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1.发明授权Slightly water-soluble metal salts, a process for the preparation thereof, and the use thereof as gloss additives in the electrolytic deposition of metals 有权微溶于水的金属盐，其制备方法及其在金属的电解沉积中作为光泽添加剂的用途
公开(公告)号：US5981793A
公开(公告)日：1999-11-09
申请号：US142857
申请日：1998-10-28
IPC分类号： C07C327/18 , C25D3/46 , C07C51/305
CPC分类号： C25D3/46 , C07C327/18
摘要： The slightly water-soluble metal salts having the formula I ##STR1## wherein R.sub.1 and R.sub.2 are the same or different and represent hydrogen or a lower alkyl group of from 1 to 3 carbon atoms, M is the cation of a metal which forms slightly water-soluble sulfides, and n means 1 or 2, and mixtures thereof are prepared by reacting carbon disulfide with ketones having the formula II: ##STR2## optionally with the addition of non-aqueous inert solvents, in the presence of strong alkali, preferably potassium hydroxide, followed by precipitation of the slightly water-soluble metal salts of formula I by the addition of aqueous solutions of metal salts of the metals M. They are used as gloss additives to electrolytic baths.
摘要翻译： PCT No.PCT / EP97 / 01389第 371日期：1998年9月16日 102（e）日期1998年9月16日PCT 1997年3月20日PCT公布。 第WO97 / 35840号公报 日期1997年10月2日具有式I的轻微水溶性金属盐，其中R 1和R 2相同或不同，表示氢或1至3个碳原子的低级烷基，M是形成金属的阳离子 微水溶性硫化物，n表示1或2，并且其混合物通过二硫化碳与具有式II的酮反应制备：任选地加入非水惰性溶剂，在强碱存在下，优选氢氧化钾 ，然后通过加入金属M的金属盐的水溶液沉淀出微溶于式I的水溶性金属盐。它们用作电解浴的光泽添加剂。
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公开(公告)号：US20060049058A1
公开(公告)日：2006-03-09
申请号：US11214421
申请日：2005-08-29
CPC分类号： C25D3/38
摘要： The present invention relates to a method as well as and electrolyte for the electrolytic deposition of mat or half-glossy copper layers from an acid electrolyte in a pull-through device. The method according to the invention is operated with current densities comprises between 10 and 100 A/dm2 and is suitable for depositing sufficiently thick copper layers in high-speed pull-through devices. The electrolyte according to the invention comprises apart from copper, alkyl sulfonic acid.
摘要翻译： 本发明涉及一种用于在拉通装置中从酸性电解质电解沉积垫或半光泽铜层的方法以及电解质。 根据本发明的方法操作，电流密度包括在10A / dm 2之间，适用于在高速拉通装置中沉积足够厚的铜层。 根据本发明的电解质除铜，烷基磺酸外。
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公开(公告)号：US20060260948A2
公开(公告)日：2006-11-23
申请号：US11105947
申请日：2005-04-14
IPC分类号： C25D11/20
摘要： Abstract of the DisclosureA method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.
摘要翻译： 发明内容一种青铜电沉积方法，其中待涂覆的基底用至少含有锡和铜离子的酸性电解液，烷基磺酸和润湿剂，以及这种电解质的制备。
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公开(公告)号：US20050263403A1
公开(公告)日：2005-12-01
申请号：US11105947
申请日：2005-04-14
摘要： A method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.
摘要翻译： 用于电镀青铜的方法，将待涂覆的基材镀在至少含有锡和铜离子的酸性电解质中，烷基磺酸和润湿剂，以及这种电解质的制备。
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公开(公告)号：US20060137991A1
公开(公告)日：2006-06-29
申请号：US10531142
申请日：2003-10-10
IPC分类号： C25D3/58
摘要： A method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.
摘要翻译： 用于电镀青铜的方法，将待涂覆的基底镀在至少含有锡和铜离子的酸性电解质中，烷基磺酸和润湿剂，以及制备这种电解质。
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公开(公告)号：US06821323B1
公开(公告)日：2004-11-23
申请号：US10129998
申请日：2002-07-31
申请人： Jane Bell , Joachim Heyer , Jürgen Hupe , Ingo Kalker , Marlies Kleinfeld
发明人： Jane Bell , Joachim Heyer , Jürgen Hupe , Ingo Kalker , Marlies Kleinfeld
IPC分类号： C23C1831
摘要： The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is a created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the layer.
摘要翻译： 本发明描述了一种通过从甲磺酸沉淀锡和含有络合剂的含锡电解质对铜和铜合金进行非电镀锡的方法。 在描述可以被焊接的耐用锡层产生的过程中，同时防止了基材的释放，本发明公开了电解质具有加入至少一种外来金属以形成扩散阻挡层 在层中。
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公开(公告)号：US20050034996A1
公开(公告)日：2005-02-17
申请号：US10919034
申请日：2004-08-16
CPC分类号： C25D11/38 , C23C18/1605 , C23C18/31
摘要： A method for the selective or complete rendering inert of substrates, workpieces, and components of the apparatus in the chemical deposition of metals by depositing nonreactive coatings thereon. A coating which is nonreactive with respect to the subsequent plating is electrolytically deposited on the sites of the substrate which are not to be plated from a solution containing an activator and an electrolyte. The inert, nonreactive coating is removable by means of dilute acids or alkaline media, without manual effort, after the subsequent chemical plating of the substrates, workpieces, or unit parts.
摘要翻译： 一种通过在其上沉积非反应性涂层来选择性地或完全地使金属化学沉积中的基材，工件和组件成为惰性的方法。 相对于随后的电镀不具有反应性的涂层被电解沉积在基板的不被含有活化剂和电解质的溶液中镀覆的部位上。 惰性非反应性涂层可在稀释酸或碱性介质之后进行，无需人工操作即可在基板，工件或单元部件进行化学镀后。
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8.发明申请Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components 审中-公开保持电子部件锡表面的可焊性和抑制晶须生长公开(公告)号：US20050249969A1
公开(公告)日：2005-11-10
申请号：US10968500
申请日：2004-10-19
申请人： Chen Xu , Yun Zhang , Chonglun Fan , Oscar Khaselev , Joseph Abys , Eric Walch , Marlies Kleinfeld , Hans Eckert
发明人： Chen Xu , Yun Zhang , Chonglun Fan , Oscar Khaselev , Joseph Abys , Eric Walch , Marlies Kleinfeld , Hans Eckert
IPC分类号： B32B15/01 , C25D5/10 , C25D5/12 , H01G4/228 , H01L23/495
CPC分类号： H01G4/228 , B32B15/01 , C25D5/12 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01078 , H01L2924/01327 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , Y10T428/12715 , Y10T428/12722 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 μm and about 4.0 μm in thickness. There is a nickel-phosphorus layer under the tin coating.
摘要翻译： 一种减少电子部件的金属特征的方法，用于减少锡涂层中的晶须形成和保持锡涂层的可焊性。 锡涂层具有内部拉伸应力，厚度在约0.5μm至约4.0μm之间。 在锡涂层下面有一个镍 - 磷层。
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公开(公告)号：US20140158545A1
公开(公告)日：2014-06-12
申请号：US14234080
申请日：2012-07-20
摘要： The invention as described in the following relates to an apparatus for the electrochemical deposition of a metal on a substrate, which apparatus is capable of refreshing an electrolyte used for the deposition in a continuous way. Furthermore, the invention as described relates to a method of refreshing an electrolyte for the electrochemical deposition of a metal on a substrate.
摘要翻译： 下面描述的本发明涉及用于在基底上电化学沉积金属的装置，该装置能够以连续的方式刷新用于沉积的电解质。 此外，所描述的本发明涉及一种刷新用于在基底上电化学沉积金属的电解质的方法。
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公开(公告)号：US07713859B2
公开(公告)日：2010-05-11
申请号：US11463355
申请日：2006-08-09
申请人： Thomas B. Richardson , Marlies Kleinfeld , Christian Rietmann , Igor Zavarine , Ortrud Steinius , Yun Zhang , Joseph A. Abys
发明人： Thomas B. Richardson , Marlies Kleinfeld , Christian Rietmann , Igor Zavarine , Ortrud Steinius , Yun Zhang , Joseph A. Abys
IPC分类号： H01L33/62
CPC分类号： H01L21/2885 , C25D3/60 , C25D21/18 , H01L24/11 , H01L24/12 , H01L2224/11462 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014
摘要： A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Sn2+ ions, a source of Ag+ ions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.
摘要翻译： 一种用于在微电子器件的制造中在下凸块金属结构上形成焊料凸块的工艺，包括将下凸块金属结构暴露于包含Sn 2+离子源，Ag +离子源，硫脲化合物和/或 季铵表面活性剂; 并向电解槽提供外部电子源，以将Sn-Ag合金沉积到下凸块金属结构上。
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