公开(公告)号：US20080217784A1

公开(公告)日：2008-09-11

申请号：US11875711

申请日：2007-10-19

申请人： Florian Binder ,  Stephen Dertinger ,  Barbara Hasler ,  Alfred Martin ,  Grit Sommer ,  Holger Torwesten

发明人： Florian Binder ,  Stephen Dertinger ,  Barbara Hasler ,  Alfred Martin ,  Grit Sommer ,  Holger Torwesten

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L21/486 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/04941 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A substrate has at least one feedthrough with at least one channel from a first main surface of the substrate to a second main surface of the substrate. The at least one channel is closed off with a first material. The at least one closed-off channel is filled with an electrically conductive second material.

摘要翻译： 衬底具有至少一个馈通，其具有从衬底的第一主表面到衬底的第二主表面的至少一个通道。 至少一个通道用第一材料封闭。 至少一个闭合通道填充有导电的第二材料。

公开(公告)号：US08263491B2

公开(公告)日：2012-09-11

申请号：US11875711

申请日：2007-10-19

申请人： Florian Binder ,  Stephan Dertinger ,  Barbara Hasler ,  Alfred Martin ,  Grit Sommer ,  Holger Torwesten

发明人： Florian Binder ,  Stephan Dertinger ,  Barbara Hasler ,  Alfred Martin ,  Grit Sommer ,  Holger Torwesten

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/76898 ,  H01L21/486 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/04941 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A substrate has at least one feedthrough with at least one channel from a first main surface of the substrate to a second main surface of the substrate. The at least one channel is closed off with a first material. The at least one closed-off channel is filled with an electrically conductive second material.

摘要翻译： 衬底具有至少一个馈通，其具有从衬底的第一主表面到衬底的第二主表面的至少一个通道。 至少一个通道用第一材料封闭。 至少一个闭合通道填充有导电的第二材料。

公开(公告)号：US08048801B2

公开(公告)日：2011-11-01

申请号：US11751396

申请日：2007-05-21

申请人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

发明人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

IPC分类号： H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A substrate with first and second main surfaces includes at least one channel extending from the first main surface to the second main surface. The at least one channel includes a first cross-sectional area at a first location and a second cross-sectional area at a second location. An electrically conductive first material is disposed in the at least one channel.

摘要翻译： 具有第一和第二主表面的基底包括从第一主表面延伸到第二主表面的至少一个通道。 所述至少一个通道包括在第一位置处的第一横截面区域和在第二位置处的第二横截面区域。 导电的第一材料设置在至少一个通道中。

公开(公告)号：US08581405B2

公开(公告)日：2013-11-12

申请号：US13151408

申请日：2011-06-02

申请人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

发明人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L27/0629 ,  B81B7/0006 ,  H01L21/76843 ,  H01L21/7687 ,  H01L21/76898 ,  H01L23/373 ,  H01L23/481 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/16 ,  H01L27/10855 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

摘要翻译： 公开了具有阻挡层的半导体衬底的集成电路。 该装置包括半导体衬底和金属元件。 碳基阻挡层设置在半导体衬底和金属元件之间。

公开(公告)号：US20110233630A1

公开(公告)日：2011-09-29

申请号：US13151408

申请日：2011-06-02

申请人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

发明人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L27/06

CPC分类号： H01L27/0629 ,  B81B7/0006 ,  H01L21/76843 ,  H01L21/7687 ,  H01L21/76898 ,  H01L23/373 ,  H01L23/481 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/16 ,  H01L27/10855 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

摘要翻译： 公开了具有阻挡层的半导体衬底的集成电路。 该装置包括半导体衬底和金属元件。 碳基阻挡层设置在半导体衬底和金属元件之间。

公开(公告)号：US07977798B2

公开(公告)日：2011-07-12

申请号：US11828865

申请日：2007-07-26

申请人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

发明人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L27/0629 ,  B81B7/0006 ,  H01L21/76843 ,  H01L21/7687 ,  H01L21/76898 ,  H01L23/373 ,  H01L23/481 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/16 ,  H01L27/10855 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

摘要翻译： 公开了具有阻挡层的半导体衬底的集成电路。 该装置包括半导体衬底和金属元件。 碳基阻挡层设置在半导体衬底和金属元件之间。

公开(公告)号：US20080268638A1

公开(公告)日：2008-10-30

申请号：US11751396

申请日：2007-05-21

申请人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

发明人： Stephan Dertinger ,  Alfred Martin ,  Barbara Hasler ,  Grit Sommer ,  Florian Binder

IPC分类号： H01L21/44 ,  H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A substrate with first and second main surfaces includes at least one channel extending from the first main surface to the second main surface. The at least one channel includes a first cross-sectional area at a first location and a second cross-sectional area at a second location. An electrically conductive first material is disposed in the at least one channel.

摘要翻译： 具有第一和第二主表面的基底包括从第一主表面延伸到第二主表面的至少一个通道。 所述至少一个通道包括在第一位置处的第一横截面区域和在第二位置处的第二横截面区域。 导电的第一材料设置在至少一个通道中。

公开(公告)号：US20090026616A1

公开(公告)日：2009-01-29

申请号：US11828865

申请日：2007-07-26

申请人： Stephan Dertinger ,  Alfred Martin ,  Barbara Halser ,  Grit Sommer ,  Florian Binder

发明人： Stephan Dertinger ,  Alfred Martin ,  Barbara Halser ,  Grit Sommer ,  Florian Binder

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L27/0629 ,  B81B7/0006 ,  H01L21/76843 ,  H01L21/7687 ,  H01L21/76898 ,  H01L23/373 ,  H01L23/481 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/16 ,  H01L27/10855 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

摘要翻译： 公开了具有阻挡层的半导体衬底的集成电路。 该装置包括半导体衬底和金属元件。 碳基阻挡层设置在半导体衬底和金属元件之间。

公开(公告)号：US07911026B2

公开(公告)日：2011-03-22

申请号：US11618172

申请日：2006-12-29

申请人： Florian Binder ,  Thomas Haneder ,  Judith Lehmann ,  Manfred Schneegans ,  Grit Sommer

发明人： Florian Binder ,  Thomas Haneder ,  Judith Lehmann ,  Manfred Schneegans ,  Grit Sommer

IPC分类号： H01L21/02

CPC分类号： H01L23/49827 ,  H01L23/50 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2224/05026 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/162 ,  H05K3/4602 ,  H01L2224/05599

摘要： Carrier including: a substrate having a first interface with first contact holes, and a second interface, which lies opposite the first interface, with second contact holes. The substrate includes a substrate body and electrically conductive contact channels formed therein, wherein each of the contact channels electrically conductively connects a first contact hole to a second contact hole. The carrier also includes a front-side wiring layer arranged on the first interface and; has a first front-side metallization layer formed therein such that it includes a first capacitor electrode for electrically connecting microelectronic devices and/or circuits to a first pole of a signal or supply voltage. The first capacitor electrode, at least partly via a capacitor dielectric formed in the carrier, couples capacitively to electrically conductive regions of a second front-side metallization layer and/or the substrate which at least partly form a second capacitor electrode for electrically connecting the microelectronic devices and/or circuits to a second pole of the signal or supply voltage.

摘要翻译： 载体包括：具有与第一接触孔的第一界面的基底和与第一界面相对的第二界面与第二接触孔。 基板包括基板主体和形成在其中的导电接触通道，其中每个接触通道将第一接触孔电连接到第二接触孔。 载体还包括布置在第一界面上的前侧布线层， 具有形成在其中的第一前侧金属化层，使得其包括用于将微电子器件和/或电路电连接到信号或电源电压的第一极的第一电容器电极。 至少部分地经由形成在载体中的电容器电介质的第一电容器电极电容耦合到第二前侧金属化层和/或衬底的导电区域，该区域至少部分地形成第二电容器电极，用于电连接微电子 设备和/或电路连接到信号或电源电压的第二极点。

公开(公告)号：US20070210417A1

公开(公告)日：2007-09-13

申请号：US11618172

申请日：2006-12-29

申请人： Florian Binder ,  Thomas Haneder ,  Judith Lehmann ,  Manfred Schneegans ,  Grit Sommer

发明人： Florian Binder ,  Thomas Haneder ,  Judith Lehmann ,  Manfred Schneegans ,  Grit Sommer

IPC分类号： H01L29/00

CPC分类号： H01L23/49827 ,  H01L23/50 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2224/05026 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/162 ,  H05K3/4602 ,  H01L2224/05599

摘要： Carrier including a substrate having a first interface with first contact holes, and a second interface, which lies opposite the first interface, with second contact holes. The substrate includes a substrate body and electrically conductive contact channels formed therein, wherein each of the contact channels electrically conductively connects a first contact hole to a second contact hole. The carrier also includes a front-side wiring layer arranged on the first interface and has a first front-side metallization layer formed therein such that it includes a first capacitor electrode for electrically connecting microelectronic devices and/or circuits to a first pole of a signal or supply voltage. The first capacitor electrode, at least partly via a capacitor dielectric formed in the carrier, couples capacitively to electrically conductive regions of a second front-side metallization layer and/or the substrate which at least partly form a second capacitor electrode for electrically connecting the microelectronic devices and/or circuits to a second pole of the signal or supply voltage.

摘要翻译： 载体包括具有与第一接触孔的第一界面的基底和与第一界面相对的第二界面与第二接触孔。 基板包括基板主体和形成在其中的导电接触通道，其中每个接触通道将第一接触孔电连接到第二接触孔。 载体还包括布置在第一界面上并具有形成在其中的第一前侧金属化层的前侧布线层，使得其包括用于将微电子器件和/或电路电连接到信号的第一极的第一电容器电极 或电源电压。 至少部分地经由形成在载体中的电容器电介质的第一电容器电极电容耦合到第二前侧金属化层和/或衬底的导电区域，该区域至少部分地形成第二电容器电极，用于电连接微电子 设备和/或电路连接到信号或电源电压的第二极点。