与通道或与空腔连通的其它空隙相交。 或者，可以通过在柔性结构中形成孔或通过打开延伸穿过晶片的孔而形成通气口。

公开(公告)号：US20070190747A1

公开(公告)日：2007-08-16

申请号：US11655739

申请日：2007-01-19

申请人： Giles Humpston ,  Michael Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky

发明人： Giles Humpston ,  Michael Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky

IPC分类号： H01L21/00

CPC分类号： B81C1/00285 ,  B81C2203/0118 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for making a plurality of lidded microelectronic elements. In an exemplary embodiment, a lid wafer is assembled with a device wafer. Desirably, the lid wafer is severed into a plurality of lid elements to remove portions of the lid wafer overlying contacts at a front face of the device wafer adjacent to dicing lanes of the device wafer. Thereafter, desirably, the device wafer is severed along the dicing lanes to provide a plurality of lidded microelectronic elements.

摘要翻译： 提供了制造多个带盖的微电子元件的方法。 在示例性实施例中，盖晶片与装置晶片组装在一起。 期望地，将盖晶片切割成多个盖元件以去除盖子晶片的覆盖在与器件晶片的切割通道相邻的器件晶片的正面处的触点的部分。 此后，期望地，器件晶片沿着切割通道切断以提供多个带盖的微电子元件。

公开(公告)号：US20070148824A1

公开(公告)日：2007-06-28

申请号：US11642616

申请日：2006-12-20

申请人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/78 ,  H01L21/00

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and terminals carried on the compliant structure adjacent the cavities and electrically connected to the wafer, the cavities being substantially sealed. The method includes subdividing the in-process assembly to form individual chip assemblies, each including one or more chip regions of the wafer, a portion of the compliant structure and the terminals carried on the portion, and opening vents communicating with said cavities after said providing step.

摘要翻译： 一种制造芯片组件的方法包括提供包括半导体晶片，覆盖晶片前表面的晶片兼容结构和空腔的过程中组件以及与该空腔相邻并且电连接到晶片的柔性结构承载的端子， 空腔基本上被密封。 该方法包括将进程中的组件细分以形成各自的芯片组件，每个芯片组件包括晶片的一个或多个芯片区域，柔性结构的一部分和承载在该部分上的端子，以及在提供之后与所述空腔连通的开口 步。

公开(公告)号：US20070190691A1

公开(公告)日：2007-08-16

申请号：US11655777

申请日：2007-01-19

申请人： Giles Humpston ,  Michael Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky ,  Mitchell Reifel

发明人： Giles Humpston ,  Michael Nystrom ,  Vage Oganesian ,  Yulia Aksenton ,  Osher Avsian ,  Robert Burtzlaff ,  Avi Dayan ,  Andrey Grinman ,  Felix Hazanovich ,  Ilya Hecht ,  Charles Rosenstein ,  David Ovrutsky ,  Mitchell Reifel

IPC分类号： H01L21/00

CPC分类号： B81C1/00269 ,  B81C2203/0118 ,  H01L21/50 ,  H01L23/10 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14618 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.

摘要翻译： 提供封装的微电子元件。 在一个示例性实施例中，具有前表面和限定前表面的多个周边边缘的微电子元件在前表面具有一个器件区域，以及一个接触区域与多个暴露的接触件相邻，至少一个周边边缘。 封装元件可以包括覆盖微电子元件的前表面的多个支撑壁，使得盖可以安装到微电子元件上方的支撑壁上。 例如，盖可以具有面向正面的内表面。 在一个具体实施例中，一些触点可以暴露在盖的边缘之外。

公开(公告)号：US20050093186A1

公开(公告)日：2005-05-05

申请号：US10698210

申请日：2003-10-31

申请人： Michael Nystrom ,  Annette Grot

发明人： Michael Nystrom ,  Annette Grot

IPC分类号： B29D99/00 ,  B29D11/00

CPC分类号： B29D11/00 ,  B29C2059/023

摘要： Selective area stamping of optical elements may be performed to make multiple micro-optic components on one or two sides of a substrate may be fabricated using a batch process. The presence of molding material may be controlled on the substrate through the use of gaps.

摘要翻译： 可以执行光学元件的选择性区域冲压，以便可以使用间歇工艺来制造在衬底的一侧或两侧上的多个微光学元件。 成型材料的存在可以通过使用间隙来控制在基材上。

公开(公告)号：US20060022696A1

公开(公告)日：2006-02-02

申请号：US10910060

申请日：2004-08-02

申请人： Michael Nystrom ,  Gloria Hofler

发明人： Michael Nystrom ,  Gloria Hofler

IPC分类号： G01R31/26

CPC分类号： G01R31/302 ,  G01R1/072

摘要： Methods and apparatus for non-contact electrical probes are described. In accordance with the invention, non-contact electrical probes use negative or positive corona discharge. Non-contact electrical probes are suited for testing of OLED flat panel displays.

摘要翻译： 描述了非接触电探针的方法和装置。 根据本发明，非接触电探针使用负或正电晕放电。 非接触式电探头适用于OLED平板显示器的测试。