公开(公告)号：US4554237A

公开(公告)日：1985-11-19

申请号：US452198

申请日：1982-12-22

申请人： Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Daisuke Makino ,  Shigeru Koibuchi ,  Asao Isobe

发明人： Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Daisuke Makino ,  Shigeru Koibuchi ,  Asao Isobe

IPC分类号： G03C1/72 ,  G03F7/008 ,  G03C1/52 ,  G03C1/60 ,  G03C5/16

CPC分类号： G03F7/008 ,  Y10S430/128

摘要： Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition.Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].

摘要翻译： 公开了用于在半导体器件上形成精细图案的光敏树脂组合物，具有高度敏感性和显影性优异的并且没有问题，例如显影后的叠氮化合物和剩余的叠氮化物颗粒的沉淀，以及方法 用于用所述组合物形成精细图案。 所述光敏树脂组合物包含（a）至少一种选自酚醛清漆树脂和聚羟基苯乙烯树脂的聚合物化合物和（b）由通式（1）表示的叠氮化合物：其中 X是-N3或-SO2N3，Y是低级亚烷基，例如-CH2CH2-，-CH2CH2CH2-或-CH2CH2OCH2CH2CH2-，羟基亚烷基或氨基亚烷基，例如

公开(公告)号：US4513132A

公开(公告)日：1985-04-23

申请号：US480789

申请日：1983-03-31

申请人： Fusaji Shoji ,  Issei Takemoto ,  Fumio Kataoka ,  Hitoshi Yokono ,  Tokio Isogai

发明人： Fusaji Shoji ,  Issei Takemoto ,  Fumio Kataoka ,  Hitoshi Yokono ,  Tokio Isogai

IPC分类号： C08G77/00 ,  C08G77/42 ,  C08G77/44 ,  C08G77/52 ,  C08G77/06

CPC分类号： C08G77/52 ,  C08G77/44

摘要： Heat-resistant silicone block polymer with a good flexibility obtained by reaction of an organosilsesquioxane with a silicone compound or organosiloxane in the presence of a basic catalyst in an organic solvent.

摘要翻译： 通过有机倍半硅氧烷与有机硅化合物或有机硅氧烷在碱性催化剂存在下在有机溶剂中反应而获得的具有良好柔软性的耐热硅氧烷嵌段聚合物。

公开(公告)号：US5753372A

公开(公告)日：1998-05-19

申请号：US500157

申请日：1995-07-10

申请人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

发明人： Hideo Sotokawa ,  Miharu Otani ,  Fumio Kataoka ,  Fusaji Shoji ,  Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shogi Ikeda ,  Hidetaka Shigi ,  Tetsuya Yamazaki ,  Naoki Matsushima ,  Shirou Akamatsu

IPC分类号： H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/532 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  B32B9/04

CPC分类号： H01L21/76801 ,  H01L21/312 ,  H01L21/32056 ,  H01L21/76838 ,  H01L23/5329 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K3/4647 ,  H05K3/4676 ,  Y10T428/24802 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31721

摘要： The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).

摘要翻译： 本发明提供具有布线层和绝缘层的布线结构及其制造方法，其中所述布线层的布线的至少一部分包括铜，并且所述绝缘层包括通过加热聚酰亚胺前体获得的聚酰亚胺 含有具有可以由以下通式表示的重复单元的聚酰亚胺前体的组合物（化学式15）。 （化学式15）（化学式16） 选自化学式16中的四价有机基团的类型，而R2是含有芳香环的二价有机基团）。

公开(公告)号：US5388328A

公开(公告)日：1995-02-14

申请号：US187546

申请日：1994-01-28

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby forming a conductor layer, forming another windowed resist layer on the conductor layer and filling windows of this resist layer with a conductor by plating, thereby forming a via-hole layer and to provide a two-level structure of the conductor layer and the via-hole layer. Thereafter, the resist layers and portions of the metallic under-conductor layer other than those in contact with a lower face of the conductor constituting the conductor layer are dissolved to form a two-level skeleton structure of conductor lines and spaces within the skeleton structure are filled with a varnish in a solventless form and the varnish is cured.

摘要翻译： 制造相互连接的多层板的方法包括以下步骤：在基底基板上形成金属导电层，在金属下导电层上形成窗口化抗蚀剂层，用导体用电镀填充抗蚀剂层的窗口 从而形成导体层，在导体层上形成另一个窗口化的抗蚀剂层，并通过电镀用导体填充该抗蚀剂层的窗口，从而形成通孔层，并提供导体层和通孔的两层结构 井层。 此后，除了与形成导体层的导体的下表面接触的金属下导体层的抗蚀剂层和部分被溶解以形成骨架结构内的导体线和空间的两级骨架结构 填充无溶剂形式的清漆，并且清漆被固化。

公开(公告)号：US5851681A

公开(公告)日：1998-12-22

申请号：US212766

申请日：1994-03-15

申请人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

发明人： Haruhiko Matsuyama ,  Eiji Matsuzaki ,  Shozi Ikeda ,  Fumio Kataoka ,  Fusaji Shoji

IPC分类号： C08G73/10 ,  G11B5/17 ,  G11B5/31 ,  H01L23/498 ,  H05K1/00 ,  G11B5/40 ,  C08G69/26

CPC分类号： H01L23/49894 ,  C08G73/10 ,  G11B5/313 ,  H05K3/4676 ,  G11B5/17 ,  G11B5/3109 ,  H01L2924/0002 ,  H05K2201/0154 ,  Y10T428/1193 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

摘要： This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.

摘要翻译： 本发明涉及具有金属布线层和聚酰亚胺层的布线结构。 本发明的目的是通过防止诸如铜的布线层的金属和羧基之间的反应来克服金属表面的氧化引起的问题，例如布线电阻的增加和绝缘的减少 组成聚酰亚胺层的聚酰胺酸组。 在根据本发明的布线结构中，通过加热和固化包含聚酰亚胺前体，胺化合物和有机溶剂的树脂组合物，形成聚酰亚胺层。

公开(公告)号：US4727185A

公开(公告)日：1988-02-23

申请号：US820629

申请日：1986-01-21

申请人： Fusaji Shoji ,  Fumio Kataoka

发明人： Fusaji Shoji ,  Fumio Kataoka

IPC分类号： C07C63/331 ,  B01J31/00 ,  C07B61/00 ,  C07C51/00 ,  C07C51/347 ,  C07C67/00

CPC分类号： C07C51/347

摘要： When a 4-halogenoorthophthalic acid salt is dissolved together with a base in an alkaline aqueous solution and the solution is heated in the presence of a catalyst comprising a noble metal supported on a carrier, a formic acid salt and a small amount of an aliphatic compound containing a hydroxyl group, a 3,3',4,4'-biphenyltetracarboxylic acid salt is obtained in a high yield.

摘要翻译： 当将4-卤代邻苯二甲酸盐与碱溶解在碱性水溶液中时，在负载在载体上的贵金属的催化剂，甲酸盐和少量的脂肪族化合物 含有羟基，高收率地得到3,3'，4,4'-联苯四羧酸盐。

公开(公告)号：US4565767A

公开(公告)日：1986-01-21

申请号：US603451

申请日：1984-04-24

申请人： Fumio Kataoka ,  Fusaji Shoji ,  Isao Obara ,  Issei Takemoto ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitsumasa Kojima

发明人： Fumio Kataoka ,  Fusaji Shoji ,  Isao Obara ,  Issei Takemoto ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitsumasa Kojima

IPC分类号： C08F290/00 ,  C08F299/00 ,  C08G73/00 ,  C08G73/02 ,  C08G73/10 ,  C08L79/08 ,  G03F7/012 ,  G03F7/038 ,  G03F7/26 ,  H01L21/312 ,  H01L21/47 ,  G03C1/71

CPC分类号： C08L79/08 ,  G03F7/0125 ,  Y10S430/12 ,  Y10S430/128

摘要： A light-sensitive polymer composition comprising a poly(amic acid), a special bisazide compound and an amine compound can give a film which has high sensitivity and in which portions exposed to light are not easily released by a developing solution at the time of development.

摘要翻译： 包含聚（酰胺酸），特殊双叠氮化合物和胺化合物的光敏聚合物组合物可以产生具有高灵敏度的膜，并且其中暴露于光的部分在显影时不容易被显影溶液释放 。

公开(公告)号：US4451551A

公开(公告)日：1984-05-29

申请号：US331875

申请日：1981-12-17

申请人： Fumio Kataoka ,  Fusaji Shoji ,  Isao Obara ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitumasa Kojima

发明人： Fumio Kataoka ,  Fusaji Shoji ,  Isao Obara ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitumasa Kojima

IPC分类号： C08K5/00 ,  C08L79/08 ,  G03F7/008 ,  G03F7/038 ,  G03C1/68

CPC分类号： G03F7/0387 ,  C08K5/0041 ,  C08L79/08 ,  G03F7/008 ,  Y10S430/12 ,  Y10S430/121 ,  Y10S522/904

摘要： A light- or radiation-sensitive polymer composition comprising (a) a poly(amic acid) having as a major component a repeating unit of the formula: ##STR1## (b) one or more light- or radiation-sensitive compounds having an amino group and an aromatic azide group or aromatic sulfonylazide group in one molecule, and if necessary (c) one or more photosensitizers and/or amine compounds having at least one unsaturated bonding, and/or (d) one or more compounds having at least two unsaturated bonding in one molecule, is highly sensitive to light and radiation and can give a precise relief pattern on a substrate. Further, a finally obtained polyimide film is excellent in heat resistance.

摘要翻译： 一种光或辐射敏感性聚合物组合物，其包含（a）作为主要组分的具有下式的重复单元的聚（酰胺酸）：（b）一种或多种具有氨基的光或辐射敏感性化合物 （c）一种或多种具有至少一个不饱和键的光敏剂和/或胺化合物，和/或（d）一种或多种具有至少两个不饱和键的化合物， 在一个分子中的不饱和键，对光和辐射具有高度敏感性，并且可以在基底上给出精确的浮雕图案。 此外，最终得到的聚酰亚胺膜的耐热性优异。

公开(公告)号：US5536584A

公开(公告)日：1996-07-16

申请号：US11493

申请日：1993-01-29

申请人： Hideo Sotokawa ,  Fusaji Shoji ,  Fumio Kataoka

发明人： Hideo Sotokawa ,  Fusaji Shoji ,  Fumio Kataoka

IPC分类号： B32B15/08 ,  B32B27/34 ,  C08G73/10 ,  H01L23/532

CPC分类号： C08G73/1042 ,  B32B15/08 ,  B32B27/34 ,  H01L23/5329 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/92147 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10S428/901 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A metalization structure uses a surface protective film formed of a polyimide that is produced by heating and dehydrating polyimide precursor has its molecular chain composed of recurring units represented by the following general formula (1) and recurring units represented by the following general formula (2): ##STR1## (where R.sup.1 is at least one tetravalent organic group selected from among ##STR2## R.sup.2 is at least one divalent organic group of a linear structure as selected from among ##STR3## and R.sup.3 is a divalent organic group of a crooked structure that has at least two aromatic rings).

摘要翻译： 金属化结构使用由聚酰亚胺前体制造的聚酰亚胺形成的表面保护膜，其具有由以下通式（1）表示的重复单元和下述通式（2）表示的重复单元构成的分子链， （1）（2）（其中R1是从 R2中选择的至少一种四价有机基团，其为选自以下的线性结构的至少一种二价有机基团： 在＆lt; IMAGE＆gt; GE＆gt;中，R 3是具有至少两个芳环的弯曲结构的二价有机基团）。

公开(公告)号：US5300735A

公开(公告)日：1994-04-05

申请号：US37543

申请日：1993-03-22

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.

摘要翻译： 这里描述了互连的多层板及其制造工艺。 骨架结构的多层导体线通过导电多层金属化而形成，同时包括所有的抗蚀剂层和金属的低导电层，然后立即去除抗蚀剂层和金属的不良导电层。 然后用无溶剂清漆填充骨架结构的多层导体线之间的空隙，从而形成绝缘层。 还描述了使用这种互连的多层板的模块和具有这种模块的计算机。