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1.发明授权Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same 有权具有含热固性物质的电介质材料的半导体器件及其制造方法公开(公告)号：US06534160B2
公开(公告)日：2003-03-18
申请号：US09781637
申请日：2001-02-12
IPC分类号： B32B300
CPC分类号： H05K1/036 , H01L2224/16 , H01L2924/15311 , H05K1/0269 , H05K1/034 , H05K1/0373 , H05K3/386 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2203/122 , H05K2203/161 , Y10T428/24917 , Y10T428/249958 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/31544
摘要： A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.
摘要翻译： 提供了具有含热固性物质的介电材料的半导体器件及其制造方法。 该装置可以采用印刷电路板，集成电路芯片载体等的形式。 介电材料是非原纤化的氟聚合物基质，其中分布有无机颗粒并用热固性材料浸渍。
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2.发明授权公开(公告)号：US06465084B1
公开(公告)日：2002-10-15
申请号：US09834281
申请日：2001-04-12
IPC分类号： B32B300
CPC分类号： H05K3/462 , H05K3/386 , H05K3/4069 , H05K3/4623 , H05K3/4641 , H05K2201/0959 , H05K2201/096 , H05K2201/10378 , H05K2203/0353 , H05K2203/0384 , H05K2203/0554 , H05K2203/063 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T428/24917
摘要： A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.
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公开(公告)号：US07014731B2
公开(公告)日：2006-03-21
申请号：US09781730
申请日：2001-02-12
IPC分类号： C09J5/02
CPC分类号： H05K1/036 , H01L2224/16 , H01L2924/15311 , H05K1/0269 , H05K1/034 , H05K1/0373 , H05K3/386 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2203/122 , H05K2203/161 , Y10T428/24917 , Y10T428/249958 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/31544
摘要： A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.
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公开(公告)号：US06686539B2
公开(公告)日：2004-02-03
申请号：US09753932
申请日：2001-01-03
申请人： Donald S. Farquhar , Claudius Feger , Voya Markovich , Konstantinos I. Papathomas , Mark D. Poliks , Jane M. Shaw , George Szeparowycz , Steve H. Weingart
发明人： Donald S. Farquhar , Claudius Feger , Voya Markovich , Konstantinos I. Papathomas , Mark D. Poliks , Jane M. Shaw , George Szeparowycz , Steve H. Weingart
IPC分类号： H05K506
CPC分类号： H01L23/57 , G06F21/87 , H01L2924/0002 , H05K1/0275 , H05K1/0393 , H05K1/095 , H05K1/167 , H05K2201/0352 , H05K2201/10151 , H05K2203/1572 , H01L2924/00
摘要： A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.
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5.发明授权公开(公告)号：US06645607B2
公开(公告)日：2003-11-11
申请号：US10213646
申请日：2002-08-06
IPC分类号： B32B300
CPC分类号： H05K3/462 , H05K3/386 , H05K3/4069 , H05K3/4623 , H05K3/4641 , H05K2201/0959 , H05K2201/096 , H05K2201/10378 , H05K2203/0353 , H05K2203/0384 , H05K2203/0554 , H05K2203/063 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T428/24917
摘要： A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.
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公开(公告)号：US06254972B1
公开(公告)日：2001-07-03
申请号：US09343079
申请日：1999-06-29
IPC分类号： B32B300
CPC分类号： H05K1/036 , H01L2224/16 , H01L2924/15311 , H05K1/0269 , H05K1/034 , H05K1/0373 , H05K3/386 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2203/122 , H05K2203/161 , Y10T428/24917 , Y10T428/249958 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/31544
摘要： A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.
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7.发明授权Method and structure for producing Z-axis interconnection assembly of printed wiring board elements 失效制造印刷电路板元件Z轴互连组件的方法和结构公开(公告)号：US07402254B2
公开(公告)日：2008-07-22
申请号：US10657483
申请日：2003-09-08
IPC分类号： B05D3/00
CPC分类号： H05K3/462 , H05K3/386 , H05K3/4069 , H05K3/4623 , H05K3/4641 , H05K2201/0959 , H05K2201/096 , H05K2201/10378 , H05K2203/0353 , H05K2203/0384 , H05K2203/0554 , H05K2203/063 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T428/24917
摘要： A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.
摘要翻译： 一种形成用于和形成复合布线板的芯的方法。 芯在电介质基板的至少一个表面上具有导电涂层。 至少一个开口形成穿过衬底，从一个面延伸到另一个面并穿过每个导电涂层。 在穿过导电涂层的每个开口中分配导电材料。 去除一个表面上的导电涂层的表面的至少一部分，以允许导体材料的一部分在衬底表面上延伸，并且任何剩余的导电材料形成可以面对面地电连接的芯 具有第二芯构件或其他电路结构。
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8.发明授权Tamper-responding encapsulated enclosure having flexible protective mesh structure 失效具有灵活保护网格结构的防篡改封装外壳公开(公告)号：US06929900B2
公开(公告)日：2005-08-16
申请号：US10704021
申请日：2003-11-07
申请人： Donald S. Farquhar , Claudius Feger , Voya Markovich , Konstantinos I. Papathomas , Mark D. Poliks , Jane M. Shaw , George Szeparowycz , Steve H. Weingart
发明人： Donald S. Farquhar , Claudius Feger , Voya Markovich , Konstantinos I. Papathomas , Mark D. Poliks , Jane M. Shaw , George Szeparowycz , Steve H. Weingart
IPC分类号： G06F12/14 , G06F1/00 , G06F21/00 , G06F21/06 , G06F21/22 , H01L23/58 , H05K1/00 , H05K1/02 , H05K1/09 , H05K1/16 , G03F7/00
CPC分类号： H01L23/57 , G06F21/87 , H01L2924/0002 , H05K1/0275 , H05K1/0393 , H05K1/095 , H05K1/167 , H05K2201/0352 , H05K2201/10151 , H05K2203/1572 , H01L2924/00
摘要： A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.
摘要翻译： 用于形成包括集成电路结构的篡改应答电子电路外壳的结构和方法，围绕集成电路结构的网格结构以及围绕网格结构的密封外壳。 网格结构包括具有第一侧和第二侧的柔性电介质层，在第一侧上形成第一电阻器网络的柔性导电第一电路线的丝网印刷图案，以及柔性电光刻形成的图案 导电的第二电路线在第二侧上形成第二电阻网络。
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9.发明授权Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use 有权无卤素三嗪，双马来酰亚胺/环氧聚合物，由其制成的用于电路板和树脂涂覆制品的预浸料，以及使用公开(公告)号：US06534179B2
公开(公告)日：2003-03-18
申请号：US09818458
申请日：2001-03-27
IPC分类号： B32B2704
CPC分类号： B32B15/08 , B32B27/281 , B32B27/38 , B32B2457/08 , C08G59/304 , C08G59/3254 , C08L63/00 , C08L79/04 , C08L79/085 , H05K1/0373 , H05K2201/012 , Y10T428/2938 , Y10T428/31511 , Y10T428/31529 , C08L2666/20
摘要： A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.
摘要翻译： 描述了一种无卤介电树脂混合物用于微孔和其它类似应用。 树脂混合物含有氰酸酯单体或预聚物，双马来酰亚胺，环氧树脂和选自次膦酸酐，膦酸和二卤化物和膦酸半酯的阻燃化合物。 阻燃剂的存在量，其中基于树脂混合物的重量，元素磷含量为约2重量％至约20重量％。 树脂混合物还可以包括一种或多种着色剂，荧光剂和UV吸收剂。 还描述了基于与无机或有机增强剂的树脂混合物的预浸料，以及由预浸料制成的电路板和芯片载体。 同样包括用于微孔激光应用的树脂涂层制品。
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10.发明申请公开(公告)号：US20120257343A1
公开(公告)日：2012-10-11
申请号：US13082502
申请日：2011-04-08
CPC分类号： H05K3/4614 , B82Y10/00 , B82Y30/00 , H05K2203/0307 , H05K2203/061
摘要： A method of forming a circuitized substrate for use in electronic packages. A substrate layer is provided that has a copper pad on a surface. A conductive seed layer and a photoresist layer are placed on the surface. The photoresist is developed and conductive material is placed within the developed features and a second conductive material placed on the first conductive material. The photoresist and conductive seed layer are removed to leave a micro-pillar array. The joining and lamination of two circuitized substrate layers utilizes the micro-pillar array for the electrical connection of the circuitized substrate layers.
摘要翻译： 一种形成用于电子封装的电路化基板的方法。 提供了在表面上具有铜垫的基底层。 导电种子层和光致抗蚀剂层被放置在表面上。 光致抗蚀剂被显影并且导电材料被放置在显影特征内并且第二导电材料放置在第一导电材料上。 去除光致抗蚀剂和导电种子层以留下微柱阵列。 两个电路化衬底层的接合和叠层利用微柱阵列用于电路化衬底层的电连接。
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