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    INTEGRATED CIRCUIT PACKAGE
    3.
    发明申请
    INTEGRATED CIRCUIT PACKAGE 有权
    集成电路封装

    公开(公告)号：US20110180921A1

    公开(公告)日：2011-07-28

    申请号：US13009949

    申请日：2011-01-20

    Applicant: Emmanuel Loiselet

    Inventor： Emmanuel Loiselet

    IPC: H01L23/488 ,  H01L21/60

    CPC classification number: H01L23/053 ,  H01L23/055 ,  H01L23/10 ,  H01L23/3128 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

    Abstract: A method of manufacturing a ball grid array, BGA, integrated circuit package, comprising forming a double sided printed circuit board, PCB, with blind vias interconnecting electrically the circuits on the opposed surfaces of the PCB, with at least one through-hole to allow fluid or gas to pass through the PCB, and an integrated circuit connected to the printed circuit on one side of the PCB; soldering a lid onto the said one side of the PCB to enclose the integrated circuit, whilst allowing thermally expanding gas or fluid to escape through the or each through-hole, whereby to form a package which is hermetically sealed except for the or each through-hole, and which has a cavity between the integrated circuit and the lid; applying a BGA to the side of the PCB opposed to the said one side, whereby to solder the balls of the BGA to respective portions of the printed circuit and to align one of the balls axially with each through-hole; and soldering the ball or balls into the through-hole, or into each respective through-hole, to hermetically seal the package.

    Abstract translation: 一种制造球栅阵列BGA集成电路封装的方法，包括形成双面印刷电路板，PCB，具有将PCB的相对表面上的电路互连的盲孔与至少一个通孔，以允许 流体或气体通过PCB，以及与PCB的一侧连接到印刷电路的集成电路; 将盖子焊接到PCB的所述一侧以封闭集成电路，同时允许热膨胀的气体或流体通过该通孔或每个通孔逸出，由此形成气密密封的包装，除了每个通孔 并且在集成电路和盖之间具有空腔; 将BGA施加到与所述一侧相对的PCB侧，由此将BGA的球焊接到印刷电路的各个部分，并使其中一个球轴向与每个通孔对准; 并将球或球焊接到通孔中，或将其焊接到每个相应的通孔中以气密地密封包装。

    Method of fabricating an integrated circuit package
    4.
    发明授权
    Method of fabricating an integrated circuit package 有权
    制造集成电路封装的方法

    公开(公告)号：US08383462B2

    公开(公告)日：2013-02-26

    申请号：US13009949

    申请日：2011-01-20

    Applicant: Emmanuel Loiselet

    Inventor： Emmanuel Loiselet

    IPC: H01L21/00 ,  H01L23/12

    CPC classification number: H01L23/053 ,  H01L23/055 ,  H01L23/10 ,  H01L23/3128 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

    Abstract: A method of manufacturing a ball grid array, BGA, integrated circuit package, comprising forming a double sided printed circuit board, PCB, with blind vias interconnecting electrically the circuits on the opposed surfaces of the PCB, with at least one through-hole to allow fluid or gas to pass through the PCB, and an integrated circuit connected to the printed circuit on one side of the PCB; soldering a lid onto the said one side of the PCB to enclose the integrated circuit, whilst allowing thermally expanding gas or fluid to escape through the or each through-hole, whereby to form a package which is hermetically sealed except for the or each through-hole, and which has a cavity between the integrated circuit and the lid; applying a BGA to the side of the PCB opposed to the said one side, whereby to solder the balls of the BGA to respective portions of the printed circuit and to align one of the balls axially with each through-hole; and soldering the ball or balls into the through-hole, or into each respective through-hole, to hermetically seal the package.

    Abstract translation: 一种制造球栅阵列BGA集成电路封装的方法，包括形成双面印刷电路板，PCB，具有将PCB的相对表面上的电路互连的盲孔与至少一个通孔，以允许 流体或气体通过PCB，以及与PCB的一侧连接到印刷电路的集成电路; 将盖子焊接到PCB的所述一侧以封闭集成电路，同时允许热膨胀的气体或流体通过该通孔或每个通孔逸出，从而形成气密密封的包装，除了该或每个通孔， 并且在集成电路和盖之间具有空腔; 将BGA施加到与所述一侧相对的PCB侧，由此将BGA的球焊接到印刷电路的各个部分，并使其中一个球轴向与每个通孔对准; 并将球或球焊接到通孔中，或将其焊接到每个相应的通孔中以气密地密封包装。

    Method of manufacture of an integrated circuit package
    6.
    发明授权
    Method of manufacture of an integrated circuit package 有权
    集成电路封装的制造方法

    公开(公告)号：US08288175B2

    公开(公告)日：2012-10-16

    申请号：US13015057

    申请日：2011-01-27

    Applicant: Emmanuel Loiselet

    Inventor： Emmanuel Loiselet

    IPC: H01L21/66

    CPC classification number: G01R31/2822 ,  G01R1/073 ,  G01R31/2889 ,  H01L22/14 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A method of manufacturing an integrated circuit, IC, package comprising radio frequency, RF, components, the method comprising: electrically connecting a printed circuit pattern on an external major surface of an IC assembly to an RF testing motherboard by bringing them together with an interposed adaptor layer, the adaptor layer comprising a double-sided PCB, printed circuit board, with conductive vias between its printed circuit layers; RF testing the IC assembly using the RF testing motherboard, while RF tuning components of the IC assembly; and separating the IC assembly and connecting its major surface to a solder ball grid array, BGA, which has substantially the same RF impedance as the adaptor at RF signal paths from the IC assembly to the BGA.

    Abstract translation: 一种制造包括射频，RF，部件的集成电路IC封装的方法，所述方法包括：将IC组件的外部主表面上的印刷电路图案与RF测试母板电连接， 适配器层，适配器层包括双面PCB，印刷电路板，其印刷电路层之间具有导电通孔; 使用RF测试主板对IC组件进行RF测试，同时对IC组件进行RF调谐组件; 并将IC组件分离并将其主表面连接到焊球网格阵列BGA，BGA在从IC组件到BGA的RF信号路径处具有与适配器基本上相同的RF阻抗。

    INTEGRATED MICROWAVE CIRCUIT
    8.
    发明申请
    INTEGRATED MICROWAVE CIRCUIT 审中-公开
    集成式微波电路

    公开(公告)号：US20100020513A1

    公开(公告)日：2010-01-28

    申请号：US12499364

    申请日：2009-07-08

    Applicant: Graham Lawson ,  Emmanuel Loiselet

    Inventor： Graham Lawson ,  Emmanuel Loiselet

    IPC: H05K5/00

    CPC classification number: H05K1/0222 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/09236 ,  H05K2201/09481 ,  H05K2201/09536 ,  H05K2201/09609 ,  H05K2201/09618 ,  H01L2924/00014

    Abstract: An hermetically sealed integrated microwave circuit comprising a coplanar waveguide on a printed circuit board (PCB) electrically connected on one major surface to an integrated circuit, and thermally and electrically connected to a ball grid array (BGA) on its opposite major surface, in which the PCB has at least first and second printed layers, a microwave signal path extends from a ball of the BGA through a through-hole in both printed layers to the coplanar wave guide, and plural ground paths extend from balls of the BGA through first through-holes in the first printed layer of the PCB and through second through-holes of the second printed layer of the PCB, the first and second through-holes being non-coincident, to allow for an hermetic seal across the PCB whilst introducing a predetermined impedance in the PCB between the signal and ground paths.

    Abstract translation: 一种密封的集成微波电路，包括在一个主表面上电连接到集成电路的印刷电路板（PCB）上的共面波导，并且在其相对的主表面上热电连接到球栅阵列（BGA），其中 PCB至少具有第一和第二印刷层，微波信号路径从BGA的球通过两个印刷层中的通孔延伸到共面波导，并且多个接地路径从BGA的球从第一至第 在PCB的第一印刷层中的孔和通过PCB的第二印刷层的第二通孔，第一和第二通孔不重合，以允许穿过PCB的气密密封，同时引入预定的 信号与接地路径之间的PCB阻抗。

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