公开(公告)号：US5367435A

公开(公告)日：1994-11-22

申请号：US153734

申请日：1993-11-16

申请人： Frank E. Andros ,  Christopher G. Angulas ,  Joseph M. Milewski

发明人： Frank E. Andros ,  Christopher G. Angulas ,  Joseph M. Milewski

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K1/18 ,  H05K3/36 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L23/49827 ,  H01L23/4985 ,  H05K3/363 ,  H01L2224/16 ,  H01L2924/15311 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2203/041

摘要： An electronic package and method of making same wherein a flexible circuitized substrate is used to interconnect contact sites on a semiconductor device (chip) to respective conductors on a circuitized substrate (PCB). Significantly, the flexible substrate is coupled to the PCB using solder elements which are applied to the flexible substrate prior to semiconductor device coupling to others of the flexible substrates' conductive elements. These other conductive elements are then connected to the devices' contact sites using thermocompression bonding, the bonding occurring through an aperture in the flexible substrate.

摘要翻译： 一种电子封装及其制造方法，其中使用柔性电路化的衬底将半导体器件（芯片）上的接触部位与电路化衬底（PCB）上的相应导体互连。 重要的是，柔性基板使用在半导体器件耦合到柔性基板的导电元件的其它部件之前施加到柔性基板上的焊接元件耦合到PCB。 然后使用热压接将这些其它导电元件连接到器件的接触位置，通过柔性衬底中的孔发生接合。

公开(公告)号：US4291364A

公开(公告)日：1981-09-22

申请号：US106966

申请日：1979-12-26

申请人： Frank E. Andros ,  Ghazaros K. Kerjilian ,  Bert E. Stevens ,  Reinhold E. Tomek

发明人： Frank E. Andros ,  Ghazaros K. Kerjilian ,  Bert E. Stevens ,  Reinhold E. Tomek

IPC分类号： H05K7/20

CPC分类号： H05K7/20154

摘要： Metallized ceramic modules (MC), which are mounted on printed circuit cards, and multi-layer ceramic modules (MLC), which are mounted on a printed circuit planar board, are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the multi-layer ceramic modules after which it is directed to flow serially across the metallized ceramic modules.

摘要翻译： 安装在印刷电路卡上的金属化陶瓷模块（MC）和安装在印刷电路平面板上的多层陶瓷模块（MLC）组合成一个混合封装。 提供一种空气冷却分配系统，其中首先引起空气撞击多层陶瓷模块，然后将其引导流过金属化陶瓷模块。

公开(公告)号：US5561323A

公开(公告)日：1996-10-01

申请号：US507719

申请日：1995-07-26

申请人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

发明人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

IPC分类号： H01L23/12 ,  H01L21/607 ,  H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L24/85 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10T29/49144

摘要： An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

摘要翻译： 一种电子封装，其包括刚性支撑构件（例如铜片），其与封装的半导体芯片和电路化的衬底构件接合。 使用导热粘合剂将芯片粘合，同时使用电绝缘粘合剂粘合电路化基底，优选柔性电路。 芯片优选通过线，热压或热超声键合电耦合到衬底的电路的指定部分。 密封剂可以用于覆盖和保护芯片和衬底之间的连接。 该封装件又可电耦合到单独的第二基板，例如PCB。

公开(公告)号：US4212349A

公开(公告)日：1980-07-15

申请号：US48

申请日：1979-01-02

申请人： Frank E. Andros ,  Robert J. E. Shay

发明人： Frank E. Andros ,  Robert J. E. Shay

IPC分类号： F28D15/02 ,  F28D15/06 ,  H01L23/427 ,  H01L23/433 ,  F28D15/00

CPC分类号： H01L23/427 ,  F28D15/02 ,  H01L23/433 ,  H01L2224/16

摘要： A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro bellows containment vessel is filled with liquid to form a coolant vapor phase bubble which is centered within the vessel due to the surface energy characteristics of the fluid. Heat input at the evaporator section results in evaporation of the liquid at the liquid-vapor interface. The vapor flows across the bubble and condenses on the opposite side where heat is rejected and liquid is replenished to the evaporator section by flow through the continuous liquid film.

摘要翻译： 提供了一种闭合的两相液体 - 蒸气传热装置，其独立于取向并且不需要灯芯。 微波箱容纳容器充满液体以形成由于流体的表面能特性而在容器内居中的冷却剂气相气泡。 在蒸发器部分的热量输入导致液体在液 - 气界面处的蒸发。 蒸汽流过气泡，并在相反的一侧冷凝，热量被排除，液体通过流过连续液膜的蒸发器部分补充。

公开(公告)号：US06219238B1

公开(公告)日：2001-04-17

申请号：US09307890

申请日：1999-05-10

申请人： Frank E. Andros ,  Michael A. Gaynes ,  Hussain Shaukatullah ,  Wayne R. Storr

发明人： Frank E. Andros ,  Michael A. Gaynes ,  Hussain Shaukatullah ,  Wayne R. Storr

IPC分类号： H05K720

CPC分类号： H01L23/4093 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/15311 ,  Y10T24/45581 ,  H01L2924/00014

摘要： A structure for removably attaching a heat sink to an electronic package. At least one heat sink engaging member engages a surface of the heat sink opposite a surface of the heat sink engaging the electronic package. At least two heat sink retaining clips extend from opposite sides of the at least one heat sink engaging member. Each retaining clip includes a first arm for extending past a side of the heat sink and a portion of the electronic package and a second arm extending from the first member for engaging the electronic package.

摘要翻译： 一种用于将散热器可拆卸地附接到电子封装的结构。 至少一个散热器接合构件与散热器的与电子封装件接合的表面相对的表面接合。 至少两个散热器保持夹从至少一个散热器接合构件的相对侧延伸。 每个固定夹包括一个第一臂，用于延伸穿过散热片的一侧和电子封装的一部分;以及第二臂，从该第一构件延伸以接合该电子封装。

公开(公告)号：US5633533A

公开(公告)日：1997-05-27

申请号：US671426

申请日：1996-06-27

申请人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

发明人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

IPC分类号： H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L23/49572 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181

摘要： An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

摘要翻译： 一种电子封装，其包括刚性支撑构件（例如铜片），其与封装的半导体芯片和电路化的衬底构件接合。 使用导热粘合剂将芯片粘合，同时使用电绝缘粘合剂粘合电路化基底，优选柔性电路。 芯片优选通过线，热压或热超声键合电耦合到衬底的电路的指定部分。 密封剂可以用于覆盖和保护芯片和衬底之间的连接。 该封装件又可电耦合到单独的第二基板，例如PCB。

公开(公告)号：US5519936A

公开(公告)日：1996-05-28

申请号：US382330

申请日：1995-02-01

申请人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

发明人： Frank E. Andros ,  James R. Bupp ,  Michael DiPietro ,  Richard B. Hammer

IPC分类号： H01L23/12 ,  H01L21/607 ,  H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/85 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10T29/49144

摘要： An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

摘要翻译： 一种电子封装，其包括刚性支撑构件（例如铜片），其与封装的半导体芯片和电路化的衬底构件接合。 使用导热粘合剂将芯片粘合，同时使用电绝缘粘合剂粘合电路化基底，优选柔性电路。 芯片优选通过线，热压或热超声键合电耦合到衬底的电路的指定部分。 密封剂可以用于覆盖和保护芯片和衬底之间的连接。 该封装件又可电耦合到单独的第二基板，例如PCB。

公开(公告)号：US4313492A

公开(公告)日：1982-02-02

申请号：US105677

申请日：1979-12-20

申请人： Frank E. Andros ,  Robert J. E. Shay

发明人： Frank E. Andros ,  Robert J. E. Shay

IPC分类号： F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  F28D15/00

CPC分类号： F28D15/04 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73253

摘要： A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro helix containment vessel contains liquid to form a coolant vapor phase. Heat input at the evaporator section results in evaporation of the liquid at the liquid-vapor interface. The vapor flows through the bellow and condenses on the opposite end where heat is rejected and liquid is replenished to the evaporator section by flow through capillary passages of helical form in the corrugations of the bellows.

摘要翻译： 提供了一种闭合的两相液体 - 蒸气传热装置，其独立于取向并且不需要灯芯。 微螺旋封存容器含有液体以形成冷却剂气相。 在蒸发器部分的热量输入导致液体在液 - 气界面处的蒸发。 蒸汽流过波纹管并在相反的端部冷凝，在热量被排除的同时，液体通过在波纹管的波纹中流过螺旋形式的毛细通道而被补充到蒸发器部分。