公开(公告)号：US20070257364A1

公开(公告)日：2007-11-08

申请号：US11741422

申请日：2007-04-27

申请人： David Van Heerden ,  Timothy Rude ,  Jesse Newson ,  Zhaojuan He ,  Etienne Besnoin ,  Ramzi Vincent ,  Timothy Weihs

发明人： David Van Heerden ,  Timothy Rude ,  Jesse Newson ,  Zhaojuan He ,  Etienne Besnoin ,  Ramzi Vincent ,  Timothy Weihs

IPC分类号： H01L23/48

CPC分类号： H01L24/29 ,  B23K1/0006 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099

摘要： The present inventors have observed that in some applications of reactive composite joining there is escape of a portion of the molten joining material through the edges of the joining regions. Such escape is not only a waste of expensive material (e.g. gold or indium) but also a reduction from the optimal thickness of the joining regions. In some applications, such escape also presents risk of short circuits or even fire. In this invention, two approaches are taken toward preventing damage to surroundings by the escape of molten joining material. First, escape may be prevented by trapping or containing the molten material near the joint, using barriers, dams, or similar means. Second, escape may be reduced by adjusting parameters within the joint, such as solder composition, joining pressure, or RCM thickness.

摘要翻译： 本发明人已经观察到，在反应性复合物接合的一些应用中，熔融接合材料的一部分通过接合区域的边缘逸出。 这种逃逸不仅浪费昂贵的材料（例如金或铟），而且还减少了连接区域的最佳厚度。 在某些应用中，这种逃生也存在短路或甚至火灾的风险。 在本发明中，采取两种途径来防止熔融接合材料的逸出对周围环境的损害。 首先，可以通过使用屏障，水坝或类似手段在接头附近捕获或容纳熔融材料来防止逃逸。 其次，通过调节接头内的参数，例如焊料组成，接合压力或RCM厚度，可以减少泄漏。

公开(公告)号：US08336457B2

公开(公告)日：2012-12-25

申请号：US11454091

申请日：2006-06-15

申请人： Timothy P. Weihs ,  Etienne Besnoin ,  Ramzi Vincent ,  Somasundaram Valliappan ,  Ellen Heian ,  David Van Heerden ,  Timothy Ryan Rude ,  Omar Knio ,  Ronald Spraker ,  Yuping Lin

发明人： Timothy P. Weihs ,  Etienne Besnoin ,  Ramzi Vincent ,  Somasundaram Valliappan ,  Ellen Heian ,  David Van Heerden ,  Timothy Ryan Rude ,  Omar Knio ,  Ronald Spraker ,  Yuping Lin

IPC分类号： F42B3/18

CPC分类号： C22C30/00 ,  C06B21/00 ,  C06B45/12 ,  C22C5/04 ,  C22C19/00 ,  F42B3/18 ,  F42B39/14 ,  Y10T29/30 ,  Y10T29/302 ,  Y10T29/49002 ,  Y10T29/49227 ,  Y10T428/12493 ,  Y10T428/12632

摘要： Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

摘要翻译： 申请人已经发现，在某些情况下，静电放电（ESD）可以导致足够的电流密度来点燃未受保护的反应性复合材料。 他们进一步发现，通过在RCM的适当位置施加导电和/或绝缘材料，可以保护反应性复合材料（RCM）免于ESD点火，而不会对RCM的期望性能产生不利影响。 因此，ESD保护的RCM结构可以设计用于诸如点燃推进剂，产生光爆炸以及可能需要受控自我破坏的设备的结构材料等敏感应用。

公开(公告)号：US20110070460A1

公开(公告)日：2011-03-24

申请号：US11454091

申请日：2006-06-15

申请人： Timothy P. Weihs ,  Etienne Besnoin ,  Ramzi Vincent ,  Somasundaram Valliappan ,  Ellen Heian ,  David Van Heerden ,  Timothy Ryan Rude ,  Omar Knio ,  Ronald Spraker ,  Yuping Lin

发明人： Timothy P. Weihs ,  Etienne Besnoin ,  Ramzi Vincent ,  Somasundaram Valliappan ,  Ellen Heian ,  David Van Heerden ,  Timothy Ryan Rude ,  Omar Knio ,  Ronald Spraker ,  Yuping Lin

IPC分类号： B32B15/01

CPC分类号： C22C30/00 ,  C06B21/00 ,  C06B45/12 ,  C22C5/04 ,  C22C19/00 ,  F42B3/18 ,  F42B39/14 ,  Y10T29/30 ,  Y10T29/302 ,  Y10T29/49002 ,  Y10T29/49227 ,  Y10T428/12493 ,  Y10T428/12632

摘要： Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

摘要翻译： 申请人已经发现，在某些情况下，静电放电（ESD）可以导致足够的电流密度来点燃未受保护的反应性复合材料。 他们进一步发现，通过在RCM的适当位置施加导电和/或绝缘材料，可以保护反应性复合材料（RCM）免于ESD点火，而不会对RCM的期望性能产生不利影响。 因此，ESD保护的RCM结构可以设计用于诸如点燃推进剂，产生光爆炸以及可能需要受控自我破坏的设备的结构材料等敏感应用。

公开(公告)号：US20060068179A1

公开(公告)日：2006-03-30

申请号：US11228085

申请日：2005-09-16

申请人： Timothy Weihs ,  Ellen Heian ,  Ramzi Vincent ,  Somasundaram Valliappan ,  Etienne Besnoin

发明人： Timothy Weihs ,  Ellen Heian ,  Ramzi Vincent ,  Somasundaram Valliappan ,  Etienne Besnoin

IPC分类号： B32B3/00

CPC分类号： H01H85/06 ,  Y10T428/24917

摘要： In accordance with the invention, a fuse comprises a reactive composite structure to interrupt the flow of current in a circuit. The term fuse, as used herein, is intended to cover current interrupters generically and thus encompasses fuses, circuit breakers and other devices for interrupting the flow of current through a conductor. Reactive composite structures comprise two or more phases of materials spaced in a controlled fashion throughout a composite in uniform layers, local layers, islands, or particles. Upon appropriate excitation, the materials undergo an exothermic chemical reaction that spreads rapidly through the composite structure generating heat and light. Moreover a reactive composite structure can break apart upon reaction. This breakage can rapidly interrupt the flow of current through the reactive composite structure. Such structures can provide high-speed current interruption. In addition, reactive composite structures can have abrupt reaction initiation thresholds such that a pulse of energy of a certain magnitude may initiate a clearing reaction but a slightly smaller pulse of energy may not. Such a reactive composite structure can thus provide a high speed, highly sensitive current interrupter.

摘要翻译： 根据本发明，保险丝包括用于中断电路中的电流的电抗复合结构。 本文所用的术语“熔断器”旨在一般地覆盖电流断流器，因此包括熔断器，断路器和用于中断通过导体的电流流动的其它装置。 反应性复合结构包括以均匀层，局部层，岛或颗粒在整个复合材料中以受控的方式间隔的两种或多种材料相。 在适当的激发下，材料经受放热的化学反应，其迅速扩散通过产生热和光的复合结构。 此外，反应性复合结构可以在反应时分裂。 这种断裂可以快速地中断通过反应性复合结构的电流的流动。 这种结构可以提供高速电流中断。 此外，反应性复合结构可以具有突然的反应起始阈值，使得一定量级的能量脉冲可能引发清除反应，但是稍微较小的能量脉冲可能不起作用。 因此，这种反应性复合结构可以提供高速，高灵敏度的电流中断器。

公开(公告)号：US20110089462A1

公开(公告)日：2011-04-21

申请号：US12674804

申请日：2008-08-29

申请人： David Van Heerden ,  Timothy Ryan Rude ,  Ramzi Vincent

发明人： David Van Heerden ,  Timothy Ryan Rude ,  Ramzi Vincent

IPC分类号： H01L33/48 ,  H01L21/60 ,  H01L31/00

CPC分类号： H01L24/83 ,  H01L24/33 ,  H01L31/02002 ,  H01L33/62 ,  H01L2224/33104 ,  H01L2224/335 ,  H01L2224/80359 ,  H01L2224/83024 ,  H01L2224/83095 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10106 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0278 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y02P70/613 ,  Y10S362/80 ,  H01L2924/00

摘要： A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.

摘要翻译： 一种用于将LED组件（71）或其它电子封装（31）接合到包含散热器（52）的基板PCB的方法，所述基板PCB利用设置在所述散热器（52）的触点（32,34）之间的反应性多层箔（51） 电子封装31和支撑基板PCB上的相关接触焊盘（55）。 通过在反应性多层箔（51）中引发放热反应以及施加压力，在触头（32,34）和相关联的接触垫（55）之间产生足够的热量以将相邻的接合材料（54）熔化成 在电子封装（31），与电子封装（31）相关联的热敏元件（35）或其他支撑衬底（31）之间，在触点32,34和接触焊盘（55）之间获得良好的导电和导热接合， PCB。

公开(公告)号：US08882301B2

公开(公告)日：2014-11-11

申请号：US12674804

申请日：2008-08-29

申请人： David Van Heerden ,  Ramzi Vincent ,  Timothy Ryan Rude

发明人： David Van Heerden ,  Ramzi Vincent ,  Timothy Ryan Rude

IPC分类号： F21V29/00 ,  H01L33/00 ,  H05K1/02 ,  H05K1/05 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L24/33 ,  H01L31/02002 ,  H01L33/62 ,  H01L2224/33104 ,  H01L2224/335 ,  H01L2224/80359 ,  H01L2224/83024 ,  H01L2224/83095 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10106 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0278 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y02P70/613 ,  Y10S362/80 ,  H01L2924/00

摘要： A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.

摘要翻译： 一种用于将LED组件（71）或其它电子封装（31）接合到包含散热器（52）的基板PCB的方法，所述基板PCB利用设置在所述散热器（52）的触点（32,34）之间的反应性多层箔（51） 电子封装31和支撑基板PCB上的相关接触焊盘（55）。 通过在反应性多层箔（51）中引发放热反应以及施加压力，在触头（32,34）和相关联的接触垫（55）之间产生足够的热量以将相邻的接合材料（54）熔化成 在电子封装（31），与电子封装（31）相关联的热敏元件（35）或其他支撑衬底（31）之间，在触点32,34和接触焊盘（55）之间获得良好的导电和导热接合， PCB。