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公开(公告)号:US20070235810A1
公开(公告)日:2007-10-11
申请号:US11279011
申请日:2006-04-07
申请人: Eladio Delgado , Richard Beaupre , Stephen Arthur , Ernest Balch , Kevin Durocher , Paul McConnelee , Raymond Fillion
发明人: Eladio Delgado , Richard Beaupre , Stephen Arthur , Ernest Balch , Kevin Durocher , Paul McConnelee , Raymond Fillion
IPC分类号: H01L23/62
CPC分类号: H01L25/50 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2224/04105 , H01L2224/2413 , H01L2224/24137 , H01L2224/2518 , H01L2224/2919 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/92144 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/1532 , H01L2924/18162 , H01L2924/00 , H01L2924/01014
摘要: A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.
摘要翻译: 功率半导体模块包括:互连层,其包括在电介质层上图案化的电导体,所述电导体包括具有足以承载电力电流的厚度的功率耦合部分和具有比功率耦合的厚度更薄的厚度的控制耦合部分 一部分; 以及物理耦合到所述互连层并且电耦合到所述电导体的功率耦合部分的半导体功率器件。
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公开(公告)号:US20070040186A1
公开(公告)日:2007-02-22
申请号:US11205903
申请日:2005-08-17
IPC分类号: H01L31/111 , H01L21/48
CPC分类号: H01L23/4822 , H01L23/4821 , H01L23/5385 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/072 , H01L2224/2402 , H01L2224/24137 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2224/92135 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/351 , H01L2924/00
摘要: A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A patterned electrically conductive layer adjacent to the dielectric film has one or more electrically conductive posts which extend through the one or more though holes aligned with the contact pads to electrically couple the conductive layer to the contact pads. In certain embodiments, one or more air gaps may be formed between the dielectric film and the active surface of the at least one power semiconductor chip. Methods for fabricating the semiconductor chip packaging structure are also disclosed.
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3.
公开(公告)号:US20050045855A1
公开(公告)日:2005-03-03
申请号:US10654391
申请日:2003-09-03
申请人: Sandeep Tonapi , Hong Zhong , Davide Simone , Raymond Fillion
发明人: Sandeep Tonapi , Hong Zhong , Davide Simone , Raymond Fillion
IPC分类号: C09K5/14 , H01L23/373 , H01B1/00
CPC分类号: H01L24/29 , C09K5/14 , H01L23/373 , H01L23/3732 , H01L23/3737 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/29393 , H01L2224/29499 , H01L2224/32245 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12044 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要: Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.
摘要翻译: 热界面组合物含有非导电的微米尺寸的填料和与聚合物基质混合的导电纳米颗粒。 这样的组合物增加了聚合物复合材料的体积热导率,并且降低了热界面材料和相应配合表面之间存在的热界面电阻。 这样的组合物是非导电的。 含有纳米颗粒的制剂与没有纳米颗粒的制剂相比,显示出微米级颗粒的相分离较少。
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