COMPOSITION FOR MANUFACTURING INSULATION MATERIALS OF ELECTRICAL WIRE AND ELECTRICAL WIRE MANUFACTURED USING THE SAME
    1.
    发明申请
    COMPOSITION FOR MANUFACTURING INSULATION MATERIALS OF ELECTRICAL WIRE AND ELECTRICAL WIRE MANUFACTURED USING THE SAME 审中-公开
    用于制造电线绝缘材料的组合物和使用该电缆制造的电线

    公开(公告)号:US20080182923A1

    公开(公告)日:2008-07-31

    申请号:US11937191

    申请日:2007-11-08

    IPC分类号: C08K3/00

    摘要: The present invention relates to a composition for manufacturing insulation materials of an electrical wire and an electrical wire manufactured using the same. The composition for manufacturing insulation materials of an electrical wire according to the present invention includes 100 parts by weight of a base resin, made by blending 20 to 70 weight % of any one resin of an unsaturated organosilane grafted polyethylene and an unsaturated organosilane grafted ethylene alpha olefine copolymer, and 30 to 80 weight % of an unsaturated organosilane grafted ethylene copolymer; 10 to 25 parts by weight of a brominated flame retardant; 10 to 50 parts by weight of an inorganic flame retardant; and 0.2 to 5 parts by weight of compound, as a crosslink retardant, represented as a general formula of XnSi(OR)4-n (X is a phenyl group, R is a methyl group and n is an integer of 1 to 3).

    摘要翻译: 本发明涉及一种电线绝缘材料的制造用组合物及使用其制造的电线。 根据本发明的用于制造电线绝缘材料的组合物包括100重量份的基础树脂,其通过将20至70重量%的任何一种不饱和有机硅烷接枝聚乙烯树脂和不饱和有机硅烷接枝的乙烯-α 烯烃共聚物和30〜80重量%的不饱和有机硅烷接枝乙烯共聚物; 10〜25重量份的溴化阻燃剂; 10〜50重量份的无机阻燃剂; 和0.2〜5重量份作为交联剂的化合物,以通式X(OR)4-n表示(X为苯基) R为甲基,n为1〜3的整数)。

    SEMICONDUCTIVE PEELABLE CROSSLINKED RESIN COMPOSITION AND INSULATING CABLE MANUFACTURED USING THE SAME
    2.
    发明申请
    SEMICONDUCTIVE PEELABLE CROSSLINKED RESIN COMPOSITION AND INSULATING CABLE MANUFACTURED USING THE SAME 审中-公开
    半导体交联树脂组合物和使用其制造的绝缘电缆

    公开(公告)号:US20100307788A1

    公开(公告)日:2010-12-09

    申请号:US12867074

    申请日:2008-06-26

    IPC分类号: H01B9/02 H01B1/24

    CPC分类号: C08K5/20 C08K3/04 C08K5/54

    摘要: The present invention relates to a peelable and water-crosslinked semiconductive resin composition. The peelable and water-crosslinked semiconductive resin composition includes 100 parts by weight of a basic resin; 20 to 80 parts by weight of carbon black based on weight of the basic resin; and 0.05 to 5.0 parts by weight of an amide-based lubricant based on weight of the basic resin, wherein the basic resin is a mixed resin including 60 to 80 weight % of an ethylene-based copolymer resin that is bonded with an unsaturated organic silane and has a melting point of 80° C. or above; 5 to 20 weight % of an ethylene-acrylic acid copolymer or its alkali metal salt; and 5 to 40 parts by weight of an ethylene propylene copolymer containing 5 to 20 weight % of ethylene, or a propylene rein.

    摘要翻译: 本发明涉及一种可剥离和水交联的半导体树脂组合物。 可剥离和水交联的半导体树脂组合物包括100重量份的碱性树脂; 20〜80重量份基于树脂重量的炭黑; 和0.05-5.0重量份基于碱性树脂重量的酰胺类润滑剂,其中所述碱性树脂是包含60-80重量%的与不饱和有机硅烷键合的乙烯类共聚物树脂的混合树脂 并具有80℃以上的熔点; 5〜20重量%的乙烯 - 丙烯酸共聚物或其碱金属盐; 和5至40重量份的含有5至20重量%乙烯或丙烯的乙烯丙烯共聚物。

    Methods of manufacturing a semiconductor device
    6.
    发明申请
    Methods of manufacturing a semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US20070010068A1

    公开(公告)日:2007-01-11

    申请号:US11481928

    申请日:2006-07-07

    IPC分类号: H01L21/30 H01L21/46

    摘要: Example embodiments of the present invention relate to methods of manufacturing a semiconductor device. Other example embodiments of the present invention relate to methods of manufacturing a semiconductor device having a gate electrode. In the method of manufacturing the semiconductor device, a gate electrode may be formed on a semiconductor substrate. Damage in the semiconductor substrate and a sidewall of the gate electrode may be cured, or repaired, by a radical re-oxidation process to form an oxide layer on the semiconductor substrate and the gate electrode. The radical re-oxidation process may be performed by providing a nitrogen gas onto the semiconductor substrate while increasing a temperature of the semiconductor substrate to a first temperature to passivate a surface of the gate electrode under a nitrogen gas atmosphere, providing an oxygen gas onto the semiconductor substrate while increasing the temperature from a first temperature to a second temperature to perform a first oxidation process and/or performing a second oxidation process at the second temperature.

    摘要翻译: 本发明的示例性实施例涉及制造半导体器件的方法。 本发明的其它示例实施例涉及制造具有栅电极的半导体器件的方法。 在制造半导体器件的方法中,可以在半导体衬底上形成栅电极。 可以通过自由基再氧化工艺固化或修复半导体衬底和栅电极的侧壁的损伤,以在半导体衬底和栅电极上形成氧化物层。 可以通过在半导体衬底上提供氮气同时将半导体衬底的温度提高到第一温度以在氮气气氛下钝化栅电极的表面来进行自由基再氧化工艺,从而将氧气提供到 半导体衬底,同时将温度从第一温度升至第二温度,以进行第一氧化工艺和/或在第二温度下进行第二氧化工艺。